Integration Manual
Table Of Contents
- Document information
- Contents
- 1 System description
- 1.1 Overview
- 1.2 Applications
- 1.3 Architecture
- 1.4 Pin assignments
- 1.5 Supply interfaces
- 1.6 System function interfaces
- 1.7 Debug
- 1.8 GPIO pins
- 1.9 Analog interfaces
- 1.10 Serial interfaces
- 1.10.1 Universal Asynchronous Receiver/Transmitter (UART)
- 1.10.2 Serial Peripheral Interface (SPI)
- 1.10.3 Quad Serial Peripheral Interface (QSPI)
- 1.10.4 Inter-Integrated Circuit (I2C) interface
- 1.10.5 Pulse Width Modulation (PWM) interface
- 1.10.6 Inter-IC Sound (I2S) interface
- 1.10.7 Pulse Density Modulation (PDM) interface
- 1.10.8 USB 2.0 device interface
- 1.11 Antenna interface
- 1.12 Reserved pins (RSVD)
- 1.13 GND pins
- 2 Software
- 3 Flashing application software
- 4 Design-in
- 5 Handling and soldering
- 6 Regulatory information and requirements
- 6.1 ETSI – European market
- 6.2 FCC/ISED – US/Canadian markets
- 6.3 MIC - Japanese market (pending)
- 6.4 NCC – Taiwanese market (pending)
- 6.5 KCC – South Korean market (pending)
- 6.6 ANATEL Brazil compliance (pending)
- 6.7 Australia and New Zealand regulatory compliance (pending)
- 6.8 South Africa regulatory compliance (pending)
- 6.9 Integration checklist
- 6.10 Pre-approved antennas list
- 7 Technology standards compliance
- 8 Product testing
- Appendix
- A Glossary
- B Antenna reference designs
- Related documents
- Revision history
- Contact
NORA-B1 series - System integration manual
UBX-20027617 - R04 Contents Page 4 of 61
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1.12 Reserved pins (RSVD) ..............................................................................................................................16
1.13 GND pins .....................................................................................................................................................16
2 Software ................................................................................................................................................ 17
2.1 Nordic Semiconductor nRF Connect SDK............................................................................................17
2.1.1 Toolchain Manager ...........................................................................................................................17
2.1.2 Documentation – nRF Connect SDK .............................................................................................17
2.1.3 Support – Nordic Semiconductor DevZone development forum ............................................17
2.1.4 Example code .....................................................................................................................................18
2.2 Bluetooth device (MAC) address and other production data ..........................................................19
3 Flashing application software ........................................................................................................ 22
3.1 SWD interface ............................................................................................................................................22
3.2 Readback protection ................................................................................................................................22
3.3 Recovery ......................................................................................................................................................22
3.4 Programming .............................................................................................................................................22
4 Design-in ................................................................................................................................................ 24
4.1 Overview ......................................................................................................................................................24
4.2 Design for NORA family ...........................................................................................................................24
4.3 Antenna interface .....................................................................................................................................24
4.3.1 RF transmission line design (NORA-B101 only) .........................................................................25
4.3.2 Antenna design (NORA-B101 only)...............................................................................................27
4.3.3 On-board antenna (NORA-B106 only) ..........................................................................................30
4.4 Supply interfaces ......................................................................................................................................31
4.4.1 Module supply design ......................................................................................................................31
4.5 Debug interface .........................................................................................................................................31
4.6 Serial interfaces ........................................................................................................................................32
4.6.1 UART ...................................................................................................................................................32
4.6.2 USB ......................................................................................................................................................32
4.6.3 SPI, QSPI, I2C, I2S, PDM ..................................................................................................................33
4.7 NFC interface .............................................................................................................................................33
4.8 General high-speed layout guidelines ...................................................................................................34
4.8.1 General considerations for schematic design and PCB floor-planning .................................34
4.8.2 Module placement ............................................................................................................................35
4.8.3 Layout and manufacturing .............................................................................................................36
4.9 Module footprint and paste mask .........................................................................................................36
4.10 Thermal guidelines ...................................................................................................................................36
4.11 ESD guidelines ...........................................................................................................................................36
5 Handling and soldering ..................................................................................................................... 38
5.1 Packaging, shipping, storage, and moisture preconditioning .........................................................38
5.2 Handling ......................................................................................................................................................38
5.3 Soldering .....................................................................................................................................................38
5.3.1 Reflow soldering process ................................................................................................................38
5.3.2 Cleaning ..............................................................................................................................................39