Integration Manual
Table Of Contents
- Preface
- Contents
- 1 System description
- 1.1 Overview
- 1.2 Architecture
- 1.3 Pin-out
- 1.4 Operating modes
- 1.5 Supply interfaces
- 1.5.1 Module supply input (VCC or 3.3Vaux)
- 1.5.1.1 VCC or 3.3Vaux supply requirements
- 1.5.1.2 VCC or 3.3Vaux current consumption in 2G connected-mode
- 1.5.1.3 VCC or 3.3Vaux current consumption in 3G connected mode
- 1.5.1.4 VCC or 3.3Vaux current consumption in LTE connected-mode
- 1.5.1.5 VCC or 3.3Vaux current consumption in cyclic idle/active mode (power saving enabled)
- 1.5.1.6 VCC or 3.3Vaux current consumption in fixed active-mode (power saving disabled)
- 1.5.2 RTC supply input/output (V_BCKP)
- 1.5.3 Generic digital interfaces supply output (V_INT)
- 1.5.1 Module supply input (VCC or 3.3Vaux)
- 1.6 System function interfaces
- 1.7 Antenna interface
- 1.8 SIM interface
- 1.9 Data communication interfaces
- 1.10 Audio
- 1.11 General Purpose Input/Output
- 1.12 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#)
- 1.13 Reserved pins (RSVD)
- 1.14 Not connected pins (NC)
- 1.15 System features
- 1.15.1 Network indication
- 1.15.2 Antenna supervisor
- 1.15.3 Jamming detection
- 1.15.4 IP modes of operation
- 1.15.5 Dual stack IPv4/IPv6
- 1.15.6 TCP/IP and UDP/IP
- 1.15.7 FTP
- 1.15.8 HTTP
- 1.15.9 SSL / TLS
- 1.15.10 Bearer Independent Protocol
- 1.15.11 Wi-Fi integration
- 1.15.12 Firmware update Over AT (FOAT)
- 1.15.13 Firmware update Over The Air (FOTA)
- 1.15.14 Smart temperature management
- 1.15.15 SIM Access Profile (SAP)
- 1.15.16 Power saving
- 2 Design-in
- 2.1 Overview
- 2.2 Supply interfaces
- 2.2.1 Module supply (VCC or 3.3Vaux)
- 2.2.1.1 General guidelines for VCC or 3.3Vaux supply circuit selection and design
- 2.2.1.2 Guidelines for VCC or 3.3Vaux supply circuit design using a switching regulator
- 2.2.1.3 Guidelines for VCC or 3.3Vaux supply circuit design using a Low Drop-Out linear regulator
- 2.2.1.4 Guidelines for VCC supply circuit design using a rechargeable Li-Ion or Li-Pol battery
- 2.2.1.5 Guidelines for VCC supply circuit design using a primary (disposable) battery
- 2.2.1.6 Additional guidelines for VCC or 3.3Vaux supply circuit design
- 2.2.1.7 Guidelines for external battery charging circuit
- 2.2.1.8 Guidelines for external battery charging and power path management circuit
- 2.2.1.9 Guidelines for VCC or 3.3Vaux supply layout design
- 2.2.1.10 Guidelines for grounding layout design
- 2.2.2 RTC supply output (V_BCKP)
- 2.2.3 Generic digital interfaces supply output (V_INT)
- 2.2.1 Module supply (VCC or 3.3Vaux)
- 2.3 System functions interfaces
- 2.4 Antenna interface
- 2.5 SIM interface
- 2.6 Data communication interfaces
- 2.7 Audio interface
- 2.8 General Purpose Input/Output
- 2.9 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#)
- 2.10 Reserved pins (RSVD)
- 2.11 Module placement
- 2.12 TOBY-L2 series module footprint and paste mask
- 2.13 MPCI-L2 series module installation
- 2.14 Thermal guidelines
- 2.15 ESD guidelines
- 2.16 Schematic for TOBY-L2 and MPCI-L2 series module integration
- 2.17 Design-in checklist
- 3 Handling and soldering
- 4 Approvals
- 4.1 Product certification approval overview
- 4.2 US Federal Communications Commission notice
- 4.3 Innovation, Science and Economic Development Canada notice
- 4.4 Brazilian Anatel certification
- 4.5 European Conformance CE mark
- 4.6 Australian Regulatory Compliance Mark
- 4.7 Taiwanese NCC certification
- 4.8 Japanese Giteki certification
- 5 Product testing
- Appendix
- A Migration between TOBY-L1 and TOBY-L2
- B Glossary
- Related documents
- Revision history
- Contact
TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R26 Contents
Page 6 of 162
1.15.4 IP modes of operation ................................................................................................................. 61
1.15.5 Dual stack IPv4/IPv6 ..................................................................................................................... 61
1.15.6 TCP/IP and UDP/IP ....................................................................................................................... 61
1.15.7 FTP .............................................................................................................................................. 61
1.15.8 HTTP ........................................................................................................................................... 62
1.15.9 SSL / TLS ...................................................................................................................................... 62
1.15.10 Bearer Independent Protocol ....................................................................................................... 63
1.15.11 Wi-Fi integration ......................................................................................................................... 64
1.15.12 Firmware update Over AT (FOAT) ................................................................................................ 64
1.15.13 Firmware update Over The Air (FOTA) ......................................................................................... 64
1.15.14 Smart temperature management................................................................................................. 65
1.15.15 SIM Access Profile (SAP) .............................................................................................................. 67
1.15.16 Power saving ............................................................................................................................... 69
2 Design-in ..................................................................................................................... 70
2.1 Overview ......................................................................................................................................... 70
2.2 Supply interfaces ............................................................................................................................. 71
2.2.1 Module supply (VCC or 3.3Vaux) ................................................................................................ 71
2.2.2 RTC supply output (V_BCKP) ....................................................................................................... 83
2.2.3 Generic digital interfaces supply output (V_INT) ........................................................................... 85
2.3 System functions interfaces ............................................................................................................. 86
2.3.1 Module power-on (PWR_ON) ...................................................................................................... 86
2.3.2 Module reset (RESET_N or PERST#) .............................................................................................. 87
2.3.3 Module configuration selection by host processor ....................................................................... 88
2.4 Antenna interface ........................................................................................................................... 89
2.4.1 Antenna RF interfaces (ANT1 / ANT2) .......................................................................................... 89
2.4.2 Antenna detection interface (ANT_DET) ...................................................................................... 97
2.5 SIM interface ................................................................................................................................... 99
2.5.1 Guidelines for SIM circuit design.................................................................................................. 99
2.5.2 Guidelines for SIM layout design ............................................................................................... 105
2.6 Data communication interfaces ..................................................................................................... 106
2.6.1 Universal Serial Bus (USB) .......................................................................................................... 106
2.6.2 Asynchronous serial interface (UART) ........................................................................................ 108
2.6.3 DDC (I
2
C) interface .................................................................................................................... 112
2.6.4 Secure Digital Input Output interface (SDIO) .............................................................................. 113
2.7 Audio interface ............................................................................................................................. 115
2.7.1 Digital audio interface ............................................................................................................... 115
2.8 General Purpose Input/Output ...................................................................................................... 119
2.9 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#) ................................................................ 120
2.10 Reserved pins (RSVD) .................................................................................................................... 121
2.11 Module placement ........................................................................................................................ 122
2.12 TOBY-L2 series module footprint and paste mask ......................................................................... 123
2.13 MPCI-L2 series module installation ................................................................................................ 124
2.14 Thermal guidelines ........................................................................................................................ 126