Integration Manual

Table Of Contents
SARA-R5 series - System integration manual
UBX-19041356 - R03 Design-in Page 82 of 123
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Figure 62 and Figure 63 provide two examples of coplanar waveguide designs with differential
characteristic impedance close to 90 and common mode characteristic impedance close to 30 .
The first transmission line can be implemented in case of 4-layer PCB stack-up herein described, the
second transmission line can be implemented in case of 2-layer PCB stack-up herein described.
35 µm
35 µm
35 µm
35 µm
270 µm
270 µm
760 µm
L1 copper
L3 copper
L2 copper
L4 copper
FR-4 dielectric
FR-4 dielectric
FR-4 dielectric
350 µm 400 µm400 µm350 µm400 µm
Figure 62: Example of USB line design, with Z0 close to 90 and ZCM close to 30 , for the described 4-layer board layup
35 µm
35 µm
1510 µm
L2 copper
L1 copper
FR-4 dielectric
740 µm 410 µm410 µm740 µm410 µm
Figure 63: Example of USB line design, with Z
0
close to 90 and Z
CM
close to 30 , for the described 2-layer board layup
2.6.3 SPI interfaces
The SPI interfaces are not supported by the “00product version of SARA-R5 series modules,
except for diagnostic purpose.
It is recommended to provide accessible test points directly connected to the SDIO_D0, SDIO_D1,
SDIO_D2 and SDIO_D3 pins for diagnostic purpose.
2.6.4 SDIO interface
The SDIO interface is not supported by the “00” product version of SARA-R5 series modules.
It is recommended to provide accessible test points directly connected to the SDIO_D0, SDIO_D1,
SDIO_D2 and SDIO_D3 pins for diagnostic purpose.