User's Manual
Table Of Contents
- Preface
- Contents
- 1 System description
- 1.1 Overview
- 1.2 Architecture
- 1.3 Pin-out
- 1.4 Operating modes
- 1.5 Supply interfaces
- 1.6 System function interfaces
- 1.7 Antenna interface
- 1.8 SIM interface
- 1.9 Serial interfaces
- 1.9.1 Asynchronous serial interface (UART)
- 1.9.1.1 UART features
- 1.9.1.2 UART AT interface configuration
- 1.9.1.3 UART signal behavior
- 1.9.1.4 UART and power-saving
- AT+UPSV=0: power saving disabled, fixed active-mode
- AT+UPSV=1: power saving enabled, cyclic idle/active-mode
- AT+UPSV=2: power saving enabled and controlled by the RTS line
- AT+UPSV=3: power saving enabled and controlled by the DTR line
- Wake up via data reception
- Additional considerations for SARA-U2 modules
- 1.9.1.5 Multiplexer protocol (3GPP 27.010)
- 1.9.2 Auxiliary asynchronous serial interface (UART AUX)
- 1.9.3 USB interface
- 1.9.4 DDC (I2C) interface
- 1.9.1 Asynchronous serial interface (UART)
- 1.10 Audio interface
- 1.11 General Purpose Input/Output (GPIO)
- 1.12 Reserved pins (RSVD)
- 1.13 System features
- 1.13.1 Network indication
- 1.13.2 Antenna detection
- 1.13.3 Jamming detection
- 1.13.4 TCP/IP and UDP/IP
- 1.13.5 FTP
- 1.13.6 HTTP
- 1.13.7 SMTP
- 1.13.8 SSL
- 1.13.9 Dual stack IPv4/IPv6
- 1.13.10 Smart temperature management
- 1.13.11 AssistNow clients and GNSS integration
- 1.13.12 Hybrid positioning and CellLocateTM
- 1.13.13 Firmware upgrade Over AT (FOAT)
- 1.13.14 Firmware upgrade Over The Air (FOTA)
- 1.13.15 In-Band modem (eCall / ERA-GLONASS)
- 1.13.16 SIM Access Profile (SAP)
- 1.13.17 Power saving
- 2 Design-in
- 2.1 Overview
- 2.2 Supply interfaces
- 2.2.1 Module supply (VCC)
- 2.2.1.1 General guidelines for VCC supply circuit selection and design
- 2.2.1.2 Guidelines for VCC supply circuit design using a switching regulator
- 2.2.1.3 Guidelines for VCC supply circuit design using a Low Drop-Out (LDO) linear regulator
- 2.2.1.4 Guidelines for VCC supply circuit design using a rechargeable Li-Ion or Li-Pol battery
- 2.2.1.5 Guidelines for VCC supply circuit design using a primary (disposable) battery
- 2.2.1.6 Additional guidelines for VCC supply circuit design
- 2.2.1.7 Guidelines for external battery charging circuit
- 2.2.1.8 Guidelines for external battery charging and power path management circuit
- 2.2.1.9 Guidelines for VCC supply layout design
- 2.2.1.10 Guidelines for grounding layout design
- 2.2.2 RTC supply (V_BCKP)
- 2.2.3 Interface supply (V_INT)
- 2.2.1 Module supply (VCC)
- 2.3 System functions interfaces
- 2.4 Antenna interface
- 2.5 SIM interface
- 2.6 Serial interfaces
- 2.6.1 Asynchronous serial interface (UART)
- 2.6.1.1 Guidelines for UART circuit design
- Providing the full RS-232 functionality (using the complete V.24 link)
- Providing the TXD, RXD, RTS, CTS and DTR lines only (not using the complete V.24 link)
- Providing the TXD, RXD, RTS and CTS lines only (not using the complete V.24 link)
- Providing the TXD and RXD lines only (not using the complete V24 link)
- Additional considerations
- 2.6.1.2 Guidelines for UART layout design
- 2.6.1.1 Guidelines for UART circuit design
- 2.6.2 Auxiliary asynchronous serial interface (UART AUX)
- 2.6.3 Universal Serial Bus (USB)
- 2.6.4 DDC (I2C) interface
- 2.6.1 Asynchronous serial interface (UART)
- 2.7 Audio interface
- 2.7.1 Analog audio interface
- 2.7.1.1 Guidelines for microphone and speaker connection circuit design (headset / handset modes)
- 2.7.1.2 Guidelines for microphone and loudspeaker connection circuit design (hands-free mode)
- 2.7.1.3 Guidelines for external analog audio device connection circuit design
- 2.7.1.4 Guidelines for analog audio layout design
- 2.7.2 Digital audio interface
- 2.7.1 Analog audio interface
- 2.8 General Purpose Input/Output (GPIO)
- 2.9 Reserved pins (RSVD)
- 2.10 Module placement
- 2.11 Module footprint and paste mask
- 2.12 Thermal guidelines
- 2.13 ESD guidelines
- 2.14 SARA-G350 ATEX integration in explosive atmospheres applications
- 2.15 Schematic for SARA-G3 and SARA-U2 series module integration
- 2.16 Design-in checklist
- 3 Handling and soldering
- 4 Approvals
- 5 Product testing
- Appendix
- A Migration between LISA and SARA-G3 modules
- A.1 Overview
- A.2 Checklist for migration
- A.3 Software migration
- A.4 Hardware migration
- B Migration between SARA-G3 and SARA-U2
- C Glossary
- Related documents
- Revision history
- Contact
SARA-G3 and SARA-U2 series - System Integration Manual
UBX-13000995 - R08 Objective Specification Contents
Page 6 of 188
2.13.2 ESD immunity test of u-blox SARA-G3 and SARA-U2 reference designs..................................... 143
2.13.3 ESD application circuits .............................................................................................................. 144
2.14 SARA-G350 ATEX integration in explosive atmospheres applications ............................................ 146
2.14.1 General guidelines ..................................................................................................................... 146
2.14.2 Guidelines for VCC supply circuit design ................................................................................... 147
