Data Sheet

Analog Integrated Circuit Device Data
Freescale Semiconductor 23
33926
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Figure 16. Thermal Test Board
Device on Thermal Test Board Table 8. Thermal Resistance Performance
R

JA
is the thermal resistance between die junction and ambient air.
33926PNB Pin Connections
32-Pin PQFN
0.80 mm Pitch
8.0 mm x 8.0 mm Body
A
25
17
18
19
20
21
22
23
24
910111213141516
1
2
3
4
5
6
7
8
26272829303132
NC
NC
VPWR
NC
IN2
IN1
SLEW
OUT1
AGND
INV
FB
EN
OUT1
VPWR
VPWR
OUT2 OUT2
AGND
OUT1
D2
PGND
SF
D1 OUT2 OUT2 CCP VPWR
PGND
PGND
PGND
PGND
PGND
OUT1
Material: Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Outline: 80 mm x 100 mm board area,
including edge connector for thermal
testing
Area A: Cu heat-spreading areas on board
surface
Ambient Conditions: Natural convection, still air
A [mm
2
] R

JA
[C/W]
0 81
300 49
600 40