Data Sheet
Table Of Contents
- Document information
- Contents
- 1 Functional description
- 2 Pin definition
- 3 Electrical specifications
- 4 Firmware
- 5 Mechanical specifications
- 6 RF design notes
- 7 BMD-380 evaluation development kit
- 8 Qualification and approvals
- 9 Environmental
- 10 Product handling
- 11 Ordering information
- 12 Life support and other high-risk use warning
- Related documents
- Revision history
- Contact
BMD-380 - Data sheet
UBX-19039467 - R06 RF design notes Page 23 of 36
6 RF design notes
6.1 Recommended RF layout and ground plane
The integrated antenna requires a suitable ground plane to radiate effectively.
The area under and extending out from the antenna portion of the module should be kept clear of
copper and other metal. The module should be placed at the edge of the PCB with the antenna edge
facing out. Reducing the ground plane from that shown in Figure 11 will reduce the effective radiated
power.
☞ Align the module keep-out with edge of host PCB copper pour (top of 2.90 mm dimension below).
☞ For best performance, center the module on the longest edge of the host PCB.
☞ If a different size board is used, place the sides of the module at least 10 mm from the
corresponding PCB board edge.
Figure 11: BMD-380 recommended RF layout and ground plane
6.2 Mechanical enclosure
Care should be taken when designing and placing the BMD-380 module into an enclosure. Metal
should be kept clear from the antenna area, both above and below. Any metal around the module can
negatively impact RF performance.
The module is designed and tuned for the antenna and RF components to be in free air. Any potting,
epoxy fill, plastic over-molding, or conformal coating can negatively impact RF performance and must
be evaluated by the customer.