Integration Manual
Table Of Contents
- Preface
- Contents
- 1 System description
- 1.1 Overview
- 1.2 Architecture
- 1.3 Pin-out
- 1.4 Operating modes
- 1.5 Supply interfaces
- 1.5.1 Module supply input (VCC or 3.3Vaux)
- 1.5.1.1 VCC or 3.3Vaux supply requirements
- 1.5.1.2 VCC or 3.3Vaux current consumption in 2G connected-mode
- 1.5.1.3 VCC or 3.3Vaux current consumption in 3G connected mode
- 1.5.1.4 VCC or 3.3Vaux current consumption in LTE connected-mode
- 1.5.1.5 VCC or 3.3Vaux current consumption in cyclic idle/active mode (power saving enabled)
- 1.5.1.6 VCC or 3.3Vaux current consumption in fixed active-mode (power saving disabled)
- 1.5.2 RTC supply input/output (V_BCKP)
- 1.5.3 Generic digital interfaces supply output (V_INT)
- 1.5.1 Module supply input (VCC or 3.3Vaux)
- 1.6 System function interfaces
- 1.7 Antenna interface
- 1.8 SIM interface
- 1.9 Data communication interfaces
- 1.10 Audio
- 1.11 General Purpose Input/Output
- 1.12 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#)
- 1.13 Reserved pins (RSVD)
- 1.14 Not connected pins (NC)
- 1.15 System features
- 1.15.1 Network indication
- 1.15.2 Antenna supervisor
- 1.15.3 Jamming detection
- 1.15.4 IP modes of operation
- 1.15.5 Dual stack IPv4/IPv6
- 1.15.6 TCP/IP and UDP/IP
- 1.15.7 FTP
- 1.15.8 HTTP
- 1.15.9 SSL / TLS
- 1.15.10 Bearer Independent Protocol
- 1.15.11 Wi-Fi integration
- 1.15.12 Firmware update Over AT (FOAT)
- 1.15.13 Firmware update Over The Air (FOTA)
- 1.15.14 Smart temperature management
- 1.15.15 SIM Access Profile (SAP)
- 1.15.16 Power saving
- 2 Design-in
- 2.1 Overview
- 2.2 Supply interfaces
- 2.2.1 Module supply (VCC or 3.3Vaux)
- 2.2.1.1 General guidelines for VCC or 3.3Vaux supply circuit selection and design
- 2.2.1.2 Guidelines for VCC or 3.3Vaux supply circuit design using a switching regulator
- 2.2.1.3 Guidelines for VCC or 3.3Vaux supply circuit design using a Low Drop-Out linear regulator
- 2.2.1.4 Guidelines for VCC supply circuit design using a rechargeable Li-Ion or Li-Pol battery
- 2.2.1.5 Guidelines for VCC supply circuit design using a primary (disposable) battery
- 2.2.1.6 Additional guidelines for VCC or 3.3Vaux supply circuit design
- 2.2.1.7 Guidelines for external battery charging circuit
- 2.2.1.8 Guidelines for external battery charging and power path management circuit
- 2.2.1.9 Guidelines for VCC or 3.3Vaux supply layout design
- 2.2.1.10 Guidelines for grounding layout design
- 2.2.2 RTC supply output (V_BCKP)
- 2.2.3 Generic digital interfaces supply output (V_INT)
- 2.2.1 Module supply (VCC or 3.3Vaux)
- 2.3 System functions interfaces
- 2.4 Antenna interface
- 2.5 SIM interface
- 2.6 Data communication interfaces
- 2.7 Audio interface
- 2.8 General Purpose Input/Output
- 2.9 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#)
- 2.10 Reserved pins (RSVD)
- 2.11 Module placement
- 2.12 TOBY-L2 series module footprint and paste mask
- 2.13 MPCI-L2 series module installation
- 2.14 Thermal guidelines
- 2.15 ESD guidelines
- 2.16 Schematic for TOBY-L2 and MPCI-L2 series module integration
- 2.17 Design-in checklist
- 3 Handling and soldering
- 4 Approvals
- 4.1 Product certification approval overview
- 4.2 US Federal Communications Commission notice
- 4.3 Innovation, Science and Economic Development Canada notice
- 4.4 Brazilian Anatel certification
- 4.5 European Conformance CE mark
- 4.6 Australian Regulatory Compliance Mark
- 4.7 Taiwanese NCC certification
- 4.8 Japanese Giteki certification
- 5 Product testing
- Appendix
- A Migration between TOBY-L1 and TOBY-L2
- B Glossary
- Related documents
- Revision history
- Contact
TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R26 Design-in
Page 99 of 162
2.5 SIM interface
SIM detection interface (GPIO5) is not available on the MPCI-L2 series modules.
