User's Manual
Table Of Contents
- Preface
- Contents
- 1 System description
- 1.1 Overview
- 1.2 Architecture
- 1.3 Pin-out
- 1.4 Operating modes
- 1.5 Supply interfaces
- 1.6 System function interfaces
- 1.7 Antenna interface
- 1.8 SIM interface
- 1.9 Serial interfaces
- 1.9.1 Asynchronous serial interface (UART)
- 1.9.1.1 UART features
- 1.9.1.2 UART AT interface configuration
- 1.9.1.3 UART signal behavior
- 1.9.1.4 UART and power-saving
- AT+UPSV=0: power saving disabled, fixed active-mode
- AT+UPSV=1: power saving enabled, cyclic idle/active-mode
- AT+UPSV=2: power saving enabled and controlled by the RTS line
- AT+UPSV=3: power saving enabled and controlled by the DTR line
- Wake up via data reception
- Additional considerations for SARA-U2 modules
- 1.9.1.5 Multiplexer protocol (3GPP 27.010)
- 1.9.2 Auxiliary asynchronous serial interface (UART AUX)
- 1.9.3 USB interface
- 1.9.4 DDC (I2C) interface
- 1.9.1 Asynchronous serial interface (UART)
- 1.10 Audio interface
- 1.11 General Purpose Input/Output (GPIO)
- 1.12 Reserved pins (RSVD)
- 1.13 System features
- 1.13.1 Network indication
- 1.13.2 Antenna detection
- 1.13.3 Jamming detection
- 1.13.4 TCP/IP and UDP/IP
- 1.13.5 FTP
- 1.13.6 HTTP
- 1.13.7 SMTP
- 1.13.8 SSL
- 1.13.9 Dual stack IPv4/IPv6
- 1.13.10 Smart temperature management
- 1.13.11 AssistNow clients and GNSS integration
- 1.13.12 Hybrid positioning and CellLocate®
- 1.13.13 Firmware upgrade Over AT (FOAT)
- 1.13.14 Firmware upgrade Over The Air (FOTA)
- 1.13.15 In-Band modem (eCall / ERA-GLONASS)
- 1.13.16 SIM Access Profile (SAP)
- 1.13.17 Power saving
- 2 Design-in
- 2.1 Overview
- 2.2 Supply interfaces
- 2.2.1 Module supply (VCC)
- 2.2.1.1 General guidelines for VCC supply circuit selection and design
- 2.2.1.2 Guidelines for VCC supply circuit design using a switching regulator
- 2.2.1.3 Guidelines for VCC supply circuit design using a Low Drop-Out (LDO) linear regulator
- 2.2.1.4 Guidelines for VCC supply circuit design using a rechargeable Li-Ion or Li-Pol battery
- 2.2.1.5 Guidelines for VCC supply circuit design using a primary (disposable) battery
- 2.2.1.6 Additional guidelines for VCC supply circuit design
- 2.2.1.7 Guidelines for external battery charging circuit
- 2.2.1.8 Guidelines for external battery charging and power path management circuit
- 2.2.1.9 Guidelines for VCC supply layout design
- 2.2.1.10 Guidelines for grounding layout design
- 2.2.2 RTC supply (V_BCKP)
- 2.2.3 Interface supply (V_INT)
- 2.2.1 Module supply (VCC)
- 2.3 System functions interfaces
- 2.4 Antenna interface
- 2.5 SIM interface
- 2.6 Serial interfaces
- 2.6.1 Asynchronous serial interface (UART)
- 2.6.1.1 Guidelines for UART circuit design
- Providing the full RS-232 functionality (using the complete V.24 link)
- Providing the TXD, RXD, RTS, CTS and DTR lines only (not using the complete V.24 link)
- Providing the TXD, RXD, RTS and CTS lines only (not using the complete V.24 link)
- Providing the TXD and RXD lines only (not using the complete V24 link)
- Additional considerations
- 2.6.1.2 Guidelines for UART layout design
- 2.6.1.1 Guidelines for UART circuit design
- 2.6.2 Auxiliary asynchronous serial interface (UART AUX)
- 2.6.3 Universal Serial Bus (USB)
- 2.6.4 DDC (I2C) interface
- 2.6.1 Asynchronous serial interface (UART)
- 2.7 Audio interface
- 2.7.1 Analog audio interface
- 2.7.1.1 Guidelines for microphone and speaker connection circuit design (headset / handset modes)
- 2.7.1.2 Guidelines for microphone and loudspeaker connection circuit design (hands-free mode)
- 2.7.1.3 Guidelines for external analog audio device connection circuit design
- 2.7.1.4 Guidelines for analog audio layout design
- 2.7.2 Digital audio interface
- 2.7.1 Analog audio interface
- 2.8 General Purpose Input/Output (GPIO)
- 2.9 Reserved pins (RSVD)
- 2.10 Module placement
