Specifications
Table Of Contents
- iXon Ultra
- SAFETY AND WARNINGS INFORMATION
- SAFETY AND WARNINGS SYMBOLS
- MANUAL HANDLING
- SHIPPING AND STORAGE PRECAUTIONS
- SECTION 1 - INTRODUCTION TO IXON ULTRA HARDWARE
- 1.1 - TECHNICAL SUPPORT
- 1.2 - DISCLAIMER
- 1.3 - TRADEMARKS AND PATENT INFORMATION
- 1.4 - COMPONENTS
- 1.4.1 - Camera description
- 1.4.2 - Camera Power Supply Unit
- 1.4.3 - SOFTWARE
- 1.5 - SPECIFICATIONS
- 1.6 - ACCESSORIES
- 1.7 - SAFETY PRECAUTIONS AND MAINTENANCE
- 1.7.1 - Care of the camera
- 1.7.2 - Regular checks
- 1.7.3 - Annual electrical safety checks
- 1.7.4 - Replacement parts
- 1.7.5 - Fuse replacement
- 1.7.6 - Working with electronics
- 1.7.7 - Condensation
- 1.7.8 - Dew Point graph
- 1.7.9 - EM Gain ageing
- 1.7.10 - Minimizing particulate contamination
- 2.1 - INSTALLING THE HARDWARE
- 2.1.1- PC requirements
- 2.2 - INSTALLING ANDOR SOLIS SOFTWARE - WINDOWS O/S(XP/VISTA/SEVEN)
- 2.3 - NEW HARDWARE WIZARD
- 2.5 - WATER PIPE CONNECTORS
- 2.6 - MOUNTING POSTS
- 2.7 - COOLING
- 2.8 - START-UP DIALOG
- 3.1 - EMCCD OPERATION
- 3.1.1 - Structure of an EMCCD
- 3.1.2 - EM Gain & Read Noise
- 3.1.3 - EM Gain ON vs EM Gain OFF
- 3.1.4 - Multiplicative Noise Factor and Photon Counting
- 3.1.5 - EM Gain dependence and stability
- 3.1.6 - RealGain: Real and Linear gain
- 3.1.7 - EM Gain Ageing: What causes it and how is it countered?
- 3.1.8 - Gain and signal restrictions
- 3.1.9 - EMCAL
- 3.2 - COOLING
- 3.2.1 - Cooling options
- 3.2.2 - Heat generated in the EMCCD
- 3.2.3 Heatsink “hot side“ temperature
- 3.2.4 - Fan settings
- 3.3 - SENSOR READOUT OPTIMIZATION
- 3.3.1 - Sensor Pre-amp options
- 3.3.2 - Variable Horizontal Readout Rate
- 3.3.3 - Variable Vertical Shift Speed
- 3.3.4 - Output amplifier selection
- 3.3.5 - Baseline Optimization
- 3.3.5.1 - Baseline Clamp
- 3.3.6 - Binning and Sub Image options
- 3.4 - ACQUISITION OPTIONS
- 3.4.1 - Capture Sequence in Frame Transfer (FT) Mode
- 3.4.1.1 - Points to consider when using FT Mode
- 3.4.2 - Capture Sequence in Non-Frame Transfer Mode (NFT) with an FT EMCCD
- 3.4.2.1 - Points to note about using an FT EMCCD as a standard EMCCD
- 3.4.3 - Capture Sequence for Fast Kinetics (FK) with an FT EMCCD
- 3.4.3.1 - Points to consider when using Fast Kinetics mode
- 3.4.4 - Keep Clean Cycles
- 3.5 - TRIGGERING OPTIONS
- 3.5.1 - Triggering options in Frame Transfer (FT) mode
- 3.5.1.1 - Internal Triggering (FT)
- 3.5.1.2 - External Triggering (FT)
- 3.5.1.3 - External Exposure (FT)
- 3.5.2 - Triggering options in Non-Frame Transfer (NFT) mode
- 3.5.2.1 - Internal (NFT)
- 3.5.2.2 - External & Fast External (NFT)
- 3.5.2.3 - External Exposure (NFT)
- 3.5.2.4 - Software trigger (NFT)
- 3.5.3 - Trigger options in Fast Kinetics (FK) mode
- 3.5.3.1 - Internal (FK)
- 3.5.3.2 - External (FK)
- 3.5.3.3 - External Start (FK)
- 3.6 - SHUTTERING
- 3.7 - COUNT CONVERT
- 3.8 - OPTACQUIRE
- 3.8.1 - OptAcquire modes
- 3.9 - PUSHING FRAME RATES WITH CROPPED SENSOR MODE
- 3.9.1 - Cropped Sensor Mode Frame Rates
- 3.10 - ADVANCED PHOTON COUNTING IN EMCCDs
- 3.10.1 - Photon Counting by Post-Process
- 3.11 - SPURIOUS NOISE FILTER
- 4.1 - EMCCD TECHNOLOGY
- 4.1.1 - What is an Electron Multiplying CCD?
- 4.1.2 - Does EMCCD technology eliminate Read Out Noise?
- 4.1.3 - How sensitive are EMCCDs?
