Integration Manual

TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R04 Advance Information Contents
Page 6 of 141
2.13 MPCI-L2 series module installation ................................................................................................ 113
2.14 Thermal guidelines ........................................................................................................................ 115
2.15 ESD guidelines .............................................................................................................................. 116
2.15.1 ESD immunity test overview ...................................................................................................... 116
2.15.2 ESD immunity test of TOBY-L2 and MPCI-L2 series reference designs ........................................ 117
2.15.3 ESD application circuits .............................................................................................................. 117
2.16 Schematic for TOBY-L2 and MPCI-L2 series module integration .................................................... 118
2.17 Design-in checklist ........................................................................................................................ 120
2.17.1 Schematic checklist ................................................................................................................... 120
2.17.2 Layout checklist ......................................................................................................................... 121
2.17.3 Antenna checklist ...................................................................................................................... 121
3 Handling and soldering ........................................................................................... 122
3.1 Packaging, shipping, storage and moisture preconditioning ............................................................. 122
3.2 Handling ........................................................................................................................................... 122
3.3 Soldering .......................................................................................................................................... 123
3.3.1 Soldering paste.......................................................................................................................... 123
3.3.2 Reflow soldering ....................................................................................................................... 123
3.3.3 Optical inspection ...................................................................................................................... 124
3.3.4 Cleaning .................................................................................................................................... 124
3.3.5 Repeated reflow soldering ......................................................................................................... 125
3.3.6 Wave soldering.......................................................................................................................... 125
3.3.7 Hand soldering .......................................................................................................................... 125
3.3.8 Rework ...................................................................................................................................... 125
3.3.9 Conformal coating .................................................................................................................... 125
3.3.10 Casting ...................................................................................................................................... 125
3.3.11 Grounding metal covers ............................................................................................................ 125
3.3.12 Use of ultrasonic processes ........................................................................................................ 125
4 Approvals .................................................................................................................. 126
4.1 Product certification approval overview ............................................................................................. 126
4.2 Federal Communications Commission and Industry Canada notice ................................................... 127
4.2.1 Safety warnings review the structure ......................................................................................... 127
4.2.2 Declaration of Conformity – United States only ......................................................................... 127
4.2.3 Modifications ............................................................................................................................ 127
4.3 R&TTED and European Conformance CE mark ................................................................................. 129
5 Product testing ......................................................................................................... 130
5.1 u-blox in-series production test ......................................................................................................... 130
5.2 Test parameters for OEM manufacturer ............................................................................................ 131
5.2.1 “Go/No go” tests for integrated devices .................................................................................... 131
5.2.2 RF functional tests ..................................................................................................................... 131
Appendix ........................................................................................................................ 133