SIM detection interface (GPIO5) is not supported by the TOBY-L2 modules “00”, “01” and “60” product
versions: the pin should not be driven by any external device.
2.5.1 Guidelines for SIM circuit design
Guidelines for SIM cards, SIM connectors and SIM chips selection
The ISO/IEC 7816, the ETSI TS 102 221 and the ETSI TS 102 671 specifications define the physical, electrical and
functional characteristics of Universal Integrated Circuit Cards (UICC), which contains the Subscriber Identification
Module (SIM) integrated circuit that securely stores all the information needed to identify and authenticate
subscribers over the LTE/3G/2G network.
Removable UICC / SIM card contacts mapping is defined by ISO/IEC 7816 and ETSI TS 102 221 as follows:
Contact C1 = VCC (Supply) It must be connected to VSIM or UIM_PWR
Contact C2 = RST (Reset) It must be connected to SIM_RST or UIM_RESET
Contact C3 = CLK (Clock) It must be connected to SIM_CLK or UIM_CLK
Contact C4 = AUX1 (Auxiliary contact) It must be left not connected
Contact C5 = GND (Ground) It must be connected to GND
Contact C6 = VPP (Programming supply) It can be left not connected
Contact C7 = I/O (Data input/output) It must be connected to SIM_IO or UIM_DATA
Contact C8 = AUX2 (Auxiliary contact) It must be left not connected
A removable SIM card can have 6 contacts (C1, C2, C3, C5, C6, C7) or 8 contacts, also including the auxiliary
contacts C4 and C8. Only 6 contacts are required and must be connected to the module SIM interface.
Removable SIM cards are suitable for applications requiring a change of SIM card during the product lifetime.
A SIM card holder can have 6 or 8 positions if a mechanical card presence detector is not provided, or it can have
6+2 or 8+2 positions if two additional pins relative to the normally-open mechanical switch integrated in the SIM
connector for the mechanical card presence detection are provided. Select a SIM connector providing 6+2 or 8+2
positions if the optional SIM detection feature (not available on MPCI-L2 series) is required by the custom
application, otherwise a connector without integrated mechanical presence switch can be selected.
Solderable UICC / SIM chip contact mapping (M2M UICC Form Factor) is defined by ETSI TS 102 671 as:
Case Pin 8 = UICC Contact C1 = VCC (Supply) It must be connected to VSIM or UIM_PWR
Case Pin 7 = UICC Contact C2 = RST (Reset) It must be connected to SIM_RST or UIM_RESET
Case Pin 6 = UICC Contact C3 = CLK (Clock) It must be connected to SIM_CLK or UIM_CLK
Case Pin 5 = UICC Contact C4 = AUX1 (Aux.contact) It must be left not connected
Case Pin 1 = UICC Contact C5 = GND (Ground) It must be connected to GND
Case Pin 2 = UICC Contact C6 = VPP (Progr. supply) It can be left not connected
Case Pin 3 = UICC Contact C7 = I/O (Data I/O) It must be connected to SIM_IO or UIM_DATA
Case Pin 4 = UICC Contact C8 = AUX2 (Aux. contact) It must be left not connected
A solderable SIM chip has 8 contacts and can also include the auxiliary contacts C4 and C8 for other uses, but only
6 contacts are required and must be connected to the module SIM card interface as described above.
Solderable SIM chips are suitable for M2M applications where it is not required to change the SIM once installed.