Integration Manual
Table Of Contents
- Document information
- Contents
- 1 System description
- 1.1 Overview
- 1.2 Architecture
- 1.3 Pin-out
- 1.4 Operating modes
- 1.5 Supply interfaces
- 1.5.1 Module supply input (VCC)
- 1.5.1.1 VCC supply requirements
- 1.5.1.2 VCC current consumption in LTE connected mode
- 1.5.1.3 VCC current consumption in 2G connected mode
- 1.5.1.4 VCC current consumption in ultra low power deep sleep mode
- 1.5.1.5 VCC current consumption in low power idle mode
- 1.5.1.6 VCC current consumption in active mode (PSM / low power disabled)
- 1.5.2 Generic digital interfaces supply output (V_INT)
- 1.5.1 Module supply input (VCC)
- 1.6 System function interfaces
- 1.7 Antenna interfaces
- 1.8 SIM interface
- 1.9 Data communication interfaces
- 1.10 Audio
- 1.11 General Purpose Input/Output
- 1.12 GNSS peripheral input output
- 1.13 Reserved pins (RSVD)
- 2 Design-in
- 2.1 Overview
- 2.2 Supply interfaces
- 2.2.1 Module supply (VCC)
- 2.2.1.1 General guidelines for VCC supply circuit selection and design
- 2.2.1.2 Guidelines for VCC supply circuit design using a switching regulator
- 2.2.1.3 Guidelines for VCC supply circuit design using LDO linear regulator
- 2.2.1.4 Guidelines for VCC supply circuit design using a rechargeable battery
- 2.2.1.5 Guidelines for VCC supply circuit design using a primary battery
- 2.2.1.6 Guidelines for external battery charging circuit
- 2.2.1.7 Guidelines for external charging and power path management circuit
- 2.2.1.8 Guidelines for particular VCC supply circuit design for SARA-R4x2
- 2.2.1.9 Guidelines for removing VCC supply
- 2.2.1.10 Additional guidelines for VCC supply circuit design
- 2.2.1.11 Guidelines for VCC supply layout design
- 2.2.1.12 Guidelines for grounding layout design
- 2.2.2 Generic digital interfaces supply output (V_INT)
- 2.2.1 Module supply (VCC)
- 2.3 System functions interfaces
- 2.4 Antenna interfaces
- 2.5 SIM interface
- 2.6 Data communication interfaces
- 2.7 Audio
- 2.8 General Purpose Input/Output
- 2.9 GNSS peripheral input output
- 2.10 Reserved pins (RSVD)
- 2.11 Module placement
- 2.12 Module footprint and paste mask
- 2.13 Thermal guidelines
- 2.14 Schematic for SARA-R4 series module integration
- 2.15 Design-in checklist
- 3 Handling and soldering
- 4 Approvals
- 4.1 Product certification approval overview
- 4.2 US Federal Communications Commission notice
- 4.3 Innovation, Science, Economic Development Canada notice
- 4.4 European Conformance CE mark
- 4.5 National Communication Commission Taiwan
- 4.6 ANATEL Brazil
- 4.7 Australian Conformance
- 4.8 GITEKI Japan
- 4.9 KC South Korea
- 5 Product testing
- Appendix
- A Migration between SARA modules
- B Glossary
- Related documentation
- Revision history
- Contact
SARA-R4 series - System integration manual
UBX-16029218 - R20 Design-in Page 97 of 129
C1-Public
2.10 Reserved pins (RSVD)
SARA-R4 series modules have pins reserved for future use, marked as RSVD.
All the RSVD pins are to be left unconnected on the application board, except for the RSVD pin number
33 that can be externally connected to ground by 0 series jumper.
☞ It is highly recommended to provide accessible test point directly connected to the RSVD #33 pin
for diagnostic purpose (see Figure 60).
2.11 Module placement
An optimized placement allows a minimum RF line’s length and closer path from DC source for VCC.
Make sure that the module, analog parts and RF circuits are clearly separated from any possible
source of radiated energy. In particular, digital circuits can radiate digital frequency harmonics, which
can produce Electro-Magnetic Interference that affects the module, analog parts and RF circuits’
performance. Implement suitable countermeasures to avoid any possible Electro-Magnetic
Compatibility issue.
Make sure that the module, RF and analog parts / circuits, and high speed digital circuits are clearly
separated from any sensitive part / circuit which may be affected by Electro-Magnetic Interference,
or employ countermeasures to avoid any possible Electro-Magnetic Compatibility issue.
Make sure that the module is placed in order to keep the antenna as far as possible from VCC supply
line and related parts (refer to Figure 32), from high speed digital lines (as USB) and from any possible
noise source.
Provide enough clearance between the module and any external part: clearance of at least 0.4 mm per
side is recommended to let suitable mounting of the parts.
☞ The heat dissipation during continuous transmission at maximum power can significantly raise
the temperature of the application base-board below the SARA-R4 series modules: avoid placing
temperature sensitive devices close to the module.