Integration Manual
Table Of Contents
- Document information
- Contents
- 1 System description
- 1.1 Overview
- 1.2 Architecture
- 1.3 Pin-out
- 1.4 Operating modes
- 1.5 Supply interfaces
- 1.5.1 Module supply input (VCC)
- 1.5.1.1 VCC supply requirements
- 1.5.1.2 VCC current consumption in LTE connected mode
- 1.5.1.3 VCC current consumption in 2G connected mode
- 1.5.1.4 VCC current consumption in ultra low power deep sleep mode
- 1.5.1.5 VCC current consumption in low power idle mode
- 1.5.1.6 VCC current consumption in active mode (PSM / low power disabled)
- 1.5.2 Generic digital interfaces supply output (V_INT)
- 1.5.1 Module supply input (VCC)
- 1.6 System function interfaces
- 1.7 Antenna interfaces
- 1.8 SIM interface
- 1.9 Data communication interfaces
- 1.10 Audio
- 1.11 General Purpose Input/Output
- 1.12 GNSS peripheral input output
- 1.13 Reserved pins (RSVD)
- 2 Design-in
- 2.1 Overview
- 2.2 Supply interfaces
- 2.2.1 Module supply (VCC)
- 2.2.1.1 General guidelines for VCC supply circuit selection and design
- 2.2.1.2 Guidelines for VCC supply circuit design using a switching regulator
- 2.2.1.3 Guidelines for VCC supply circuit design using LDO linear regulator
- 2.2.1.4 Guidelines for VCC supply circuit design using a rechargeable battery
- 2.2.1.5 Guidelines for VCC supply circuit design using a primary battery
- 2.2.1.6 Guidelines for external battery charging circuit
- 2.2.1.7 Guidelines for external charging and power path management circuit
- 2.2.1.8 Guidelines for particular VCC supply circuit design for SARA-R4x2
- 2.2.1.9 Guidelines for removing VCC supply
- 2.2.1.10 Additional guidelines for VCC supply circuit design
- 2.2.1.11 Guidelines for VCC supply layout design
- 2.2.1.12 Guidelines for grounding layout design
- 2.2.2 Generic digital interfaces supply output (V_INT)
- 2.2.1 Module supply (VCC)
- 2.3 System functions interfaces
- 2.4 Antenna interfaces
- 2.5 SIM interface
- 2.6 Data communication interfaces
- 2.7 Audio
- 2.8 General Purpose Input/Output
- 2.9 GNSS peripheral input output
- 2.10 Reserved pins (RSVD)
- 2.11 Module placement
- 2.12 Module footprint and paste mask
- 2.13 Thermal guidelines
- 2.14 Schematic for SARA-R4 series module integration
- 2.15 Design-in checklist
- 3 Handling and soldering
- 4 Approvals
- 4.1 Product certification approval overview
- 4.2 US Federal Communications Commission notice
- 4.3 Innovation, Science, Economic Development Canada notice
- 4.4 European Conformance CE mark
- 4.5 National Communication Commission Taiwan
- 4.6 ANATEL Brazil
- 4.7 Australian Conformance
- 4.8 GITEKI Japan
- 4.9 KC South Korea
- 5 Product testing
- Appendix
- A Migration between SARA modules
- B Glossary
- Related documentation
- Revision history
- Contact
SARA-R4 series - System integration manual
UBX-16029218 - R20 System description Page 13 of 129
C1-Public
SARA-R4 series modules internally consist of the following sections described herein with more
details than the simplified block diagrams of Figure 1, Figure 2 and Figure 3.
RF section
The RF section is composed of the following main elements:
• RF switch connecting the antenna port (ANT) to the suitable RF Tx / Rx paths for LTE Cat M1 /
NB-IoT Half-Duplex operations
• Power Amplifiers (PA) amplifying the Tx signal modulated and pre-amplified by the RF transceiver
• RF filters along the Tx and Rx signal paths providing RF filtering
• RF transceiver, performing modulation, up-conversion and pre-amplification of the baseband
signals for LTE transmission, and performing down-conversion and demodulation of the RF signal
for LTE reception
• 19.2 MHz Temperature-Controlled Crystal Oscillator (TCXO) generating the reference clock signal
for the RF transceiver and the baseband system, when the related system is in active mode or
connected mode.
Baseband and power management section
The baseband and power management section, is composed of the following main elements:
• On-chip modem processor, vector signal processor, with dedicated hardware assistance for signal
processing and system timing
• On-chip modem processor, with interfaces control functions
• On-chip voltage regulators to derive all the internal or external (V_SIM, V_INT) supply voltages
from the module supply input VCC
• Dedicated flash memory IC
• 32.768 kHz crystal oscillator to provide the clock reference in the low power idle mode, which can
be enabled using the +UPSV AT command, and in the PSM deep-sleep mode, which can be enabled
using the +CPSMS AT command
GNSS section (SARA-R422M8S modules only)
The GNSS section, is composed of the following main elements illustrated in Figure 4:
• u-blox UBX-M8030-CT concurrent GNSS chipset with SPG 3.01 firmware version
• Dedicated SAW filter
• Additional Low Noise Amplifier (LNA)
• 26 MHz Temperature-Controlled Crystal Oscillator (TCXO) generating the reference clock signal
for the GNSS system
ANT_GNSS
UART1
UART2
Base Band
Processor
Power
Management
Flash memory
SAW
LNA
UBX-M8030
GNSS chipset
LNA_EN (PIO16)
RF_IN
V_BCKPVCC 26 MHz
VCC
RTC
19.2 MHz
SQI
EXTINT
TIMEPULSE
TCXO
ANT_ON
Time-Pulse (PIO11)
Ext-Int (PIO13)
Tx-Ready (PIO15)
I2C (PIO8/PIO9)
Cellular chipset
TXD (PIO6)
TXD_GNSS
Power ClockCtrl
SARA-R422M8S
Figure 4: SARA-R422M8S modules GNSS section block diagram