Data Sheet
Table Of Contents
- Document information
- Contents
- 1 Functional description
- 2 Pin definition
- 3 Electrical specifications
- 4 Firmware
- 5 Mechanical specifications
- 6 RF design notes
- 7 BMD-380 evaluation development kit
- 8 Qualification and approvals
- 9 Environmental
- 10 Product handling
- 11 Ordering information
- 12 Life support and other high-risk use warning
- Related documents
- Revision history
- Contact
BMD-380 - Data sheet
UBX-19039467 - R06 Contents Page 3 of 36
Contents
Document information ................................................................................................................................ 2
Contents .......................................................................................................................................................... 3
1 Functional description ......................................................................................................................... 5
1.1 Features ........................................................................................................................................................ 5
1.2 Applications ................................................................................................................................................. 6
1.3 Block diagram .............................................................................................................................................. 6
1.4 Product specifications ............................................................................................................................... 7
2 Pin definition ........................................................................................................................................... 9
2.1 Pin assignment ............................................................................................................................................ 9
2.2 Peripheral pins ...........................................................................................................................................11
3 Electrical specifications ................................................................................................................... 12
3.1 Absolute maximum ratings ....................................................................................................................12
3.2 Operating conditions ................................................................................................................................12
3.3 Power and DCDC configuration ..............................................................................................................13
3.3.1 USB power ..........................................................................................................................................13
3.3.2 Normal (LV) power mode examples ..............................................................................................14
3.3.3 High voltage (HV) power mode examples ....................................................................................15
3.4 General purpose I/O ..................................................................................................................................15
3.5 Module reset ..............................................................................................................................................16
3.6 Debug and programming .........................................................................................................................16
3.7 Clocks ..........................................................................................................................................................16
3.7.1 32.768 kHz crystal (LFXO) ..............................................................................................................17
3.7.2 32.768 kHz clock source comparison ...........................................................................................17
4 Firmware ................................................................................................................................................ 18
4.1 Factory image ............................................................................................................................................18
4.2 SoftDevices ................................................................................................................................................18
4.2.1 S140 ....................................................................................................................................................18
4.2.2 S340 ....................................................................................................................................................18
4.3 IEEE 802.15.4 (Thread and Zigbee) ......................................................................................................19
4.4 Bluetooth device address ........................................................................................................................19
5 Mechanical specifications ............................................................................................................... 20
5.1 Dimensions .................................................................................................................................................20
5.2 Recommended PCB land pads ...............................................................................................................20
5.3 Module marking .........................................................................................................................................21
5.3.1 Label marking for type number BMD-380-A-R-00 ....................................................................21
5.3.2 Module and label marking for type number BMD-380-A-R-10 ...............................................22
6 RF design notes ................................................................................................................................... 23
6.1 Recommended RF layout and ground plane ........................................................................................23
6.2 Mechanical enclosure ...............................................................................................................................23
6.3 Antenna patterns ......................................................................................................................................24