Integration Manual
Table Of Contents
- Document information
- Contents
- 1 System description
- 1.1 Overview
- 1.2 Architecture
- 1.3 Pin-out
- 1.4 Operating modes
- 1.5 Supply interfaces
- 1.5.1 Module supply input (VCC)
- 1.5.1.1 VCC supply requirements
- 1.5.1.2 VCC current consumption in LTE connected mode
- 1.5.1.3 VCC current consumption in 2G connected mode
- 1.5.1.4 VCC current consumption in ultra low power deep sleep mode
- 1.5.1.5 VCC current consumption in low power idle mode
- 1.5.1.6 VCC current consumption in active mode (PSM / low power disabled)
- 1.5.2 Generic digital interfaces supply output (V_INT)
- 1.5.1 Module supply input (VCC)
- 1.6 System function interfaces
- 1.7 Antenna interfaces
- 1.8 SIM interface
- 1.9 Data communication interfaces
- 1.10 Audio
- 1.11 General Purpose Input/Output
- 1.12 GNSS peripheral input output
- 1.13 Reserved pins (RSVD)
- 2 Design-in
- 2.1 Overview
- 2.2 Supply interfaces
- 2.2.1 Module supply (VCC)
- 2.2.1.1 General guidelines for VCC supply circuit selection and design
- 2.2.1.2 Guidelines for VCC supply circuit design using a switching regulator
- 2.2.1.3 Guidelines for VCC supply circuit design using LDO linear regulator
- 2.2.1.4 Guidelines for VCC supply circuit design using a rechargeable battery
- 2.2.1.5 Guidelines for VCC supply circuit design using a primary battery
- 2.2.1.6 Guidelines for external battery charging circuit
- 2.2.1.7 Guidelines for external charging and power path management circuit
- 2.2.1.8 Guidelines for particular VCC supply circuit design for SARA-R4x2
- 2.2.1.9 Guidelines for removing VCC supply
- 2.2.1.10 Additional guidelines for VCC supply circuit design
- 2.2.1.11 Guidelines for VCC supply layout design
- 2.2.1.12 Guidelines for grounding layout design
- 2.2.2 Generic digital interfaces supply output (V_INT)
- 2.2.1 Module supply (VCC)
- 2.3 System functions interfaces
- 2.4 Antenna interfaces
- 2.5 SIM interface
- 2.6 Data communication interfaces
- 2.7 Audio
- 2.8 General Purpose Input/Output
- 2.9 GNSS peripheral input output
- 2.10 Reserved pins (RSVD)
- 2.11 Module placement
- 2.12 Module footprint and paste mask
- 2.13 Thermal guidelines
- 2.14 Schematic for SARA-R4 series module integration
- 2.15 Design-in checklist
- 3 Handling and soldering
- 4 Approvals
- 4.1 Product certification approval overview
- 4.2 US Federal Communications Commission notice
- 4.3 Innovation, Science, Economic Development Canada notice
- 4.4 European Conformance CE mark
- 4.5 National Communication Commission Taiwan
- 4.6 ANATEL Brazil
- 4.7 Australian Conformance
- 4.8 GITEKI Japan
- 4.9 KC South Korea
- 5 Product testing
- Appendix
- A Migration between SARA modules
- B Glossary
- Related documentation
- Revision history
- Contact
SARA-R4 series - System integration manual
UBX-16029218 - R20 Contents Page 5 of 129
C1-Public
2.4.1 General guidelines for antenna interfaces ..................................................................................62
2.4.2 Cellular antenna RF interface (ANT) .............................................................................................66
2.4.3 GNSS antenna RF interface (ANT_GNSS) ...................................................................................69
2.4.4 Cellular and GNSS RF coexistence ................................................................................................73
2.4.5 Antenna detection interface (ANT_DET).....................................................................................76
2.5 SIM interface ..............................................................................................................................................79
2.5.1 Guidelines for SIM circuit design ...................................................................................................79
2.5.2 Guidelines for SIM layout design ...................................................................................................83
2.6 Data communication interfaces ............................................................................................................84
2.6.1 UART interface ..................................................................................................................................84
2.6.2 USB interface .....................................................................................................................................89
2.6.3 SPI interface ......................................................................................................................................92
2.6.4 SDIO interface ...................................................................................................................................92
2.6.5 DDC (I2C) interface ...........................................................................................................................92
2.7 Audio ............................................................................................................................................................95
2.7.1 Guidelines for Audio circuit design ................................................................................................95
2.8 General Purpose Input/Output ...............................................................................................................95
2.8.1 Guidelines for GPIO circuit design .................................................................................................95
2.8.2 Guidelines for general purpose input/output layout design ....................................................96
2.9 GNSS peripheral input output ................................................................................................................96
2.9.1 Guidelines for GNSS peripheral input output circuit design ....................................................96
2.9.2 Guidelines for GNSS peripheral input output layout design ....................................................96
2.10 Reserved pins (RSVD) ..............................................................................................................................97
2.11 Module placement ....................................................................................................................................97
2.12 Module footprint and paste mask .........................................................................................................98
2.13 Thermal guidelines ...................................................................................................................................99
2.14 Schematic for SARA-R4 series module integration ....................................................................... 100
2.14.1 Schematic for SARA-R4 series modules .................................................................................. 100
2.15 Design-in checklist ................................................................................................................................. 101
2.15.1 Schematic checklist ...................................................................................................................... 101
2.15.2 Layout checklist ............................................................................................................................. 101
2.15.3 Antenna checklist .......................................................................................................................... 102
3 Handling and soldering ................................................................................................................... 103
3.1 Packaging, shipping, storage and moisture preconditioning ....................................................... 103
3.2 Handling ................................................................................................................................................... 103
3.3 Soldering .................................................................................................................................................. 104
3.3.1 Soldering paste .............................................................................................................................. 104
3.3.2 Reflow soldering ............................................................................................................................. 104
3.3.3 Optical inspection .......................................................................................................................... 105
3.3.4 Cleaning ........................................................................................................................................... 105
3.3.5 Repeated reflow soldering ........................................................................................................... 106
3.3.6 Wave soldering ............................................................................................................................... 106
3.3.7 Hand soldering ............................................................................................................................... 106