Specifications

EMMY-W1 Antenna reference design
UBX-16015910 Page 4 of 12
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3.2 PCB stack-up
The stack-up used in the reference design is specified in Table 2.
PCB Layer Material Thickness
Soldermask Top Generic LPI Soldermask 25 µm
Top Copper Foil 35 µm
Dielectric Pre-preg 2x7628 360 µm
L2 Copper Foil 35 µm
Dielectric Core 700 µm +/-10%
L3 Copper Foil 35 µm
Dielectric Pre-preg 2x7628 360 µm
Bottom Copper Foil 35 µm
Soldermask Bottom Generic LPI Soldermask 25 µm
Table 2: Stack-up of EVK-EMMY-W1
3.2.1 RF trace specification
The 50 Ω coplanar micro-strip dimensions used in these reference designs are stated in Figure 3 and Table 3.
Figure 3: Coplanar micro-strip dimension specification
Item Value
S 400 µm
W 600 µm
T 35 µm
H 360 µm
Table 3: Coplanar micro-strip specification
3.3 Mechanical dimensions
The Mechanical dimensions and position of the components are specified in Figure 4.
The layers beneath the ‘top layer’ have the same dimensions and are filled with ground. No RF traces are routed
in those layers.