Integration Manual
Table Of Contents
- Document Information
- Contents
- 1 System description
- 1.1 Overview
- 1.2 Architecture
- 1.3 Pin-out
- 1.4 Operating modes
- 1.5 Power management
- 1.6 System functions
- 1.7 RF connection
- 1.8 (U)SIM interface
- 1.9 Serial communication
- 1.9.1 Serial interfaces configuration
- 1.9.2 Asynchronous serial interface (UART)
- 1.9.2.1 UART features
- 1.9.2.2 UART signal behavior
- 1.9.2.3 UART and power-saving
- 1.9.2.4 UART application circuits
- Providing the full RS-232 functionality (using the complete V.24 link)
- Providing the TxD, RxD, RTS, CTS and DTR lines only (not using the complete V.24 link)
- Providing the TxD, RxD, RTS and CTS lines only (not using the complete V.24 link)
- Providing the TxD and RxD lines only (not using the complete V24 link)
- Additional considerations
- 1.9.3 USB interface
- 1.9.4 SPI interface
- 1.9.5 MUX protocol (3GPP TS 27.010)
- 1.10 DDC (I2C) interface
- 1.11 Audio Interface
- 1.12 General Purpose Input/Output (GPIO)
- 1.13 Reserved pins (RSVD)
- 1.14 Schematic for LISA-U2 module integration
- 1.15 Approvals
- 1.15.1 European Conformance CE mark
- 1.15.2 US Federal Communications Commission notice
- 1.15.3 Innovation, Science, Economic Development Canada notice
- 1.15.4 Australian Regulatory Compliance Mark
- 1.15.5 ICASA Certification
- 1.15.6 KCC Certification
- 1.15.7 ANATEL Certification
- 1.15.8 CCC Certification
- 1.15.9 Giteki Certification
- 2 Design-In
- 3 Features description
- 3.1 Network indication
- 3.2 Antenna detection
- 3.3 Jamming Detection
- 3.4 TCP/IP and UDP/IP
- 3.5 FTP
- 3.6 HTTP
- 3.7 SSL/TLS
- 3.8 Dual stack IPv4/IPv6
- 3.9 AssistNow clients and GNSS integration
- 3.10 Hybrid positioning and CellLocate®
- 3.11 Control Plane Aiding / Location Services (LCS)
- 3.12 Firmware update Over AT (FOAT)
- 3.13 Firmware update Over the Air (FOTA)
- 3.14 In-Band modem (eCall / ERA-GLONASS)
- 3.15 SIM Access Profile (SAP)
- 3.16 Smart Temperature Management
- 3.17 Bearer Independent Protocol
- 3.18 Multi-Level Precedence and Pre-emption Service
- 3.19 Network Friendly Mode
- 3.20 Power saving
- 4 Handling and soldering
- 5 Product Testing
- Appendix
- A Migration from LISA-U1 to LISA-U2 series
- A.1 Checklist for migration
- A.2 Software migration
- A.2.1 Software migration from LISA-U1 series to LISA-U2 series modules
- A.3 Hardware migration
- A.3.1 Hardware migration from LISA-U1 series to LISA-U2 series modules
- A.3.2 Pin-out comparison LISA-U1 series vs. LISA-U2 series
- A.3.3 Layout comparison LISA-U1 series vs. LISA-U2 series
- B Glossary
- Related documents
- Revision history
- Contact
LISA-U2 series - System Integration Manual
UBX-13001118 - R25 Contents Page 6 of 182
3.16 Smart Temperature Management ...................................................................................................... 154
3.16.1 Smart Temperature Supervisor (STS) ....................................................................................... 154
3.16.2 Threshold definitions ..................................................................................................................... 155
3.17 Bearer Independent Protocol ................................................................................................................ 156
3.18 Multi-Level Precedence and Pre-emption Service ........................................................................... 156
3.19 Network Friendly Mode .......................................................................................................................... 156
3.20 Power saving ............................................................................................................................................ 157
4 Handling and soldering .................................................................................................................... 158
4.1 Packaging, shipping, storage and moisture preconditioning ........................................................ 158
4.2 Soldering ................................................................................................................................................... 158
4.2.1 Soldering paste ............................................................................................................................... 158
4.2.2 Reflow soldering .............................................................................................................................. 158
4.2.3 Optical inspection ........................................................................................................................... 160
4.2.4 Cleaning ............................................................................................................................................ 160
4.2.5 Repeated reflow soldering ............................................................................................................ 160
4.2.6 Wave soldering ................................................................................................................................ 160
4.2.7 Hand soldering ................................................................................................................................ 160
4.2.8 Rework ............................................................................................................................................... 161
4.2.9 Conformal coating ........................................................................................................................... 161
4.2.10 Casting ............................................................................................................................................... 161
4.2.11 Grounding metal covers ................................................................................................................. 161
4.2.12 Use of ultrasonic processes .......................................................................................................... 161
5 Product Testing .................................................................................................................................. 162
5.1 u-blox in-series production test ........................................................................................................... 162
5.2 Test parameters for OEM manufacturer ........................................................................................... 163
5.2.1 ‘Go/No go’ tests for integrated devices ...................................................................................... 163
5.2.2 Functional tests providing RF operation ................................................................................... 163
Appendix ...................................................................................................................................................... 166
A Migration from LISA-U1 to LISA-U2 series ............................................................................... 166
A.1 Checklist for migration .......................................................................................................................... 166
A.2 Software migration ................................................................................................................................. 167
A.2.1 Software migration from LISA-U1 series to LISA-U2 series modules.................................. 167
A.3 Hardware migration ................................................................................................................................ 167
A.3.1 Hardware migration from LISA-U1 series to LISA-U2 series modules ................................. 167
A.3.2 Pin-out comparison LISA-U1 series vs. LISA-U2 series ........................................................... 169
A.3.3 Layout comparison LISA-U1 series vs. LISA-U2 series ............................................................ 177
B Glossary ................................................................................................................................................ 178
Related documents ................................................................................................................................. 180
Revision history ......................................................................................................................................... 181
Contact ......................................................................................................................................................... 182