- 2.11 Module footprint and paste mask
- 2.12 Thermal guidelines
- 2.13 ESD guidelines
- 2.14 SARA-G350 ATEX and SARA-U270 ATEX integration in explosive atmospheres applications
- 2.15 Schematic for SARA-G3 and SARA-U2 series module integration
- 2.16 Design-in checklist
- 3 Handling and soldering
- 4 Approvals
- 5 Product testing
- Appendix
- A Migration between LISA and SARA-G3 modules
- A.1 Overview
- A.2 Checklist for migration
- A.3 Software migration
- A.4 Hardware migration
- B Migration between SARA-G3 and SARA-U2
- C Glossary
- Related documents
- Revision history
- Contact
SARA-G3 and SARA-U2 series - System Integration Manual
2.2.1.6 Additional guidelines for VCC supply circuit design
To reduce voltage drops, use a low impedance power source. The resistance of the power supply lines
(connected to the VCC and GND pins of the module) on the application board and battery pack should also be
considered and minimized: cabling and routing must be as short as possible to minimize power losses.
Three pins are allocated for VCC supply. Another twenty pins are designated for GND connection. Even if all the
VCC pins and all the GND pins are internally connected within the module, it is recommended to properly
connect all of them to supply the module to minimize series resistance losses.
To avoid voltage drop undershoot and overshoot at the start and end of a transmit burst during a single-slot 2G
voice/data call (when current consumption on the VCC supply can rise up to the maximum peak / pulse current
specified in the SARA-G3 series Data Sheet [1] or in the SARA-U2 series Data Sheet [2]), place a bypass capacitor
with large capacitance (more than 100 µF) and low ESR near the VCC pins, for example:
• 330 µF capacitance, 45 mΩ ESR (e.g. KEMET T520D337M006ATE045, Tantalum Capacitor)
The use of very large capacitors (i.e. greater then 1000 µF) on the VCC line should be carefully evaluated, since
the voltage at the VCC pins voltage must ramp from 2.5 V to 3.2 V in less than 1 ms to switch on the SARA-U2
modules or in less than 4 ms to switch on the SARA-G3 modules by applying VCC supply, that otherwise can be
switched on by forcing a low level on the RESET_N pin during the VCC rising edge and then releasing the
RESET_N pin when the VCC supply voltage stabilizes at its proper nominal value.
To reduce voltage ripple and noise, especially if the application device integrates an internal antenna, place the
following bypass capacitors near the VCC pins:
• 100 nF capacitor (e.g Murata GRM155R61C104K) to filter digital logic noise from clocks and data sources
• 10 nF capacitor (e.g. Murata GRM155R71C103K) to filter digital logic noise from clocks and data sources
• 56 pF capacitor with Self-Resonant Frequency in 800/900 MHz range (e.g. Murata GRM1555C1E560J) to
filter transmission EMI in the GSM/EGSM bands
• 15 pF capacitor with Self-Resonant Frequency in 1800/1900 MHz range (e.g. Murata GRM1555C1E150J) to
filter transmission EMI in the DCS/PCS bands
A series ferrite bead for GHz band noise (e.g. Murata BLM18EG221SN1) can be placed close to the VCC pins of
the module for additional noise filtering, but in general it is not strictly required.
Figure 40 shows the complete configuration but the mounting of each single component depends on the
application design: it is recommended to provide all the VCC bypass capacitors as described in Figure 40
and Table 25 if the application device integrates an internal antenna.
C4
GND
C3 C2
SARA-G3 / SARA
-U2
52
VCC
53
VCC
51
VCC
3V8
C1
+
C5
Figure 40: Suggested schematic and layout design for the VCC bypass capacitors to reduce ripple / noise on VCC voltage profile
and to avoid undershoot / overshoot on VCC voltage drops
UBX-13000995 - R12 Early Production Information Design-in
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