Specifications
Table Of Contents
- iXon Ultra
- SAFETY AND WARNINGS INFORMATION
- SAFETY AND WARNINGS SYMBOLS
- MANUAL HANDLING
- SHIPPING AND STORAGE PRECAUTIONS
- SECTION 1 - INTRODUCTION TO IXON ULTRA HARDWARE
- 1.1 - TECHNICAL SUPPORT
- 1.2 - DISCLAIMER
- 1.3 - TRADEMARKS AND PATENT INFORMATION
- 1.4 - COMPONENTS
- 1.4.1 - Camera description
- 1.4.2 - Camera Power Supply Unit
- 1.4.3 - SOFTWARE
- 1.5 - SPECIFICATIONS
- 1.6 - ACCESSORIES
- 1.7 - SAFETY PRECAUTIONS AND MAINTENANCE
- 1.7.1 - Care of the camera
- 1.7.2 - Regular checks
- 1.7.3 - Annual electrical safety checks
- 1.7.4 - Replacement parts
- 1.7.5 - Fuse replacement
- 1.7.6 - Working with electronics
- 1.7.7 - Condensation
- 1.7.8 - Dew Point graph
- 1.7.9 - EM Gain ageing
- 1.7.10 - Minimizing particulate contamination
- 2.1 - INSTALLING THE HARDWARE
- 2.1.1- PC requirements
- 2.2 - INSTALLING ANDOR SOLIS SOFTWARE - WINDOWS O/S(XP/VISTA/SEVEN)
- 2.3 - NEW HARDWARE WIZARD
- 2.5 - WATER PIPE CONNECTORS
- 2.6 - MOUNTING POSTS
- 2.7 - COOLING
- 2.8 - START-UP DIALOG
- 3.1 - EMCCD OPERATION
- 3.1.1 - Structure of an EMCCD
- 3.1.2 - EM Gain & Read Noise
- 3.1.3 - EM Gain ON vs EM Gain OFF
- 3.1.4 - Multiplicative Noise Factor and Photon Counting
- 3.1.5 - EM Gain dependence and stability
- 3.1.6 - RealGain: Real and Linear gain
- 3.1.7 - EM Gain Ageing: What causes it and how is it countered?
- 3.1.8 - Gain and signal restrictions
- 3.1.9 - EMCAL
- 3.2 - COOLING
- 3.2.1 - Cooling options
- 3.2.2 - Heat generated in the EMCCD
- 3.2.3 Heatsink “hot side“ temperature
- 3.2.4 - Fan settings
- 3.3 - SENSOR READOUT OPTIMIZATION
- 3.3.1 - Sensor Pre-amp options
- 3.3.2 - Variable Horizontal Readout Rate
- 3.3.3 - Variable Vertical Shift Speed
- 3.3.4 - Output amplifier selection
- 3.3.5 - Baseline Optimization
- 3.3.5.1 - Baseline Clamp
- 3.3.6 - Binning and Sub Image options
- 3.4 - ACQUISITION OPTIONS
- 3.4.1 - Capture Sequence in Frame Transfer (FT) Mode
- 3.4.1.1 - Points to consider when using FT Mode
- 3.4.2 - Capture Sequence in Non-Frame Transfer Mode (NFT) with an FT EMCCD
- 3.4.2.1 - Points to note about using an FT EMCCD as a standard EMCCD
- 3.4.3 - Capture Sequence for Fast Kinetics (FK) with an FT EMCCD
- 3.4.3.1 - Points to consider when using Fast Kinetics mode
- 3.4.4 - Keep Clean Cycles
- 3.5 - TRIGGERING OPTIONS
- 3.5.1 - Triggering options in Frame Transfer (FT) mode
- 3.5.1.1 - Internal Triggering (FT)
- 3.5.1.2 - External Triggering (FT)
- 3.5.1.3 - External Exposure (FT)
- 3.5.2 - Triggering options in Non-Frame Transfer (NFT) mode
- 3.5.2.1 - Internal (NFT)
- 3.5.2.2 - External & Fast External (NFT)
- 3.5.2.3 - External Exposure (NFT)
- 3.5.2.4 - Software trigger (NFT)
- 3.5.3 - Trigger options in Fast Kinetics (FK) mode
- 3.5.3.1 - Internal (FK)
- 3.5.3.2 - External (FK)
- 3.5.3.3 - External Start (FK)
- 3.6 - SHUTTERING
- 3.7 - COUNT CONVERT
- 3.8 - OPTACQUIRE
- 3.8.1 - OptAcquire modes
- 3.9 - PUSHING FRAME RATES WITH CROPPED SENSOR MODE
- 3.9.1 - Cropped Sensor Mode Frame Rates
- 3.10 - ADVANCED PHOTON COUNTING IN EMCCDs
- 3.10.1 - Photon Counting by Post-Process
- 3.11 - SPURIOUS NOISE FILTER
- 4.1 - EMCCD TECHNOLOGY
- 4.1.1 - What is an Electron Multiplying CCD?
