Datasheet

Page 6 of 7 QR-QE-20/2003.08.01
Solder dip:浸焊
Preheating condition: Surface temperature
of the substrate shall be settled within 100℃
in one min.
預熱: 基板表面溫度 100℃以下，1 分鐘
內。
Solder temperature 260±5℃for 5 sec.
焊錫溫度 260±5℃，5 秒。
7
Resistance to
soldering heat
焊錫耐熱性
Variation of total resistance shall
be within ± 5%, and terminals
shall not work loose to injure
electric contact, after test.
全阻值變化±5%以內,測試後無端
子鬆動,不會損壞電氣接點。
Manual Soldering: Less than 300℃ and
quicker than 3 seconds.
手銲: 300℃以下，3 秒以內
8
Number of
cycles
耐久次數值
Total resistance ≦ Initial value ± 20%.
No mechanical malfunction.
全阻值變化≦初始值±20% .
機械方面能動作.
1,000,000 Cycles min
四、SWITCH CHARACTERISTICS (FOR WITH-SWITCH TYPE)
開關規格(適用於帶開關機種)
序號
NO.
項 目
ITEM
性 能
PERFORMANCE
測試條件
TEST CONDITIONS
1
Operating
force
作動力
/
/
Apply side force perpendicular to the lever’s
axial direction on the lever until the lever
stops, measure the max force value.
將一個軸向力施加於搖杆上直到其不動
為止,量取施力期間之最大值.
2
Travel
移動量
/
Put the switch lever upward, apply 2 times
of the static operating force over the lever’s
axial direction of the lever, measure the
variance of the switch stroke.
將開關操作部(搖杆)置於靜止位置,並在操
作柄中央施加兩倍於作動力之靜負荷測
量柄被壓到不動時之移動距離.
3
Push
strength
按壓強度
/
Put the switch lever upward; apply 3kgf of
the static load over the vertical direction of
the lever for 60 seconds.
將開關之操作部(搖杆)置於垂直方向,並沿
操作方向加 3kgf 之靜負荷 60 秒.
4
Circuit
diagram
電路圖
/