Integration Manual
Table Of Contents
- Document information
- Contents
- 1 System description
- 1.1 Overview
- 1.2 Applications
- 1.3 Architecture
- 1.4 Pin assignments
- 1.5 Supply interfaces
- 1.6 System function interfaces
- 1.7 Debug
- 1.8 GPIO pins
- 1.9 Analog interfaces
- 1.10 Serial interfaces
- 1.10.1 Universal Asynchronous Receiver/Transmitter (UART)
- 1.10.2 Serial Peripheral Interface (SPI)
- 1.10.3 Quad Serial Peripheral Interface (QSPI)
- 1.10.4 Inter-Integrated Circuit (I2C) interface
- 1.10.5 Pulse Width Modulation (PWM) interface
- 1.10.6 Inter-IC Sound (I2S) interface
- 1.10.7 Pulse Density Modulation (PDM) interface
- 1.10.8 USB 2.0 device interface
- 1.11 Antenna interface
- 1.12 Reserved pins (RSVD)
- 1.13 GND pins
- 2 Software
- 3 Flashing application software
- 4 Design-in
- 5 Handling and soldering
- 6 Regulatory information and requirements
- 6.1 ETSI – European market
- 6.2 FCC/ISED – US/Canadian markets
- 6.3 MIC - Japanese market (pending)
- 6.4 NCC – Taiwanese market (pending)
- 6.5 KCC – South Korean market (pending)
- 6.6 ANATEL Brazil compliance (pending)
- 6.7 Australia and New Zealand regulatory compliance (pending)
- 6.8 South Africa regulatory compliance (pending)
- 6.9 Integration checklist
- 6.10 Pre-approved antennas list
- 7 Technology standards compliance
- 8 Product testing
- Appendix
- A Glossary
- B Antenna reference designs
- Related documents
- Revision history
- Contact
NORA-B1 series - System integration manual
UBX-20027617 - R04 Handling and soldering Page 40 of 61
C1-Public
• Cleaning with alcohol or other organic solvents can result in soldering flux residues flooding into
the housing, an area that is not accessible for post-wash inspections. The solvent will also
damage the sticker and the inkjet printed text.
• Ultrasonic cleaning will permanently damage the module, in particular the crystal oscillators.
For best results, use a "no clean" soldering paste and eliminate the cleaning step after the soldering
process.
5.3.3 Other remarks
• Only a single reflow soldering process is allowed for boards with a module populated on them.
• Boards with combined through-hole technology (THT) components and surface-mount
technology (SMT) devices may require wave soldering to solder the THT components. Only a
single wave soldering process is allowed for boards populated with the modules. The Miniature
Wave Selective Solder process is preferred over the traditional wave soldering process.
• Hand soldering is not recommended.
• Rework is not recommended.
• Conformal coating may affect the performance of the module, so it is important to prevent the
liquid from flowing into the module. The RF shields do not provide protection for the module from
coating liquids with low viscosity, and so care is required in applying the coating. Conformal
coating of the module will void the warranty.
• Grounding metal covers: attempts to improve grounding by soldering ground cables, wick or
other forms of metal strips directly onto the EMI covers is made at the customer’s own risk and
will void the module’s warranty. The numerous ground pins are adequate to provide optimal
immunity to interferences.
• Take care when handling the NORA-B1. Applying force to the module might damage the RF
shield.
• The module contains components that are sensitive to ultrasonic waves. Use of any ultrasonic
processes such as cleaning, welding etc., may damage the module. Use of ultrasonic processes
on an end-product integrating this module will void the warranty.