User's Manual

LISA-U1/LISA-H1 series - System Integration Manual
3G.G2-HW-10002-2 Advance Information Design-In
Page 94 of 116
5.3 mm11.85 mm
33.2 mm
1.0 mm
1.4 mm
PIN 1
Bottom side
(through module view)
22.40 mm
Exposed GND on LISA module bottom layer
Signals keep-out area on application board
Figure 53: Signals keep-out area on the top layer of the application board, below LISA-U1/LISA-H1 series modules
2.2.3 Placement
Optimize placement for minimum length of RF line and closer path from DC source for VCC.
The heat dissipation during continuous transmission at maximum power can significantly raise the
temperature of the application base-board below the LISA-U1/LISA-H1 series modules: avoid placing
temperature sensitive devices (e.g. GPS receiver) close to the module.