Integration Manual
Table Of Contents
- Document Information
- Contents
- 1 System description
- 1.1 Overview
- 1.2 Architecture
- 1.3 Pin-out
- 1.4 Operating modes
- 1.5 Power management
- 1.6 System functions
- 1.7 RF connection
- 1.8 (U)SIM interface
- 1.9 Serial communication
- 1.9.1 Serial interfaces configuration
- 1.9.2 Asynchronous serial interface (UART)
- 1.9.2.1 UART features
- 1.9.2.2 UART signal behavior
- 1.9.2.3 UART and power-saving
- 1.9.2.4 UART application circuits
- Providing the full RS-232 functionality (using the complete V.24 link)
- Providing the TxD, RxD, RTS, CTS and DTR lines only (not using the complete V.24 link)
- Providing the TxD, RxD, RTS and CTS lines only (not using the complete V.24 link)
- Providing the TxD and RxD lines only (not using the complete V24 link)
- Additional considerations
- 1.9.3 USB interface
- 1.9.4 SPI interface
- 1.9.5 MUX protocol (3GPP TS 27.010)
- 1.10 DDC (I2C) interface
- 1.11 Audio Interface
- 1.12 General Purpose Input/Output (GPIO)
- 1.13 Reserved pins (RSVD)
- 1.14 Schematic for LISA-U2 module integration
- 1.15 Approvals
- 1.15.1 European Conformance CE mark
- 1.15.2 US Federal Communications Commission notice
- 1.15.3 Innovation, Science, Economic Development Canada notice
- 1.15.4 Australian Regulatory Compliance Mark
- 1.15.5 ICASA Certification
- 1.15.6 KCC Certification
- 1.15.7 ANATEL Certification
- 1.15.8 CCC Certification
- 1.15.9 Giteki Certification
- 2 Design-In
- 3 Features description
- 3.1 Network indication
- 3.2 Antenna detection
- 3.3 Jamming Detection
- 3.4 TCP/IP and UDP/IP
- 3.5 FTP
- 3.6 HTTP
- 3.7 SSL/TLS
- 3.8 Dual stack IPv4/IPv6
- 3.9 AssistNow clients and GNSS integration
- 3.10 Hybrid positioning and CellLocate®
- 3.11 Control Plane Aiding / Location Services (LCS)
- 3.12 Firmware update Over AT (FOAT)
- 3.13 Firmware update Over the Air (FOTA)
- 3.14 In-Band modem (eCall / ERA-GLONASS)
- 3.15 SIM Access Profile (SAP)
- 3.16 Smart Temperature Management
- 3.17 Bearer Independent Protocol
- 3.18 Multi-Level Precedence and Pre-emption Service
- 3.19 Network Friendly Mode
- 3.20 Power saving
- 4 Handling and soldering
- 5 Product Testing
- Appendix
- A Migration from LISA-U1 to LISA-U2 series
- A.1 Checklist for migration
- A.2 Software migration
- A.2.1 Software migration from LISA-U1 series to LISA-U2 series modules
- A.3 Hardware migration
- A.3.1 Hardware migration from LISA-U1 series to LISA-U2 series modules
- A.3.2 Pin-out comparison LISA-U1 series vs. LISA-U2 series
- A.3.3 Layout comparison LISA-U1 series vs. LISA-U2 series
- B Glossary
- Related documents
- Revision history
- Contact
LISA-U2 series - System Integration Manual
UBX-13001118 - R25 Contents Page 4 of 182
Contents
Document Information ................................................................................................................................ 2
Contents .......................................................................................................................................................... 4
1 System description ............................................................................................................................... 7
1.1 Overview ........................................................................................................................................................ 7
1.2 Architecture ................................................................................................................................................. 9
1.2.1 Functional blocks ................................................................................................................................ 9
1.3 Pin-out .......................................................................................................................................................... 11
1.4 Operating modes ....................................................................................................................................... 15
1.5 Power management .................................................................................................................................. 17
1.5.1 Power supply circuit overview ......................................................................................................... 17
1.5.2 Module supply (VCC) ........................................................................................................................ 18
1.5.3 Current consumption profiles ........................................................................................................ 28
1.5.4 RTC Supply (V_BCKP) ...................................................................................................................... 33
1.5.5 Interface supply (V_INT) .................................................................................................................. 36
1.6 System functions ...................................................................................................................................... 37
1.6.1 Module power-on .............................................................................................................................. 37
1.6.2 Module power-off .............................................................................................................................. 41
1.6.3 Module reset ...................................................................................................................................... 43
1.7 RF connection ............................................................................................................................................ 45
1.8 (U)SIM interface ........................................................................................................................................ 46
1.8.1 (U)SIM application circuits ............................................................................................................. 47
1.9 Serial communication .............................................................................................................................. 53
1.9.1 Serial interfaces configuration ...................................................................................................... 54
1.9.2 Asynchronous serial interface (UART) ......................................................................................... 55
1.9.3 USB interface ..................................................................................................................................... 74
1.9.4 SPI interface ...................................................................................................................................... 79
1.9.5 MUX protocol (3GPP TS 27.010)..................................................................................................... 84
1.10 DDC (I
2
C) interface .................................................................................................................................... 86
1.10.1 Overview ............................................................................................................................................. 86
1.10.2 DDC application circuits .................................................................................................................. 86
1.11 Audio Interface .......................................................................................................................................... 92
1.11.1 I
2
S interface - PCM mode ................................................................................................................ 94
1.11.2 I
2
S interface - Normal I
2
S mode...................................................................................................... 94
1.11.3 I
2
S interface application circuits.................................................................................................... 95
1.11.4 Voiceband processing system ....................................................................................................... 97
1.12 General Purpose Input/Output (GPIO) .................................................................................................. 99
1.13 Reserved pins (RSVD) ............................................................................................................................ 106
1.14 Schematic for LISA-U2 module integration ...................................................................................... 107
1.15 Approvals .................................................................................................................................................. 108
1.15.1 European Conformance CE mark ................................................................................................ 108
1.15.2 US Federal Communications Commission notice ................................................................... 109
1.15.3 Innovation, Science, Economic Development Canada notice .................................................. 111
1.15.4 Australian Regulatory Compliance Mark .................................................................................... 113