Integration Manual

ANNA-B4 series - System integration manual
UBX-21000517 - R03 Contents Page 29 of 76
C1-Public
Table 14 describes the ESD immunity requirements as defined by CENELEC EN 61000-4-2, ETSI EN
301 489-1, ETSI EN 301 489-7, ETSI EN 301 489-24.
Application
Category
Immunity level
All exposed surfaces of the radio equipment and ancillary equipment
in a representative configuration
Indirect Contact Discharge
* ±8 kV
*Tested on ANNA-B4 evaluation board.
Table 14: Electromagnetic Compatibility ESD immunity requirements
ANNA-B4 is manufactured with consideration to specific standards that minimize the occurrence of
ESD events; the highly automated process complies with IEC61340-5-1 (STM5.2-1999 Class M1
devices) standard, and designers should subsequently implement proper measures to protect any pin
that might be exposed to the end user from ESD events.
Compliance with the standard protection level specified in EN61000-4-2 is achieved by including ESD
protection close to any areas that are accessible to the end user.
3.7 Design-in checklists
Schematic checklist
 Are the module pins properly numbered and designated on the schematic, as shown in the pin list
of the respective data sheet [5] [6].
 Power supply design complies with the voltage supply requirement, as described in the respective
ANNA-B402 [5] and ANNA-B412 data sheets [6].
 Adequate bypassing is present in front of the power pins, as described in the respective
ANNA-B402 [5] and ANNA-B412 data sheets [6].
 Each signal group is consistent with its own power rail supply or proper signal translation has been
provided, as described in the respective ANNA-B402 [5] and ANNA-B412 data sheets [6].
 When using an external antenna, provide a pi-filter in front of it for final matching.
Layout checklist
 PCB stack-up and controlled impedance traces follow the recommendations given by the PCB
manufacturer. See RF transmission line design.
 All pins are properly connected, and the footprint follows u-blox recommendations for pin design.
See the solder mask information in the ANNA-B402 [5] and ANNA-B412 data sheets [6].
 Proper clearance has been provided between RF section and digital section.
 Proper isolation has been provided between Antennas for co-location RF systems.
 Bypass capacitors are placed close to the module. See Layout and manufacturing.
 Low impedance power path or power plane has been provided to the module.
 Controlled impedance traces are properly implemented on the layout (both RF and digital) and
follow PCB manufacturer recommendations. See RF transmission line design.
 50 Ω RF traces and connectors follow the rules described in Antenna interface.
 Antenna design has been reviewed by the antenna manufacturer. See Antenna integration
guidelines
 Proper grounding has been provided to the module for low impedance return path. See Layout and
manufacturing.
 Reference plane skipping has been minimized for high frequency busses.
 All traces and planes are routed inside the area defined by the main ground plane.
 u-blox has reviewed and approved the PCB
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This is applicable only for end-products based on u-blox reference designs.