Integration Manual

ANNA-B4 series - System integration manual
UBX-21000517 - R03 Contents Page 49 of 76
C1-Public
Cleaning
Cleaning the module is not recommended.
Residues underneath the module cannot be easily removed with a washing process.
• Cleaning with water will lead to capillary effects where water is absorbed in the gap between the
baseboard and the module. The combination of residues of soldering flux and encapsulated water
leads to short circuits or resistor-like interconnections between neighboring pads. Water will also
damage the label and the ink-jet printed text.
• Cleaning with alcohol or other organic solvents can result in soldering flux residues flooding into
areas that are not accessible for post-wash inspections. The solvent will also damage the label
and the ink-jet printed text.
• Ultrasonic cleaning will permanently damage the module and the crystal oscillators in particular.
For best results use a "no clean" soldering paste and circumvent the need for a cleaning stage after
the soldering process.
Potting and conformal coating
If potting or conformal coating is required, the ANNA-B4 mold characteristics in Table 19 should be
considered. If the antenna and/or antenna trace is covered by the potting or coating, it may affect the
RF characteristics of the module. This might also affect the certification of the module, and the
antenna will most likely be classified as a new antenna requiring recertification. The customer is
strongly advised to qualify the potting / coating process in combination with the u-blox module.
⚠ Hardware failure analysis requires that it is possible to remove the potting / coating.
⚠ Failures related to the use of potting / coating are not covered by warranty.
Parameter
Unit
Value
Shrinkage
%
0.17
Modulus (25 °C)
MPa
20000
Modulus (260 °C)
MPa
500
Table 19: ANNA-B4 mold parameters
Other remarks
• Only a single wave soldering process is allowed for boards populated with the module.
• Boards with combined through-hole technology (THT) components and surface-mount technology
(SMT) devices might require THT components to be wave soldered.
• Miniature Wave Selective Solder processes are preferred over traditional wave soldering
processes.
• Hand soldering is not recommended.
• Rework is not recommended.
• The modules contain components that are sensitive to Ultrasonic Waves. Use of any ultrasonic
processes, like cleaning and welding, might damage the module. Use of ultrasonic processes on
an end product integrating this module will void the warranty.