Datasheet

6.ELECTRONICAL PERFORMANCE 电气性能
8.1
SLLDERING
TEST
可焊性试验
The tip of the terminals shall be
dipped 2mm in the solder bath at a
Temperature of 230±5℃ for 3sec.
端子顶部被浸入焊锡池 2mm 深 , 温度
260±5℃时间 3 秒.
A new uniform coating of solder
Shall cover a minimum of 75% of
the surface being immersed.
浸入的部分 75%以上表面将被锡
覆盖。
8.2
RESISTANCE
TO
SOLDERING
HEAT TEST
耐焊性试验
Solder bath method
Solder temperature 260±5℃
Immersion time 3±0.5scc
Immersion depth up to the surface of
the board
Thickness of PCB 1.6 mm.
焊炉焊的温度控制在 230±5℃，过炉焊接的
时间 3±0.5 秒，于(基板)厚度为 1.6 mm.
Solder bath method
Bit temperature 350±10℃
application time 3±0.5scc
however excessive pressure shall not be
applied to the terminal.
手焊接的时候温度需控制在 350±10℃，时
间为
3±0.5 秒，但不能在排脚上施加异常压力。
Without deformation of case
Or excessive looseness of
mechanically electrical
characteristics
Shall be satisfied.
本体无变形，能满足于机械、电
器性能。
8.3
LIFI TEST
寿命试验
10000cycles of operation at a rate
of 15-18 cycles per minute with unloading.
无负载条件下,每分钟 15-18 次的速度操作
10000 次.
(1) Contact resistance
接触阻抗.
150mΩ max.150 毫欧以下.
(2) Operating force
动作力.
±30%Inltial value.
变化范围初始值 30%.
(3)ITEN 项目—6.2
(4)ITEN 项目—6.3
(5)ITEN 项目—7.2
(6)ITEN 项目—7.3
8.4
HEAT TEST
耐热试验
80±2℃ for 96 hours , caner test keep
in normal condition for 30minutes.
在 80±2℃环境中放 96 小时,再放在正常环
境中
30 分钟后进行测试.
8.5
HUMIDITY
TEST
耐湿试验
40±2℃ 90-95%RH for 96firs after test
keep in mortal condition for 30 min.
在 40±2℃ 90-95%RH 环境中放 96 小时,再
放在正常环境中,30 分钟后进行测试.
(1)Contact resistance 150mΩ max.
接触电阻 150 毫欧以下.
(2)Insulation resistance
绝缘电阻.
50MΩmin 50 兆欧以上.
(3)There shall be no sign of
damage mechanically and
electrically.
无任何迹象显示机械及电器性能
之损坏.