Integration Manual
Table Of Contents
- Preface
- Contents
- 1 System description
- 1.1 Overview
- 1.2 Architecture
- 1.3 Pin-out
- 1.4 Operating modes
- 1.5 Supply interfaces
- 1.5.1 Module supply input (VCC or 3.3Vaux)
- 1.5.1.1 VCC or 3.3Vaux supply requirements
- 1.5.1.2 VCC or 3.3Vaux current consumption in 2G connected-mode
- 1.5.1.3 VCC or 3.3Vaux current consumption in 3G connected mode
- 1.5.1.4 VCC or 3.3Vaux current consumption in LTE connected-mode
- 1.5.1.5 VCC or 3.3Vaux current consumption in cyclic idle/active mode (power saving enabled)
- 1.5.1.6 VCC or 3.3Vaux current consumption in fixed active-mode (power saving disabled)
- 1.5.2 RTC supply input/output (V_BCKP)
- 1.5.3 Generic digital interfaces supply output (V_INT)
- 1.5.1 Module supply input (VCC or 3.3Vaux)
- 1.6 System function interfaces
- 1.7 Antenna interface
- 1.8 SIM interface
- 1.9 Data communication interfaces
- 1.10 Audio
- 1.11 General Purpose Input/Output
- 1.12 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#)
- 1.13 Reserved pins (RSVD)
- 1.14 Not connected pins (NC)
- 1.15 System features
- 1.15.1 Network indication
- 1.15.2 Antenna supervisor
- 1.15.3 Jamming detection
- 1.15.4 IP modes of operation
- 1.15.5 Dual stack IPv4/IPv6
- 1.15.6 TCP/IP and UDP/IP
- 1.15.7 FTP
- 1.15.8 HTTP
- 1.15.9 SSL / TLS
- 1.15.10 Bearer Independent Protocol
- 1.15.11 Wi-Fi integration
- 1.15.12 Firmware update Over AT (FOAT)
- 1.15.13 Firmware update Over The Air (FOTA)
- 1.15.14 Smart temperature management
- 1.15.15 SIM Access Profile (SAP)
- 1.15.16 Power saving
- 2 Design-in
- 2.1 Overview
- 2.2 Supply interfaces
- 2.2.1 Module supply (VCC or 3.3Vaux)
- 2.2.1.1 General guidelines for VCC or 3.3Vaux supply circuit selection and design
- 2.2.1.2 Guidelines for VCC or 3.3Vaux supply circuit design using a switching regulator
- 2.2.1.3 Guidelines for VCC or 3.3Vaux supply circuit design using a Low Drop-Out linear regulator
- 2.2.1.4 Guidelines for VCC supply circuit design using a rechargeable Li-Ion or Li-Pol battery
- 2.2.1.5 Guidelines for VCC supply circuit design using a primary (disposable) battery
- 2.2.1.6 Additional guidelines for VCC or 3.3Vaux supply circuit design
- 2.2.1.7 Guidelines for external battery charging circuit
- 2.2.1.8 Guidelines for external battery charging and power path management circuit
- 2.2.1.9 Guidelines for VCC or 3.3Vaux supply layout design
- 2.2.1.10 Guidelines for grounding layout design
- 2.2.2 RTC supply output (V_BCKP)
- 2.2.3 Generic digital interfaces supply output (V_INT)
- 2.2.1 Module supply (VCC or 3.3Vaux)
- 2.3 System functions interfaces
- 2.4 Antenna interface
- 2.5 SIM interface
- 2.6 Data communication interfaces
- 2.7 Audio interface
- 2.8 General Purpose Input/Output
- 2.9 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#)
- 2.10 Reserved pins (RSVD)
- 2.11 Module placement
- 2.12 TOBY-L2 series module footprint and paste mask
- 2.13 MPCI-L2 series module installation
- 2.14 Thermal guidelines
- 2.15 ESD guidelines
- 2.16 Schematic for TOBY-L2 and MPCI-L2 series module integration
- 2.17 Design-in checklist
- 3 Handling and soldering
- 4 Approvals
- 4.1 Product certification approval overview
- 4.2 US Federal Communications Commission notice
- 4.3 Innovation, Science and Economic Development Canada notice
- 4.4 Brazilian Anatel certification
- 4.5 European Conformance CE mark
- 4.6 Australian Regulatory Compliance Mark
- 4.7 Taiwanese NCC certification
- 4.8 Japanese Giteki certification
- 5 Product testing
- Appendix
- A Migration between TOBY-L1 and TOBY-L2
- B Glossary
- Related documents
- Revision history
- Contact
TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R26 Design-in
Page 102 of 162
Guidelines for single SIM card connection with detection
A removable SIM card placed in a SIM card holder must be connected to the SIM card interface of TOBY-L2
modules as described in Figure 52, where the optional SIM card detection feature is implemented.