2.14.3 Guidelines for antenna RF interface design ................................................................................ 148
2.15 Schematic for SARA-G3 and SARA-U2 series module integration .................................................. 149
2.15.1 Schematic for SARA-G300 / SARA-G310 modules integration ................................................... 149
2.15.2 Schematic for SARA-G340 / SARA-G350 modules integration ................................................... 150
2.15.3 Schematic for SARA-U2 series modules integration ................................................................... 151
2.16 Design-in checklist ........................................................................................................................ 152
2.16.1 Schematic checklist ................................................................................................................... 152
2.16.2 Layout checklist ......................................................................................................................... 153
2.16.3 Antenna checklist ...................................................................................................................... 153
3 Handling and soldering ........................................................................................... 154
3.1 Packaging, shipping, storage and moisture preconditioning ............................................................. 154
3.2 Handling ........................................................................................................................................... 154
3.3 Soldering .......................................................................................................................................... 155
3.3.1 Soldering paste.......................................................................................................................... 155
3.3.2 Reflow soldering ....................................................................................................................... 155
3.3.3 Optical inspection ...................................................................................................................... 156
3.3.4 Cleaning .................................................................................................................................... 156
3.3.5 Repeated reflow soldering ......................................................................................................... 157
3.3.6 Wave soldering.......................................................................................................................... 157
3.3.7 Hand soldering .......................................................................................................................... 157
3.3.8 Rework ...................................................................................................................................... 157
3.3.9 Conformal coating .................................................................................................................... 157
3.3.10 Casting ...................................................................................................................................... 157
3.3.11 Grounding metal covers ............................................................................................................ 157
3.3.12 Use of ultrasonic processes ........................................................................................................ 157
4 Approvals .................................................................................................................. 158
4.1 Product certification approval overview ............................................................................................. 158
4.2 Federal Communications Commission and Industry Canada notice ................................................... 159
4.2.1 Safety warnings review the structure ......................................................................................... 159
4.2.2 Declaration of conformity – United States only .......................................................................... 159
4.2.3 Modifications ............................................................................................................................ 160
4.3 R&TTED and European conformance CE mark .................................................................................. 161
4.4 Anatel certification ........................................................................................................................... 162
4.5 SARA-G350 ATEX conformance for use in explosive atmospheres .................................................... 163
5 Product testing ......................................................................................................... 164
5.1 u-blox in-series production test ......................................................................................................... 164
5.2 Test parameters for OEM manufacturer ............................................................................................ 164