Integration Manual

SARA-R4/N4 series - System Integration Manual
UBX-16029218 - R13 Handling and soldering Page 89 of 119
3 Handling and soldering
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☞ No natural rubbers, no hygroscopic materials or materials containing asbestos are employed.
3.1 Packaging, shipping, storage and moisture preconditioning
For information pertaining to SARA-R4/N4 series reels / tapes, Moisture Sensitivity levels (MSD), shipment and storage
information, as well as drying for preconditioning, see the SARA-R4/N4 series Data Sheet [1] and the u-blox Package
Information Guide [17].
3.2 Handling
The SARA-R4/N4 series modules are Electro-Static Discharge (ESD) sensitive devices.
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⚠ Ensure ESD precautions are implemented during handling of the module.
Electrostatic discharge (ESD) is the sudden and momentary electric current that flows between two objects at different
electrical potentials caused by direct contact or induced by an electrostatic field. The term is usually used in the
electronics and other industries to describe momentary unwanted currents that may cause damage to electronic
equipment.
The ESD sensitivity for each pin of SARA-R4/N4 series modules (as Human Body Model according to JESD22-A114F) is
specified in the SARA-R4/N4 series Data Sheet [1].
ESD prevention is based on establishing an Electrostatic Protective Area (EPA). The EPA can be a small working station or
a large manufacturing area. The main principle of an EPA is that there are no highly charging materials near ESD sensitive
electronics, all conductive materials are grounded, workers are grounded, and charge build-up on ESD sensitive
electronics is prevented. International standards are used to define typical EPA and can be obtained for example from
the International Electrotechnical Commission (IEC) or the American National Standards Institute (ANSI).
In addition to standard ESD safety practices, the following measures should be taken into account whenever handling the
SARA-R4/N4 series modules:
• Unless there is a galvanic coupling between the local GND (i.e. the work table) and the PCB GND, then the first point
of contact when handling the PCB must always be between the local GND and PCB GND.
• Before mounting an antenna patch, connect the ground of the device.
• When handling the module, do not come into contact with any charged capacitors and be careful when contacting
materials that can develop charges (e.g. patch antenna, coax cable, soldering iron).
• To prevent electrostatic discharge through the RF pin, do not touch any exposed antenna area. If there is any risk
that such exposed antenna area is touched in a non-ESD protected work area, implement adequate ESD protection
measures in the design.
• When soldering the module and patch antennas to the RF pin, make sure to use an ESD-safe soldering iron.