Integration Manual
Table Of Contents
- Document Information
- Contents
- 1 System description
- 1.1 Overview
- 1.2 Architecture
- 1.3 Pin-out
- 1.4 Operating modes
- 1.5 Power management
- 1.6 System functions
- 1.7 RF connection
- 1.8 (U)SIM interface
- 1.9 Serial communication
- 1.9.1 Serial interfaces configuration
- 1.9.2 Asynchronous serial interface (UART)
- 1.9.2.1 UART features
- 1.9.2.2 UART signal behavior
- 1.9.2.3 UART and power-saving
- 1.9.2.4 UART application circuits
- Providing the full RS-232 functionality (using the complete V.24 link)
- Providing the TxD, RxD, RTS, CTS and DTR lines only (not using the complete V.24 link)
- Providing the TxD, RxD, RTS and CTS lines only (not using the complete V.24 link)
- Providing the TxD and RxD lines only (not using the complete V24 link)
- Additional considerations
- 1.9.3 USB interface
- 1.9.4 SPI interface
- 1.9.5 MUX protocol (3GPP TS 27.010)
- 1.10 DDC (I2C) interface
- 1.11 Audio Interface
- 1.12 General Purpose Input/Output (GPIO)
- 1.13 Reserved pins (RSVD)
- 1.14 Schematic for LISA-U2 module integration
- 1.15 Approvals
- 1.15.1 European Conformance CE mark
- 1.15.2 US Federal Communications Commission notice
- 1.15.3 Innovation, Science, Economic Development Canada notice
- 1.15.4 Australian Regulatory Compliance Mark
- 1.15.5 ICASA Certification
- 1.15.6 KCC Certification
- 1.15.7 ANATEL Certification
- 1.15.8 CCC Certification
- 1.15.9 Giteki Certification
- 2 Design-In
- 3 Features description
- 3.1 Network indication
- 3.2 Antenna detection
- 3.3 Jamming Detection
- 3.4 TCP/IP and UDP/IP
- 3.5 FTP
- 3.6 HTTP
- 3.7 SSL/TLS
- 3.8 Dual stack IPv4/IPv6
- 3.9 AssistNow clients and GNSS integration
- 3.10 Hybrid positioning and CellLocate®
- 3.11 Control Plane Aiding / Location Services (LCS)
- 3.12 Firmware update Over AT (FOAT)
- 3.13 Firmware update Over the Air (FOTA)
- 3.14 In-Band modem (eCall / ERA-GLONASS)
- 3.15 SIM Access Profile (SAP)
- 3.16 Smart Temperature Management
- 3.17 Bearer Independent Protocol
- 3.18 Multi-Level Precedence and Pre-emption Service
- 3.19 Network Friendly Mode
- 3.20 Power saving
- 4 Handling and soldering
- 5 Product Testing
- Appendix
- A Migration from LISA-U1 to LISA-U2 series
- A.1 Checklist for migration
- A.2 Software migration
- A.2.1 Software migration from LISA-U1 series to LISA-U2 series modules
- A.3 Hardware migration
- A.3.1 Hardware migration from LISA-U1 series to LISA-U2 series modules
- A.3.2 Pin-out comparison LISA-U1 series vs. LISA-U2 series
- A.3.3 Layout comparison LISA-U1 series vs. LISA-U2 series
- B Glossary
- Related documents
- Revision history
- Contact
LISA-U2 series - System Integration Manual
UBX-13001118 - R25 System description Page 49 of 182
1.8.1.3 Single SIM chip
A solderable SIM chip (M2M UICC form factor) must be connected the SIM card interface of LISA-U2
modules as described in Figure 22 when the optional SIM detection feature is not implemented (see
the circuit described in Figure 23 if the SIM detection feature is required).
Follow these guidelines connecting the module to a solderable SIM chip without SIM presence
detection:
Connect the UICC / SIM contacts C1 (VCC) to the VSIM pin of the module
Connect the UICC / SIM contact C7 (I/O) to the SIM_IO pin of the module
Connect the UICC / SIM contact C3 (CLK) to the SIM_CLK pin of the module
Connect the UICC / SIM contact C2 (RST) to the SIM_RST pin of the module
Connect the UICC / SIM contact C5 (GND) to ground
Provide a 100 nF bypass capacitor (e.g. Murata GRM155R71C104K) at the SIM supply line (VSIM)
close to the specific pad of the SIM chip, to prevent digital noise
Provide a bypass capacitor of about 22 pF to 47 pF (e.g. Murata GRM1555C1H330J) on each SIM
line (VSIM, SIM_CLK, SIM_IO, SIM_RST), to prevent RF coupling especially in case the RF antenna
is placed closer than 10 - 30 cm from the SIM card holder
Limit capacitance and series resistance on each SIM signal (SIM_CLK, SIM_IO, SIM_RST) to
match the requirements for the SIM interface (27.7 ns is the maximum allowed rise time on the
SIM_CLK line, 1.0 µ s is the maximum allowed rise time on the SIM_IO and SIM_RST lines)
LISA-U2 series
50
VSIM
48
SIM_IO
47
SIM_CLK
49
SIM_RST
4
V_INT
51
GPIO5
SIM CHIP
SIM Chip
Bottom View
(contacts side)
C1
VPP (C6)
VCC (C1)
IO (C7)
CLK (C3)
RST (C2)
GND (C5)
C2 C3 C5
U1
C4
2
8
3
6
7
1
C1 C5
C2 C6
C3 C7
C4 C8
8
7
6
5
1
2
3
4
Figure 22: Application circuit for the connection to a single solderable SIM chip, with SIM detection not implemented
Reference
Description
Part Number - Manufacturer
C1, C2, C3, C4
33 pF Capacitor Ceramic COG 0402 5% 25 V
GRM1555C1H330JZ01 - Murata
C5
100 nF Capacitor Ceramic X7R 0402 10% 16 V
GRM155R71C104KA01 - Murata
U1
SIM chip (M2M UICC Form Factor)
Various Manufacturers
Table 23: Example of components for the connection to a single solderable SIM chip, with SIM detection not implemented
1.8.1.4 Single SIM card with detection
A removable SIM card placed in a SIM card holder must be connected to the SIM card interface of
LISA-U2 modules as described in Figure 23 when the optional SIM card detection feature is
implemented so that the module detects if a SIM card is present in the connector by means of the
GPIO5 signal. The SW1 and SW2 pins of the SIM card holder are connected to a normally-open
mechanical switch integrated in the SIM connector. The following cases are available:
SIM card not present: the GPIO5 signal is forced low by the pull-down resistor connected to ground
(i.e. the switch integrated in the SIM connector is open)
SIM card present: the GPIO5 signal is forced high by the pull-up resistor connected to V_INT (i.e.
the switch integrated in the SIM connector is closed)