User's Manual
Table Of Contents
- Preface
- Contents
- 1 System description
- 1.1 Overview
- 1.2 Architecture
- 1.3 Pin-out
- 1.4 Operating modes
- 1.5 Supply interfaces
- 1.6 System function interfaces
- 1.7 Antenna interface
- 1.8 SIM interface
- 1.9 Serial interfaces
- 1.9.1 Asynchronous serial interface (UART)
- 1.9.1.1 UART features
- 1.9.1.2 UART AT interface configuration
- 1.9.1.3 UART signal behavior
- 1.9.1.4 UART and power-saving
- AT+UPSV=0: power saving disabled, fixed active-mode
- AT+UPSV=1: power saving enabled, cyclic idle/active-mode
- AT+UPSV=2: power saving enabled and controlled by the RTS line
- AT+UPSV=3: power saving enabled and controlled by the DTR line
- Wake up via data reception
- Additional considerations for SARA-U2 modules
- 1.9.1.5 Multiplexer protocol (3GPP 27.010)
- 1.9.2 Auxiliary asynchronous serial interface (UART AUX)
- 1.9.3 USB interface
- 1.9.4 DDC (I2C) interface
- 1.9.1 Asynchronous serial interface (UART)
- 1.10 Audio interface
- 1.11 General Purpose Input/Output (GPIO)
- 1.12 Reserved pins (RSVD)
- 1.13 System features
- 1.13.1 Network indication
- 1.13.2 Antenna detection
- 1.13.3 Jamming detection
- 1.13.4 TCP/IP and UDP/IP
- 1.13.5 FTP
- 1.13.6 HTTP
- 1.13.7 SMTP
- 1.13.8 SSL
- 1.13.9 Dual stack IPv4/IPv6
- 1.13.10 Smart temperature management
- 1.13.11 AssistNow clients and GNSS integration
- 1.13.12 Hybrid positioning and CellLocateTM
- 1.13.13 Firmware upgrade Over AT (FOAT)
- 1.13.14 Firmware upgrade Over The Air (FOTA)
- 1.13.15 In-Band modem (eCall / ERA-GLONASS)
- 1.13.16 SIM Access Profile (SAP)
- 1.13.17 Power saving
- 2 Design-in
- 2.1 Overview
- 2.2 Supply interfaces
- 2.2.1 Module supply (VCC)
- 2.2.1.1 General guidelines for VCC supply circuit selection and design
- 2.2.1.2 Guidelines for VCC supply circuit design using a switching regulator
- 2.2.1.3 Guidelines for VCC supply circuit design using a Low Drop-Out (LDO) linear regulator
- 2.2.1.4 Guidelines for VCC supply circuit design using a rechargeable Li-Ion or Li-Pol battery
- 2.2.1.5 Guidelines for VCC supply circuit design using a primary (disposable) battery
- 2.2.1.6 Additional guidelines for VCC supply circuit design
- 2.2.1.7 Guidelines for external battery charging circuit
- 2.2.1.8 Guidelines for external battery charging and power path management circuit
- 2.2.1.9 Guidelines for VCC supply layout design
- 2.2.1.10 Guidelines for grounding layout design
- 2.2.2 RTC supply (V_BCKP)
- 2.2.3 Interface supply (V_INT)
- 2.2.1 Module supply (VCC)
- 2.3 System functions interfaces
- 2.4 Antenna interface
- 2.5 SIM interface
- 2.6 Serial interfaces
- 2.6.1 Asynchronous serial interface (UART)
- 2.6.1.1 Guidelines for UART circuit design
- Providing the full RS-232 functionality (using the complete V.24 link)
- Providing the TXD, RXD, RTS, CTS and DTR lines only (not using the complete V.24 link)
- Providing the TXD, RXD, RTS and CTS lines only (not using the complete V.24 link)
- Providing the TXD and RXD lines only (not using the complete V24 link)
- Additional considerations
- 2.6.1.2 Guidelines for UART layout design
- 2.6.1.1 Guidelines for UART circuit design
- 2.6.2 Auxiliary asynchronous serial interface (UART AUX)
- 2.6.3 Universal Serial Bus (USB)
- 2.6.4 DDC (I2C) interface
- 2.6.1 Asynchronous serial interface (UART)
- 2.7 Audio interface
- 2.7.1 Analog audio interface
- 2.7.1.1 Guidelines for microphone and speaker connection circuit design (headset / handset modes)
- 2.7.1.2 Guidelines for microphone and loudspeaker connection circuit design (hands-free mode)
- 2.7.1.3 Guidelines for external analog audio device connection circuit design
- 2.7.1.4 Guidelines for analog audio layout design
- 2.7.2 Digital audio interface
- 2.7.1 Analog audio interface
- 2.8 General Purpose Input/Output (GPIO)
- 2.9 Reserved pins (RSVD)
- 2.10 Module placement
- 2.11 Module footprint and paste mask
- 2.12 Thermal guidelines
- 2.13 ESD guidelines
- 2.14 SARA-G350 ATEX integration in explosive atmospheres applications
- 2.15 Schematic for SARA-G3 and SARA-U2 series module integration
- 2.16 Design-in checklist
- 3 Handling and soldering
- 4 Approvals
- 5 Product testing
- Appendix
- A Migration between LISA and SARA-G3 modules
- A.1 Overview
- A.2 Checklist for migration
- A.3 Software migration
- A.4 Hardware migration
- B Migration between SARA-G3 and SARA-U2
- C Glossary
- Related documents
- Revision history
- Contact
SARA-G3 and SARA-U2 series - System Integration Manual
UBX-13000995 - R08 Objective Specification Product testing
Page 164 of 188
5 Product testing
5.1 u-blox in-series production test
u-blox focuses on high quality for its products. All units produced are fully tested. Defective units are analyzed in
detail to improve the production quality.
This is achieved with automatic test equipment, which delivers a detailed test report for each unit. The following
measurements are done:
Digital self-test (firmware download, Flash firmware verification, IMEI programming)
Measurement of voltages and currents
Adjustment of ADC measurement interfaces
Functional tests (Serial interface communication, analog audio interface, real time clock, temperature sensor,
antenna detection, SIM card communication)
Digital tests (GPIOs, digital interfaces)
Measurement and calibration of RF characteristics in all supported bands (Receiver S/N verification, frequency
tuning of reference clock, calibration of transmitter and receiver power levels)
Verification of RF characteristics after calibration (modulation accuracy, power levels and spectrum
performance are checked to be within tolerances when calibration parameters are applied)
Figure 88: Automatic test equipment for module tests
5.2 Test parameters for OEM manufacturer
Because of the testing done by u-blox (with 100% coverage), an OEM manufacturer does not need to repeat
firmware tests or measurements of the module RF performance or tests over analog and digital interfaces in their
production test.
An OEM manufacturer should focus on:
Module assembly on the device; it should be verified that:
o Soldering and handling process did not damaged the module components
o All module pins are well soldered on device board
o There are no short circuits between pins