Integration Manual
Table Of Contents
- Preface
- Contents
- 1 System description
- 1.1 Overview
- 1.2 Architecture
- 1.3 Pin-out
- 1.4 Operating modes
- 1.5 Supply interfaces
- 1.5.1 Module supply input (VCC or 3.3Vaux)
- 1.5.1.1 VCC or 3.3Vaux supply requirements
- 1.5.1.2 VCC or 3.3Vaux current consumption in 2G connected-mode
- 1.5.1.3 VCC or 3.3Vaux current consumption in 3G connected mode
- 1.5.1.4 VCC or 3.3Vaux current consumption in LTE connected-mode
- 1.5.1.5 VCC or 3.3Vaux current consumption in cyclic idle/active mode (power saving enabled)
- 1.5.1.6 VCC or 3.3Vaux current consumption in fixed active-mode (power saving disabled)
- 1.5.2 RTC supply input/output (V_BCKP)
- 1.5.3 Generic digital interfaces supply output (V_INT)
- 1.5.1 Module supply input (VCC or 3.3Vaux)
- 1.6 System function interfaces
- 1.7 Antenna interface
- 1.8 SIM interface
- 1.9 Data communication interfaces
- 1.10 Audio
- 1.11 General Purpose Input/Output
- 1.12 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#)
- 1.13 Reserved pins (RSVD)
- 1.14 Not connected pins (NC)
- 1.15 System features
- 1.15.1 Network indication
- 1.15.2 Antenna supervisor
- 1.15.3 Jamming detection
- 1.15.4 IP modes of operation
- 1.15.5 Dual stack IPv4/IPv6
- 1.15.6 TCP/IP and UDP/IP
- 1.15.7 FTP
- 1.15.8 HTTP
- 1.15.9 SSL / TLS
- 1.15.10 Bearer Independent Protocol
- 1.15.11 Wi-Fi integration
- 1.15.12 Firmware update Over AT (FOAT)
- 1.15.13 Firmware update Over The Air (FOTA)
- 1.15.14 Smart temperature management
- 1.15.15 SIM Access Profile (SAP)
- 1.15.16 Power saving
- 2 Design-in
- 2.1 Overview
- 2.2 Supply interfaces
- 2.2.1 Module supply (VCC or 3.3Vaux)
- 2.2.1.1 General guidelines for VCC or 3.3Vaux supply circuit selection and design
- 2.2.1.2 Guidelines for VCC or 3.3Vaux supply circuit design using a switching regulator
- 2.2.1.3 Guidelines for VCC or 3.3Vaux supply circuit design using a Low Drop-Out linear regulator
- 2.2.1.4 Guidelines for VCC supply circuit design using a rechargeable Li-Ion or Li-Pol battery
- 2.2.1.5 Guidelines for VCC supply circuit design using a primary (disposable) battery
- 2.2.1.6 Additional guidelines for VCC or 3.3Vaux supply circuit design
- 2.2.1.7 Guidelines for external battery charging circuit
- 2.2.1.8 Guidelines for external battery charging and power path management circuit
- 2.2.1.9 Guidelines for VCC or 3.3Vaux supply layout design
- 2.2.1.10 Guidelines for grounding layout design
- 2.2.2 RTC supply output (V_BCKP)
- 2.2.3 Generic digital interfaces supply output (V_INT)
- 2.2.1 Module supply (VCC or 3.3Vaux)
- 2.3 System functions interfaces
- 2.4 Antenna interface
- 2.5 SIM interface
- 2.6 Data communication interfaces
- 2.7 Audio interface
- 2.8 General Purpose Input/Output
- 2.9 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#)
- 2.10 Reserved pins (RSVD)
- 2.11 Module placement
- 2.12 TOBY-L2 series module footprint and paste mask
- 2.13 MPCI-L2 series module installation
- 2.14 Thermal guidelines
- 2.15 ESD guidelines
- 2.16 Schematic for TOBY-L2 and MPCI-L2 series module integration
- 2.17 Design-in checklist
- 3 Handling and soldering
- 4 Approvals
- 4.1 Product certification approval overview
- 4.2 US Federal Communications Commission notice
- 4.3 Innovation, Science and Economic Development Canada notice
- 4.4 Brazilian Anatel certification
- 4.5 European Conformance CE mark
- 4.6 Australian Regulatory Compliance Mark
- 4.7 Taiwanese NCC certification
- 4.8 Japanese Giteki certification
- 5 Product testing
- Appendix
- A Migration between TOBY-L1 and TOBY-L2
- B Glossary
- Related documents
- Revision history
- Contact
TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R26 Design-in
Page 127 of 162
Beside the reduction of the Module-to-Ambient thermal resistance implemented by proper application hardware
design, the increase of module temperature can be moderated by proper application software implementation:
Enable power saving configuration using the AT+UPSV command (see section 1.15.16).
Enable module connected-mode for a given time period and then disable it for a time period enough long to
properly mitigate temperature increase.
2.15 ESD guidelines
The sections 2.15.1 and 2.15.2 are related to EMC / ESD immunity. The modules are ESD sensitive devices. The
ESD sensitivity for each pin (as Human Body Model according to JESD22-A114F) is specified in TOBY-L2 series Data
Sheet [1] or MPCI-L2 series Data Sheet [2]. Special precautions are required when handling the pins; for ESD
handling guidelines see section 3.2.
2.15.1 ESD immunity test overview
The immunity of devices integrating TOBY-L2 and MPCI-L2 series modules to Electro-Static Discharge (ESD) is part
of the Electro-Magnetic Compatibility (EMC) conformity which is required for products bearing the CE marking,
compliant with the Radio Equipment Directive (2014/53/EU), the EMC Directive (2014/30/EU) and the Low Voltage
Directive (2014/35/EU) issued by the Commission of the European Community.
Compliance with these directives implies conformity to the following European Norms for device ESD immunity:
ESD testing standard CENELEC EN 61000-4-2 [18] and the radio equipment standards ETSI EN 301 489-1 [19],
ETSI EN 301 489-52 [20], which requirements are summarized in Table 51.
The ESD immunity test is performed at the enclosure port, defined by ETSI EN 301 489-1 [19] as the physical
boundary through which the electromagnetic field radiates. If the device implements an integral antenna, the
enclosure port is seen as all insulating and conductive surfaces housing the device. If the device implements a
removable antenna, the antenna port can be separated from the enclosure port. The antenna port includes the
antenna element and its interconnecting cable surfaces.
The applicability of ESD immunity test to the whole device depends on the device classification as defined by ETSI
EN 301 489-1 [19]. Applicability of ESD immunity test to the relative device ports or the relative interconnecting
cables to auxiliary equipment, depends on device accessible interfaces and manufacturer requirements, as defined
by ETSI EN 301 489-1 [19].
Contact discharges are performed at conductive surfaces, while air discharges are performed at insulating surfaces.
Indirect contact discharges are performed on the measurement setup horizontal and vertical coupling planes as
defined in CENELEC EN 61000-4-2 [18].
For the definition of integral antenna, removable antenna, antenna port and device classification see ETSI
EN 301 489-1 [19]. For the contact / air discharges definitions see CENELEC EN 61000-4-2 [18].
Application
Category
Immunity Level
All exposed surfaces of the radio equipment and ancillary equipment in a
representative configuration
Contact Discharge
4 kV
Air Discharge
8 kV
Table 51: EMC / ESD immunity requirements as defined by CENELEC EN 61000-4-2 and ETSI EN 301 489-1, ETSI EN 301 489-52