Product Info

JODY-W2 - Application Note
UBX-20053581 - TBD Contents Page 6 of 11
equipment are connected. Figure 3 and Table 3 shows the design stack-up including dimensions of
the 50 Ω coplanar microstrips implemented.
Regarding the coplanar microstrips the ground planes beside the signal trace are connected to the
inner layer ground plane using vias. The vias are placed with a maximum distance of 0.5 mm to the
coplanar ground edge and a maximum pitch of 2 mm. The top layer is coated with generic LPI solder
stop mask.
The SMA connectors on the carrier board are used for mounting antennas. For Bluetooth and Wi-Fi
operation in the 2.4 GHz band and Wi-Fi operation in the 5 GHz band, the module has been tested and
approved for use with antennas up to 2 dBi antenna gain.
Figure 3: Coplanar micro-strip dimension specification
Item Value
S 200 µm
W 700 µm
T 35 µm
H 800 µm
𝜀

4.3
Table 3: Coplanar micro-strip specification
The mechanical dimensions of the module board’s microstrips and position of the pi network
impedance matching components are shown in Figure 4. Figure 6 shows the components used for the
PI network impedance matching. Here only series 0 ohm resistors are used. The inner layers have the
same dimensions and are filled with ground. No RF traces are routed in these layers.
The antenna ports shown in Figure 4 on the right hand side are from top to bottom: ANT1, ANT0, and
ANT2. ANT2 is not used and shall be left unconnected.