Integration Manual

ANNA-B4 series - System integration manual
UBX-21000517 - R03 Contents Page 48 of 76
C1-Public
Reflow soldering process
ANNA-B4 modules are surface mounted devices supplied in a Land Grid Array (LGA) package with
gold-plated solder lands. The modules are manufactured in a lead-free process with lead-free
soldering paste.
The thickness of solder resist between the top side of host PCB and the bottom side of ANNA-B4
must be considered for the soldering process.
ANNA-B4 modules are compatible with the industrial reflow profile for common SAC type RoHS
solders. No-clean soldering paste is strongly recommended.
The reflow profile is dependent on the thermal mass over the entire area of the fully populated host
PCB, the heat transfer efficiency of the oven, and the type of solder paste that is used. The optimal
soldering profile that is used must be trimmed for each case depending on the specific soldering
process and layout of the host PCB.
⚠ The target parameter values shown in Table 18 are only general guidelines for a Pb-free process
and all given values are tentative and subject to change. For further information, see also the
JEDEC J-STD-020C standard [9].
Process parameter
Unit
Value
Pre-heat
Ramp up rate to T
SMIN
K/s
3
T
SMIN
°C
150
T
SMAX
°C
200
t
S
(from 25 °C)
s
110
t
S
(Pre-heat)
s
60
Peak
T
L
°C
217
t
L
(time above T
L
)
s
60
T
P
(absolute max)
°C
245
t
P
(time above T
P
-5 °C)
s
10
Cooling
Ramp-down from T
L
(absolute max)
K/s
6
General
T
to peak
s
300
Allowed reflow soldering cycles
-
2
Table 18: Recommended reflow profiles
Figure 25: Reflow profile
☞ The lower value of T
P
and slower ramp down rate (2–3 °C/sec) is preferred.