- 4.1.4 - What applications are EMCCDs suitable for?
- 4.1.5 - What is Andor Technology's experience with EMCCDs?
- 4.2 - EMCCD SENSOR
- 4.3 - VACUUM HOUSING
- 4.3.1 - Thermoelectric cooler
- 4.4 – USB 2.0 INTERFACE
- 4.5 - OUTGASSING
- 4.6 - EXTERNAL I/O
- 4.7 - SIGNAL DIAGRAMS
- 4.8 - CAMERALINK
- SECTION 5: TROUBLESHOOTING
- 5.1 - UNIT DOES NOT SWITCH ON
- 5.2 - SUPPORT DEVICE NOT RECOGNISED WHEN PLUGGED INTO PC
- 5.3 - TEMPERATURE TRIP ALARM SOUNDS (CONTINUOUS TONE)
- 5.4 - CAMERA HIGH FIFO FILL ALARM
- 5.5 - USE OF MULTIPLE HIGH SPEED USB 2.0 I/O ON ONE CAMERA
- A.1 - GLOSSARY
- A.1.1 - Readout sequence of an EMCCD
- A.1.2 - Accumulation
- A.1.3 - Acquisition
- A.1.4 - A/D Conversion
- A.1.5 - Background
- A.1.6 - Binning
- A.1.7 - Counts
- A.1.8 - Dark Signal
- A.1.9 - Detection Limit
- A.1.10 - Exposure Time
- A.1.11 - Frame Transfer
- A.1.12 - NOISE
- A.1.12.1 - Pixel Noise
- A.1.12.1.1 - Readout Noise
- A.1.12.1.2 - Shot Noise
- A.1.12.1.2.A - Shot Noise from the Signal
- A.1.12.1.2.B - Shot Noise from the Dark Signal
- A.1.12.1.3 - Calculation of Total Pixel Noise
- A.1.12.2 - Fixed Pattern Noise
- A.1.13 - Quantum Efficiency/Spectral Response
- A.1.14 - Readout
- A.1.15 - Saturation
- A.1.16 - Scans (Keep Clean and Acquired)
- A.1.17 - Shift Register
- A.1.18 - Signal To Noise Ratio
- B - MECHANICAL DIMENSIONS
- C - DECLARATION OF CONFORMITY
- D - HARDWARE AND SOFTWARE WARRANTY SERVICE
- D.1 - SERVICE DESCRIPTION
- D.2 - Access to Service
- D.3 - Hardware Remediation
- D.4 - Software Remediation
- E - THE WASTE ELECTRONIC AND ELECTRICAL EQUIPMENT REGULATIONS 2006 (WEEE)

Version 1.1 rev Jan 2013
Page 78
iXon Ultra
, Features and Functionality
3.7 - COUNT CONVERT
One of the distinctive features of the iXon Ultra is the capability to quantitatively capture and present data in units of
electrons or photons; the conversion applied either in real time or as a post-conversion step. Photons that are incident
on pixels of an array detector are captured and converted to electrons. During a given exposure time, the signal in
electrons that is collected in each pixel is proportional to the signal intensity. In EMCCDs, the signal in electrons
is further multiplied in the EM Gain register. The average multiplication factor is selected in the software from the
RealGain™ scale. It can be desirable to directly quantify signal intensity either in terms of electrons per pixel, or in terms
of incident photons per pixel. However, during the readout process, array detectors must rst convert the signal in
electrons (the multiplied signal in the case of EMCCDs) into a voltage, which is then digitized by an Analogue to Digital
Converter (ADC). Each Analogue to Digital Unit (ADU) is presented as a ‘count’ in the signal intensity scale, each count
corresponding to an exact number of electrons. Furthermore, the signal value in counts sits on top of an electronic bias
offset value. In the iXon Ultra this ‘baseline’ is clamped at 200 counts in normal operation modes.
Therefore, in order to calculate to the original signal in electrons, the electron to ADU conversion factor must be very
accurately stored by the camera (which varies depending on the pre-amplier gain selection chosen through software).
Calculation of the signal as absolute electrons also requires knowledge of the bias offset and the EM Gain. The
calculation path is shown in Figure 35 below:
Figure 35: Count Convert calculation path
Furthermore, knowledge of the Quantum Efciency (QE) at each wavelength, and light throughput properties of the
camera window, enables this process to be taken a step further allowing the signal to be estimated in photons incident
at each pixel. For this step, the user must input the signal wavelength. In uorescence microscopy, for example, this
would correspond to the central wavelength dened by a narrow band emission lter matched to the uorophore
of interest. If the spectral coverage of the signal on the detector is so broad that the QE curve varies signicantly
throughout this range, then the accuracy of the incident photon estimation would be compromised.
The Count Convert functionality of the iXon Ultra provides the exibility to acquire data in either electrons or incident
photons, using both real time and post-process facilities. Since the real time feature is processed in hardware, there is
little or no impact on the display rate. With the post-process option, it is possible to record the original data in counts
and perform this important conversion to either electrons or photons as a post-conversion step, while retaining the
original data.










