User's Manual

LISA-U1/LISA-H1 series - System Integration Manual
3G.G2-HW-10002-2 Advance Information Design-In
Page 93 of 116
2.2.2 Footprint and paste mask
The following figure describes the footprint and provides recommendations for the paste mask for LISA-U1/LISA-
H1 series modules. These are recommendations only and not specifications. Note that the copper and solder
masks have the same size and position.
33.2 mm [1307.1 mil]
22.4 mm [881.9 mil]
2.3 mm
[90.6 mil]
0.8 mm
[31.5 mil]
1.1 mm
[43.3 mil]
0.8 mm
[31.5 mil]
1.0 mm
[39.3 mil]
5.7 mm
[224.4 mil]
33.2 mm [1307.1 mil]
22.4 mm [881.9 mil]
2.3 mm
[90.6 mil]
1.2 mm
[47.2 mil]
1.1 mm
[43.3 mil]
0.8 mm
[31.5 mil]
0.9 mm
[35.4 mil]
5.7 mm
[224.4 mil]
0.6 mm
[23.6 mil]
Stencil: 120 µm
Figure 52: LISA-U1/LISA-H1 series modules suggested footprint and paste mask
To improve the wetting of the half vias, reduce the amount of solder paste under the module and increase the
volume outside of the module by defining the dimensions of the paste mask to form a T-shape (or equivalent)
extending beyond the copper mask. The solder paste should have a total thickness of 120 µm.
The paste mask outline needs to be considered when defining the minimal distance to the next
component.
The exact geometry, distances, stencil thicknesses and solder paste volumes must be adapted to the
specific production processes (e.g. soldering etc.) of the customer.
The bottom layer of LISA-U1/LISA-H1 series modules shows an unprotected copper area for GND described in
Figure 53.
Consider “No-routing” area for the LISA-U1/LISA-H1 series modules footprint as follows: signals keep-
out area on the top layer of the application board, below LISA-U1/LISA-H1 series modules, due to GND
opening on module bottom layer (see Figure 53).