Integration Manual
Table Of Contents
- Preface
- Contents
- 1 System description
- 1.1 Overview
- 1.2 Architecture
- 1.3 Pin-out
- 1.4 Operating modes
- 1.5 Supply interfaces
- 1.5.1 Module supply input (VCC or 3.3Vaux)
- 1.5.1.1 VCC or 3.3Vaux supply requirements
- 1.5.1.2 VCC or 3.3Vaux current consumption in 2G connected-mode
- 1.5.1.3 VCC or 3.3Vaux current consumption in 3G connected mode
- 1.5.1.4 VCC or 3.3Vaux current consumption in LTE connected-mode
- 1.5.1.5 VCC or 3.3Vaux current consumption in cyclic idle/active mode (power saving enabled)
- 1.5.1.6 VCC or 3.3Vaux current consumption in fixed active-mode (power saving disabled)
- 1.5.2 RTC supply input/output (V_BCKP)
- 1.5.3 Generic digital interfaces supply output (V_INT)
- 1.5.1 Module supply input (VCC or 3.3Vaux)
- 1.6 System function interfaces
- 1.7 Antenna interface
- 1.8 SIM interface
- 1.9 Data communication interfaces
- 1.10 Audio
- 1.11 General Purpose Input/Output
- 1.12 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#)
- 1.13 Reserved pins (RSVD)
- 1.14 Not connected pins (NC)
- 1.15 System features
- 1.15.1 Network indication
- 1.15.2 Antenna supervisor
- 1.15.3 Jamming detection
- 1.15.4 IP modes of operation
- 1.15.5 Dual stack IPv4/IPv6
- 1.15.6 TCP/IP and UDP/IP
- 1.15.7 FTP
- 1.15.8 HTTP
- 1.15.9 SSL / TLS
- 1.15.10 Bearer Independent Protocol
- 1.15.11 Wi-Fi integration
- 1.15.12 Firmware update Over AT (FOAT)
- 1.15.13 Firmware update Over The Air (FOTA)
- 1.15.14 Smart temperature management
- 1.15.15 SIM Access Profile (SAP)
- 1.15.16 Power saving
- 2 Design-in
- 2.1 Overview
- 2.2 Supply interfaces
- 2.2.1 Module supply (VCC or 3.3Vaux)
- 2.2.1.1 General guidelines for VCC or 3.3Vaux supply circuit selection and design
- 2.2.1.2 Guidelines for VCC or 3.3Vaux supply circuit design using a switching regulator
- 2.2.1.3 Guidelines for VCC or 3.3Vaux supply circuit design using a Low Drop-Out linear regulator
- 2.2.1.4 Guidelines for VCC supply circuit design using a rechargeable Li-Ion or Li-Pol battery
- 2.2.1.5 Guidelines for VCC supply circuit design using a primary (disposable) battery
- 2.2.1.6 Additional guidelines for VCC or 3.3Vaux supply circuit design
- 2.2.1.7 Guidelines for external battery charging circuit
- 2.2.1.8 Guidelines for external battery charging and power path management circuit
- 2.2.1.9 Guidelines for VCC or 3.3Vaux supply layout design
- 2.2.1.10 Guidelines for grounding layout design
- 2.2.2 RTC supply output (V_BCKP)
- 2.2.3 Generic digital interfaces supply output (V_INT)
- 2.2.1 Module supply (VCC or 3.3Vaux)
- 2.3 System functions interfaces
- 2.4 Antenna interface
- 2.5 SIM interface
- 2.6 Data communication interfaces
- 2.7 Audio interface
- 2.8 General Purpose Input/Output
- 2.9 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#)
- 2.10 Reserved pins (RSVD)
- 2.11 Module placement
- 2.12 TOBY-L2 series module footprint and paste mask
- 2.13 MPCI-L2 series module installation
- 2.14 Thermal guidelines
- 2.15 ESD guidelines
- 2.16 Schematic for TOBY-L2 and MPCI-L2 series module integration
- 2.17 Design-in checklist
- 3 Handling and soldering
- 4 Approvals
- 4.1 Product certification approval overview
- 4.2 US Federal Communications Commission notice
- 4.3 Innovation, Science and Economic Development Canada notice
- 4.4 Brazilian Anatel certification
- 4.5 European Conformance CE mark
- 4.6 Australian Regulatory Compliance Mark
- 4.7 Taiwanese NCC certification
- 4.8 Japanese Giteki certification
- 5 Product testing
- Appendix
- A Migration between TOBY-L1 and TOBY-L2
- B Glossary
- Related documents
- Revision history
- Contact
TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R26 Contents
Page 7 of 162
2.15 ESD guidelines .............................................................................................................................. 127
2.15.1 ESD immunity test overview ...................................................................................................... 127
2.15.2 ESD immunity test of TOBY-L2 and MPCI-L2 series reference designs ........................................ 128
2.15.3 ESD application circuits .............................................................................................................. 128
2.16 Schematic for TOBY-L2 and MPCI-L2 series module integration .................................................... 130
2.16.1 Schematic for TOBY-L2 module “00” product version ............................................................... 130
2.16.2 Schematic for TOBY-L2 module “01” or “60” product versions ................................................ 131
2.16.3 Schematic for TOBY-L2 module “02”, “03” or “62” product versions ...................................... 132
2.16.4 Schematic for MPCI-L2 series ..................................................................................................... 133
2.17 Design-in checklist ........................................................................................................................ 134
2.17.1 Schematic checklist ................................................................................................................... 134
2.17.2 Layout checklist ......................................................................................................................... 135
2.17.3 Antenna checklist ...................................................................................................................... 135
3 Handling and soldering ........................................................................................... 136
3.1 Packaging, shipping, storage and moisture preconditioning .......................................................... 136
3.2 Handling ....................................................................................................................................... 136
3.3 Soldering ...................................................................................................................................... 137
3.3.1 Soldering paste ......................................................................................................................... 137
3.3.2 Reflow soldering ....................................................................................................................... 137
3.3.3 Optical inspection ...................................................................................................................... 138
3.3.4 Cleaning .................................................................................................................................... 138
3.3.5 Repeated reflow soldering ......................................................................................................... 139
3.3.6 Wave soldering ......................................................................................................................... 139
3.3.7 Hand soldering .......................................................................................................................... 139
3.3.8 Rework ...................................................................................................................................... 139
3.3.9 Conformal coating .................................................................................................................... 139
3.3.10 Casting ...................................................................................................................................... 139
3.3.11 Grounding metal covers ............................................................................................................ 139
3.3.12 Use of ultrasonic processes ........................................................................................................ 139
4 Approvals .................................................................................................................. 140
4.1 Product certification approval overview ......................................................................................... 140
4.2 US Federal Communications Commission notice ........................................................................... 141
4.2.1 Safety warnings review the structure ......................................................................................... 141
4.2.2 Declaration of Conformity ......................................................................................................... 141
4.2.3 Modifications ............................................................................................................................ 142
4.3 Innovation, Science and Economic Development Canada notice ................................................... 142
4.3.1 Declaration of Conformity ......................................................................................................... 143
4.3.2 Modifications ............................................................................................................................ 143
4.4 Brazilian Anatel certification .......................................................................................................... 145
4.5 European Conformance CE mark .................................................................................................. 146
4.6 Australian Regulatory Compliance Mark ....................................................................................... 147
4.7 Taiwanese NCC certification ......................................................................................................... 147
4.8 Japanese Giteki certification .......................................................................................................... 148