Integration Manual

Table Of Contents
TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R26 Contents
Page 7 of 162
2.15 ESD guidelines .............................................................................................................................. 127
2.15.1 ESD immunity test overview ...................................................................................................... 127
2.15.2 ESD immunity test of TOBY-L2 and MPCI-L2 series reference designs ........................................ 128
2.15.3 ESD application circuits .............................................................................................................. 128
2.16 Schematic for TOBY-L2 and MPCI-L2 series module integration .................................................... 130
2.16.1 Schematic for TOBY-L2 module “00” product version ............................................................... 130
2.16.2 Schematic for TOBY-L2 module “01” or “60” product versions ................................................ 131
2.16.3 Schematic for TOBY-L2 module “02”, “03” or “62” product versions ...................................... 132
2.16.4 Schematic for MPCI-L2 series ..................................................................................................... 133
2.17 Design-in checklist ........................................................................................................................ 134
2.17.1 Schematic checklist ................................................................................................................... 134
2.17.2 Layout checklist ......................................................................................................................... 135
2.17.3 Antenna checklist ...................................................................................................................... 135
3 Handling and soldering ........................................................................................... 136
3.1 Packaging, shipping, storage and moisture preconditioning .......................................................... 136
3.2 Handling ....................................................................................................................................... 136
3.3 Soldering ...................................................................................................................................... 137
3.3.1 Soldering paste ......................................................................................................................... 137
3.3.2 Reflow soldering ....................................................................................................................... 137
3.3.3 Optical inspection ...................................................................................................................... 138
3.3.4 Cleaning .................................................................................................................................... 138
3.3.5 Repeated reflow soldering ......................................................................................................... 139
3.3.6 Wave soldering ......................................................................................................................... 139
3.3.7 Hand soldering .......................................................................................................................... 139
3.3.8 Rework ...................................................................................................................................... 139
3.3.9 Conformal coating .................................................................................................................... 139
3.3.10 Casting ...................................................................................................................................... 139
3.3.11 Grounding metal covers ............................................................................................................ 139
3.3.12 Use of ultrasonic processes ........................................................................................................ 139
4 Approvals .................................................................................................................. 140
4.1 Product certification approval overview ......................................................................................... 140
4.2 US Federal Communications Commission notice ........................................................................... 141
4.2.1 Safety warnings review the structure ......................................................................................... 141
4.2.2 Declaration of Conformity ......................................................................................................... 141
4.2.3 Modifications ............................................................................................................................ 142
4.3 Innovation, Science and Economic Development Canada notice ................................................... 142
4.3.1 Declaration of Conformity ......................................................................................................... 143
4.3.2 Modifications ............................................................................................................................ 143
4.4 Brazilian Anatel certification .......................................................................................................... 145
4.5 European Conformance CE mark .................................................................................................. 146
4.6 Australian Regulatory Compliance Mark ....................................................................................... 147
4.7 Taiwanese NCC certification ......................................................................................................... 147
4.8 Japanese Giteki certification .......................................................................................................... 148