Integration Manual
Table Of Contents
- Preface
- Contents
- 1 System description
- 1.1 Overview
- 1.2 Architecture
- 1.3 Pin-out
- 1.4 Operating modes
- 1.5 Supply interfaces
- 1.5.1 Module supply input (VCC or 3.3Vaux)
- 1.5.1.1 VCC or 3.3Vaux supply requirements
- 1.5.1.2 VCC or 3.3Vaux current consumption in 2G connected-mode
- 1.5.1.3 VCC or 3.3Vaux current consumption in 3G connected mode
- 1.5.1.4 VCC or 3.3Vaux current consumption in LTE connected-mode
- 1.5.1.5 VCC or 3.3Vaux current consumption in cyclic idle/active mode (power saving enabled)
- 1.5.1.6 VCC or 3.3Vaux current consumption in fixed active-mode (power saving disabled)
- 1.5.2 RTC supply input/output (V_BCKP)
- 1.5.3 Generic digital interfaces supply output (V_INT)
- 1.5.1 Module supply input (VCC or 3.3Vaux)
- 1.6 System function interfaces
- 1.7 Antenna interface
- 1.8 SIM interface
- 1.9 Data communication interfaces
- 1.10 Audio
- 1.11 General Purpose Input/Output
- 1.12 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#)
- 1.13 Reserved pins (RSVD)
- 1.14 Not connected pins (NC)
- 1.15 System features
- 1.15.1 Network indication
- 1.15.2 Antenna supervisor
- 1.15.3 Jamming detection
- 1.15.4 IP modes of operation
- 1.15.5 Dual stack IPv4/IPv6
- 1.15.6 TCP/IP and UDP/IP
- 1.15.7 FTP
- 1.15.8 HTTP
- 1.15.9 SSL / TLS
- 1.15.10 Bearer Independent Protocol
- 1.15.11 Wi-Fi integration
- 1.15.12 Firmware update Over AT (FOAT)
- 1.15.13 Firmware update Over The Air (FOTA)
- 1.15.14 Smart temperature management
- 1.15.15 SIM Access Profile (SAP)
- 1.15.16 Power saving
- 2 Design-in
- 2.1 Overview
- 2.2 Supply interfaces
- 2.2.1 Module supply (VCC or 3.3Vaux)
- 2.2.1.1 General guidelines for VCC or 3.3Vaux supply circuit selection and design
- 2.2.1.2 Guidelines for VCC or 3.3Vaux supply circuit design using a switching regulator
- 2.2.1.3 Guidelines for VCC or 3.3Vaux supply circuit design using a Low Drop-Out linear regulator
- 2.2.1.4 Guidelines for VCC supply circuit design using a rechargeable Li-Ion or Li-Pol battery
- 2.2.1.5 Guidelines for VCC supply circuit design using a primary (disposable) battery
- 2.2.1.6 Additional guidelines for VCC or 3.3Vaux supply circuit design
- 2.2.1.7 Guidelines for external battery charging circuit
- 2.2.1.8 Guidelines for external battery charging and power path management circuit
- 2.2.1.9 Guidelines for VCC or 3.3Vaux supply layout design
- 2.2.1.10 Guidelines for grounding layout design
- 2.2.2 RTC supply output (V_BCKP)
- 2.2.3 Generic digital interfaces supply output (V_INT)
- 2.2.1 Module supply (VCC or 3.3Vaux)
- 2.3 System functions interfaces
- 2.4 Antenna interface
- 2.5 SIM interface
- 2.6 Data communication interfaces
- 2.7 Audio interface
- 2.8 General Purpose Input/Output
- 2.9 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#)
- 2.10 Reserved pins (RSVD)
- 2.11 Module placement
- 2.12 TOBY-L2 series module footprint and paste mask
- 2.13 MPCI-L2 series module installation
- 2.14 Thermal guidelines
- 2.15 ESD guidelines
- 2.16 Schematic for TOBY-L2 and MPCI-L2 series module integration
- 2.17 Design-in checklist
- 3 Handling and soldering
- 4 Approvals
- 4.1 Product certification approval overview
- 4.2 US Federal Communications Commission notice
- 4.3 Innovation, Science and Economic Development Canada notice
- 4.4 Brazilian Anatel certification
- 4.5 European Conformance CE mark
- 4.6 Australian Regulatory Compliance Mark
- 4.7 Taiwanese NCC certification
- 4.8 Japanese Giteki certification
- 5 Product testing
- Appendix
- A Migration between TOBY-L1 and TOBY-L2
- B Glossary
- Related documents
- Revision history
- Contact
TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R26 Design-in
Page 124 of 162
2.13 MPCI-L2 series module installation
MPCI-L2 series modules are fully compliant with the 52-pin PCI Express Full-Mini Card Type F2 form factor, i.e.,
top-side and bottom-side keep-out areas, 50.95 mm nominal length, 30 mm nominal width, and all the other
dimensions as defined by the PCI Express Mini Card Electromechanical Specification [16], except for the card
thickness (which nominal value is 3.7 mm), as described in Figure 70.
3.7 mm
Side View
Pin 1 Pin 51
ANT1ANT2
Top View
Hole GND HoleGND
30 mm
Pin 52 Pin 2
Bottom View
Hole GND HoleGND
50.95 mm
Figure 70: MPCI-L2 series mechanical description (top, side and bottom views)
MPCI-L2 series modules are fully compliant with the 52-pin PCI Express Full-Mini card edge type system connector
as defined by the PCI Express Mini Card Electromechanical Specification [16]. Table 50 describes some examples
of 52-pin mating system connectors for the MPCI-L2 series PCI Express Full-Mini card modules.
Manufacturer
Part Number
Description
JAE Electronics
MM60 series
52-circuit, 0.8 mm pitch, PCI Express Mini card edge female connector
Molex
67910 series
52-circuit, 0.8 mm pitch, PCI Express Mini card edge female connector
TE Connectivity / AMP
2041119 series
52-circuit, 0.8 mm pitch, PCI Express Mini card edge female connector
FCI
10123824 series
52-circuit, 0.8 mm pitch, PCI Express Mini card edge female connector
Table 50: MPCI-L2 series PCI Express Full-Mini card compatible connector
It is recommended to use the two mounting holes described in Figure 70 to fix (ground) the MPCI-L2 module
to the main ground of the application board with suitable screws and fasteners.
Follow the recommendations provided by the connector manufacturer and the guidelines available in the
PCI Express Mini Card Electromechanical Specification [16] for the development of the footprint (i.e. the
copper mask) PCB layout for the mating edge system connector. The exact geometries, distances and stencil
thicknesses should be adapted to the specific production processes (e.g. soldering etc.).
Follow the recommendations provided by the connector manufacturer to properly insert and remove the
MPCI-L2 series modules.