Integration Manual
Table Of Contents
- Preface
- Contents
- 1 System description
- 1.1 Overview
- 1.2 Architecture
- 1.3 Pin-out
- 1.4 Operating modes
- 1.5 Supply interfaces
- 1.5.1 Module supply input (VCC or 3.3Vaux)
- 1.5.1.1 VCC or 3.3Vaux supply requirements
- 1.5.1.2 VCC or 3.3Vaux current consumption in 2G connected-mode
- 1.5.1.3 VCC or 3.3Vaux current consumption in 3G connected mode
- 1.5.1.4 VCC or 3.3Vaux current consumption in LTE connected-mode
- 1.5.1.5 VCC or 3.3Vaux current consumption in cyclic idle/active mode (power saving enabled)
- 1.5.1.6 VCC or 3.3Vaux current consumption in fixed active-mode (power saving disabled)
- 1.5.2 RTC supply input/output (V_BCKP)
- 1.5.3 Generic digital interfaces supply output (V_INT)
- 1.5.1 Module supply input (VCC or 3.3Vaux)
- 1.6 System function interfaces
- 1.7 Antenna interface
- 1.8 SIM interface
- 1.9 Data communication interfaces
- 1.10 Audio
- 1.11 General Purpose Input/Output
- 1.12 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#)
- 1.13 Reserved pins (RSVD)
- 1.14 Not connected pins (NC)
- 1.15 System features
- 1.15.1 Network indication
- 1.15.2 Antenna supervisor
- 1.15.3 Jamming detection
- 1.15.4 IP modes of operation
- 1.15.5 Dual stack IPv4/IPv6
- 1.15.6 TCP/IP and UDP/IP
- 1.15.7 FTP
- 1.15.8 HTTP
- 1.15.9 SSL / TLS
- 1.15.10 Bearer Independent Protocol
- 1.15.11 Wi-Fi integration
- 1.15.12 Firmware update Over AT (FOAT)
- 1.15.13 Firmware update Over The Air (FOTA)
- 1.15.14 Smart temperature management
- 1.15.15 SIM Access Profile (SAP)
- 1.15.16 Power saving
- 2 Design-in
- 2.1 Overview
- 2.2 Supply interfaces
- 2.2.1 Module supply (VCC or 3.3Vaux)
- 2.2.1.1 General guidelines for VCC or 3.3Vaux supply circuit selection and design
- 2.2.1.2 Guidelines for VCC or 3.3Vaux supply circuit design using a switching regulator
- 2.2.1.3 Guidelines for VCC or 3.3Vaux supply circuit design using a Low Drop-Out linear regulator
- 2.2.1.4 Guidelines for VCC supply circuit design using a rechargeable Li-Ion or Li-Pol battery
- 2.2.1.5 Guidelines for VCC supply circuit design using a primary (disposable) battery
- 2.2.1.6 Additional guidelines for VCC or 3.3Vaux supply circuit design
- 2.2.1.7 Guidelines for external battery charging circuit
- 2.2.1.8 Guidelines for external battery charging and power path management circuit
- 2.2.1.9 Guidelines for VCC or 3.3Vaux supply layout design
- 2.2.1.10 Guidelines for grounding layout design
- 2.2.2 RTC supply output (V_BCKP)
- 2.2.3 Generic digital interfaces supply output (V_INT)
- 2.2.1 Module supply (VCC or 3.3Vaux)
- 2.3 System functions interfaces
- 2.4 Antenna interface
- 2.5 SIM interface
- 2.6 Data communication interfaces
- 2.7 Audio interface
- 2.8 General Purpose Input/Output
- 2.9 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#)
- 2.10 Reserved pins (RSVD)
- 2.11 Module placement
- 2.12 TOBY-L2 series module footprint and paste mask
- 2.13 MPCI-L2 series module installation
- 2.14 Thermal guidelines
- 2.15 ESD guidelines
- 2.16 Schematic for TOBY-L2 and MPCI-L2 series module integration
- 2.17 Design-in checklist
- 3 Handling and soldering
- 4 Approvals
- 4.1 Product certification approval overview
- 4.2 US Federal Communications Commission notice
- 4.3 Innovation, Science and Economic Development Canada notice
- 4.4 Brazilian Anatel certification
- 4.5 European Conformance CE mark
- 4.6 Australian Regulatory Compliance Mark
- 4.7 Taiwanese NCC certification
- 4.8 Japanese Giteki certification
- 5 Product testing
- Appendix
- A Migration between TOBY-L1 and TOBY-L2
- B Glossary
- Related documents
- Revision history
- Contact
TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R26 Design-in
Page 128 of 162
2.15.2 ESD immunity test of TOBY-L2 and MPCI-L2 series reference designs
Although EMC / ESD certification is required for customized devices integrating TOBY-L2 and MPCI-L2 series
modules for European Conformance CE mark, EMC certification (including ESD immunity) has been successfully
performed on TOBY-L2 and MPCI-L2 series modules reference design according to European Norms summarized
in Table 51.
The EMC / ESD approved u-blox reference designs consist of a TOBY-L2 and MPCI-L2 series module installed onto
a motherboard which provides supply interface, SIM card and communication port. External LTE/3G/2G antennas
are connected to the provided connectors.
Since external antennas are used, the antenna port can be separated from the enclosure port. The reference design
is not enclosed in a box so that the enclosure port is not identified with physical surfaces. Therefore, some test
cases cannot be applied. Only the antenna port is identified as accessible for direct ESD exposure.
Table 52 reports the u-blox TOBY-L2 and MPCI-L2 series reference designs ESD immunity test results, according
to test requirements stated in CENELEC EN 61000-4-2 [18], ETSI EN 301 489-1 [19], ETSI EN 301 489-52 [20].
Category
Application
Immunity Level
Remarks
Contact Discharge
to coupling planes
(indirect contact discharge)
Enclosure
+4 kV / -4 kV
Contact Discharges
to conducted surfaces
(direct contact discharge)
Enclosure port
Not Applicable
Test not applicable to u-blox reference design because it
does not provide enclosure surface.
The test is applicable only to equipment providing
conductive enclosure surface.
Antenna ports
+4 kV / -4 kV
Test applicable to u-blox reference design because it
provides antennas with conductive & insulating surfaces.
The test is applicable only to equipment providing
antennas with conductive surface.
Air Discharge
at insulating surfaces
Enclosure port
Not Applicable
Test not applicable to the u-blox reference design because
it does not provide an enclosure surface.
The test is applicable only to equipment providing
insulating enclosure surface.
Antenna ports
+8 kV / -8 kV
Test applicable to u-blox reference design because it
provides antennas with conductive & insulating surfaces.
The test is applicable only to equipment providing
antennas with insulating surface.
Table 52: Enclosure ESD immunity level of u-blox TOBY-L2 and MPCI-L2 series modules reference designs
TOBY-L2 and MPCI-L2 reference design implement all the ESD precautions described in section 2.15.3.
2.15.3 ESD application circuits
The application circuits described in this section are recommended and should be implemented in the device
integrating TOBY-L2 and MPCI-L2 series modules, according to the application device classification (see ETSI EN
301 489-1 [19]), to satisfy the requirements for ESD immunity test summarized in Table 51.
Antenna interface
The ANT1 and ANT2 ports of TOBY-L2 and MPCI-L2 series modules provide ESD immunity up to ±4 kV for direct
Contact Discharge and up to ±8 kV for Air Discharge: no further precaution to ESD immunity test is needed, as
implemented in the EMC / ESD approved reference design of TOBY-L2 and MPCI-L2 series modules.