Integration Manual

SARA-R4/N4 series - System Integration Manual
UBX-16029218 - R13 Handling and soldering Page 92 of 119
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☞ u-blox gives no warranty against damages to the SARA-R4/N4 series modules caused by performing more than a total
of two reflow soldering processes (one reflow soldering process to mount the SARA-R4/N4 series module, plus one
reflow soldering process to mount other parts).
3.3.6 Wave soldering
SARA-R4/N4 series LGA modules must not be soldered with a wave soldering process.
Boards with combined through-hole technology (THT) components and surface-mount technology (SMT) devices require
wave soldering to solder the THT components. No more than one wave soldering process is allowed for a board with a
SARA-R4/N4 series module already populated on it.
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⚠ Performing a wave soldering process on the module can result in severe damage to the device!
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☞ u-blox gives no warranty against damages to the SARA-R4/N4 series modules caused by performing more than a total
of two soldering processes (one reflow soldering process to mount the SARA-R4/N4 series module, plus one wave
soldering process to mount other THT parts on the application board).
3.3.7 Hand soldering
Hand soldering is not recommended.
3.3.8 Rework
Rework is not recommended.
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☞ Never attempt a rework on the module itself, e.g. replacing individual components. Such actions immediately
terminate the warranty.
3.3.9 Conformal coating
Certain applications employ a conformal coating of the PCB using HumiSeal
®
or other related coating products.
These materials affect the HF properties of the cellular modules and it is important to prevent them from flowing into
the module.
The RF shields do not provide 100% protection for the module from coating liquids with low viscosity, therefore care is
required in applying the coating.
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☞ Conformal Coating of the module will void the warranty.
3.3.10 Casting
If casting is required, use viscose or another type of silicon pottant. The OEM is strongly advised to qualify such processes
in combination with the cellular modules before implementing this in production.
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☞ Casting will void the warranty.
3.3.11 Grounding metal covers
Attempts to improve grounding by soldering ground cables, wick or other forms of metal strips directly onto the EMI
covers is done at the customer's own risk. The numerous ground pins should be sufficient to provide optimum immunity
to interference and noise.
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☞ u-blox gives no warranty for damages to the cellular modules caused by soldering metal cables or any other forms of
metal strips directly onto the EMI covers.
3.3.12 Use of ultrasonic processes
The cellular modules contain components which are sensitive to ultrasonic waves. Use of any ultrasonic processes
(cleaning, welding etc.) may cause damage to the module.