Data Sheet

BMD-345 - Data sheet
UBX-19039908 - R07 Contents Page 3 of 36
Contents
Document information ................................................................................................................................ 2
Contents .......................................................................................................................................................... 3
1 Functional description ......................................................................................................................... 5
1.1 Features ........................................................................................................................................................ 5
1.2 Applications ................................................................................................................................................. 6
1.3 Block diagram .............................................................................................................................................. 6
1.4 Product specifications ............................................................................................................................... 7
2 Pin definition ........................................................................................................................................... 9
2.1 Pin assignment ............................................................................................................................................ 9
2.2 Peripheral pins ...........................................................................................................................................11
2.2.1 BMD-301 to BMD-345 pad differences ........................................................................................12
3 Electrical specifications ................................................................................................................... 13
3.1 Absolute maximum ratings ....................................................................................................................13
3.2 Operating conditions ................................................................................................................................13
3.3 Power configuration .................................................................................................................................13
3.3.1 USB power ..........................................................................................................................................14
3.4 General purpose I/O ..................................................................................................................................14
3.5 Module reset ..............................................................................................................................................14
3.6 Debug and programming .........................................................................................................................14
3.7 Clocks ..........................................................................................................................................................15
3.7.1 32.768 kHz crystal (LFXO) ..............................................................................................................15
3.7.2 32.768 kHz clock source comparison ...........................................................................................15
4 Firmware ................................................................................................................................................ 16
4.1 Factory image ............................................................................................................................................16
4.2 SoftDevices ................................................................................................................................................16
4.2.1 S140 ....................................................................................................................................................16
4.2.2 S340 ....................................................................................................................................................16
4.2.3 IEEE 802.15.4 (Thread and Zigbee) ..............................................................................................16
4.3 Bluetooth device address ........................................................................................................................17
5 RF front end – PA / LNA .................................................................................................................... 18
5.1 Hardware .....................................................................................................................................................18
5.1.1 PA / LNA modes ................................................................................................................................18
5.1.2 PA / LNA control ................................................................................................................................18
5.1.3 Power Limitations .............................................................................................................................18
5.2 Software Enablement ..............................................................................................................................19
5.2.1 Dynamic Method ...............................................................................................................................19
5.2.2 Static Method ....................................................................................................................................22
6 Mechanical specifications ............................................................................................................... 23
6.1 Dimensions .................................................................................................................................................23
6.2 Recommended PCB land pads ...............................................................................................................23