Follow these guidelines to connect the module to a SIM connector implementing SIM presence detection:
Connect the UICC / SIM contacts C1 (VCC) to the VSIM pin of the module.
Connect the UICC / SIM contact C7 (I/O) to the SIM_IO pin of the module.
Connect the UICC / SIM contact C3 (CLK) to the SIM_CLK pin of the module.
Connect the UICC / SIM contact C2 (RST) to the SIM_RST pin of the module.
Connect the UICC / SIM contact C5 (GND) to ground.
Connect one pin of the normally-open mechanical switch integrated in the SIM connector (e.g. the SW2 pin
as described in Figure 52) to the GPIO5 input pin of the module.
Connect the other pin of the normally-open mechanical switch integrated in the SIM connector (e.g. the SW1
pin as described in Figure 52) to the V_INT 1.8 V supply output of the module by means of a strong (e.g.
1 k) pull-up resistor, as the R1 resistor in Figure 52.
Provide a weak (e.g. 470 k) pull-down resistor at the SIM detection line, as the R2 resistor in Figure 52
Provide a 100 nF bypass capacitor (e.g. Murata GRM155R71C104K) at the SIM supply line, close to the related
pad of the SIM connector, to prevent digital noise.
Provide a bypass capacitor of about 22 pF to 47 pF (e.g. Murata GRM1555C1H470J) on each SIM line, very
close to each related pad of the SIM connector, to prevent RF coupling especially in case the RF antenna is
placed closer than 10 - 30 cm from the SIM card holder.
Provide a very low capacitance (i.e. less than 10 pF) ESD protection (e.g. Tyco PESD0402-140) on each
externally accessible SIM line, close to each related pad of the SIM connector: ESD sensitivity rating of the SIM
interface pins is 1 kV (HBM), so that, according to the EMC/ESD requirements of the custom application,
higher protection level can be required if the lines are externally accessible on the application device.
Limit capacitance and series resistance on each SIM signal to match the SIM requirements (26.2 ns is the
maximum allowed rise time on clock line, 1.0 µs is the maximum allowed rise time on data and reset lines).
TOBY-L2 series
5
V_INT
60
GPIO5
SIM CARD
HOLDER
C
5
C
6
C
7
C
1
C
2
C
3
SIM Card
Bottom View
(contacts side)
C1
VPP (C6)
VCC (C1)
IO (C7)
CLK (C3)
RST (C2)
GND (C5)
C2 C3 C5
J1
C4
SW1
SW2
D1 D2 D3 D4 D5 D6
R2
R1
C
8
C
4
TP
59
VSIM
57
SIM_IO
56
SIM_CLK
58
SIM_RST
Figure 52: Application circuit for the connection to a single removable SIM card, with SIM detection implemented
Reference
Description
Part Number - Manufacturer
C1, C2, C3, C4
47 pF Capacitor Ceramic C0G 0402 5% 50 V
GRM1555C1H470JA01 - Murata
C5
100 nF Capacitor Ceramic X7R 0402 10% 16 V
GRM155R71C104KA01 - Murata
D1, … , D6
Very Low Capacitance ESD Protection
PESD0402-140 - Tyco Electronics
R1
1 k Resistor 0402 5% 0.1 W
RC0402JR-071KL - Yageo Phycomp
R2
470 k Resistor 0402 5% 0.1 W
RC0402JR-07470KL- Yageo Phycomp
J1
SIM Card Holder, 6 + 2 p, with card presence switch
Various manufacturers, as CCM03-3013LFT R102 - C&K
Table 38: Example of components for the connection to a single removable SIM card, with SIM detection implemented