Installation Instructions

LISA-U2 series - System Integration Manual
UBX-13001118 - R19 Early Production Information Contents
Page 6 of 175
3.15.2 Threshold Definitions ................................................................................................................................ 151
3.16 Bearer Independent Protocol ............................................................................................................................. 151
3.17 Multi-Level Precedence and Pre-emption Service ............................................................................................... 151
3.18 Network Friendly Mode .................................................................................................................................... 152
3.19 Power saving .................................................................................................................................................... 152
4 Handling and soldering ...................................................................................................... 153
4.1 Packaging, shipping, storage and moisture preconditioning .............................................................................. 153
4.2 Soldering .......................................................................................................................................................... 153
4.2.1 Soldering paste ......................................................................................................................................... 153
4.2.2 Reflow soldering ....................................................................................................................................... 153
4.2.3 Optical inspection ..................................................................................................................................... 155
4.2.4 Cleaning ................................................................................................................................................... 155
4.2.5 Repeated reflow soldering ........................................................................................................................ 155
4.2.6 Wave soldering ......................................................................................................................................... 155
4.2.7 Hand soldering ......................................................................................................................................... 155
4.2.8 Rework ..................................................................................................................................................... 155
4.2.9 Conformal coating .................................................................................................................................... 155
4.2.10 Casting ..................................................................................................................................................... 156
4.2.11 Grounding metal covers ............................................................................................................................ 156
4.2.12 Use of ultrasonic processes ....................................................................................................................... 156
5 Product Testing ................................................................................................................... 157
5.1 u-blox in-series production test ......................................................................................................................... 157
5.2 Test parameters for OEM manufacturer ............................................................................................................ 157
5.2.1 ‘Go/No go’ tests for integrated devices...................................................................................................... 158
5.2.2 Functional tests providing RF operation ..................................................................................................... 158
Appendix ................................................................................................................................... 161
A Migration from LISA-U1 to LISA-U2 series ......................................................................... 161
A.1 Checklist for migration ..................................................................................................................................... 161
A.2 Software migration ........................................................................................................................................... 161
A.2.1 Software migration from LISA-U1 series to LISA-U2 series modules ............................................................ 161
A.3 Hardware migration .......................................................................................................................................... 162
A.3.1 Hardware migration from LISA-U1 series to LISA-U2 series modules .......................................................... 162
A.3.2 Pin-out comparison LISA-U1 series vs. LISA-U2 series ................................................................................. 163
A.3.3 Layout comparison LISA-U1 series vs. LISA-U2 series .................................................................................. 170
B Glossary ............................................................................................................................... 171
Related documents .................................................................................................................... 173
Revision history ......................................................................................................................... 174
Contact ....................................................................................................................................... 175