- 4.1.2 - Does EMCCD technology eliminate Read Out Noise?
- 4.1.3 - How sensitive are EMCCDs?
- 4.1.4 - What applications are EMCCDs suitable for?
- 4.1.5 - What is Andor Technology's experience with EMCCDs?
- 4.2 - EMCCD SENSOR
- 4.3 - VACUUM HOUSING
- 4.3.1 - Thermoelectric cooler
- 4.4 – USB 2.0 INTERFACE
- 4.5 - OUTGASSING
- 4.6 - EXTERNAL I/O
- 4.7 - SIGNAL DIAGRAMS
- 4.8 - CAMERALINK
- SECTION 5: TROUBLESHOOTING
- 5.1 - UNIT DOES NOT SWITCH ON
- 5.2 - SUPPORT DEVICE NOT RECOGNISED WHEN PLUGGED INTO PC
- 5.3 - TEMPERATURE TRIP ALARM SOUNDS (CONTINUOUS TONE)
- 5.4 - CAMERA HIGH FIFO FILL ALARM
- 5.5 - USE OF MULTIPLE HIGH SPEED USB 2.0 I/O ON ONE CAMERA
- A.1 - GLOSSARY
- A.1.1 - Readout sequence of an EMCCD
- A.1.2 - Accumulation
- A.1.3 - Acquisition
- A.1.4 - A/D Conversion
- A.1.5 - Background
- A.1.6 - Binning
- A.1.7 - Counts
- A.1.8 - Dark Signal
- A.1.9 - Detection Limit
- A.1.10 - Exposure Time
- A.1.11 - Frame Transfer
- A.1.12 - NOISE
- A.1.12.1 - Pixel Noise
- A.1.12.1.1 - Readout Noise
- A.1.12.1.2 - Shot Noise
- A.1.12.1.2.A - Shot Noise from the Signal
- A.1.12.1.2.B - Shot Noise from the Dark Signal
- A.1.12.1.3 - Calculation of Total Pixel Noise
- A.1.12.2 - Fixed Pattern Noise
- A.1.13 - Quantum Efficiency/Spectral Response
- A.1.14 - Readout
- A.1.15 - Saturation
- A.1.16 - Scans (Keep Clean and Acquired)
- A.1.17 - Shift Register
- A.1.18 - Signal To Noise Ratio
- B - MECHANICAL DIMENSIONS
- C - DECLARATION OF CONFORMITY
- D - HARDWARE AND SOFTWARE WARRANTY SERVICE
- D.1 - SERVICE DESCRIPTION
- D.2 - Access to Service
- D.3 - Hardware Remediation
- D.4 - Software Remediation
- E - THE WASTE ELECTRONIC AND ELECTRICAL EQUIPMENT REGULATIONS 2006 (WEEE)
Version 1.1 rev Jan 2013
Page 91
iXon Ultra
Hardware
4.3.1 - Thermoelectric cooler
The iXon Ultra range makes use of a four-stage Peltier cooling assembly, which utilizes the thermoelectric effect to
rapidly cool the sensor down to the stable operating temperature. TE coolers have a cold end (in contact with the
sensor) and a hot end. Heat must be efciently dissipated from the TE cooler for effective cooling of the sensor.
The iXon Ultra is designed to yield maximum heat dissipation, via either forced air cooling (in-built fan) or water cooling
which, in combination with Andor’s UltraVac
TM
vacuum process, results in market-leading cooling performance. A
recirculator or a chiller can be purchased from Andor Technology to provide convenient and effective heat dissipation
through water cooling.
The iXon Ultra camera also contains temperature control components, which regulate the cooling of the camera and
ensure that a stable temperature is maintained between and throughout measurements.
Figure 39: Ultravac
TM
metal hermetic vacuum sealing