Integration Manual

SARA-R4/N4 series - System Integration Manual
UBX-16029218 - R13 Design-in Page 70 of 119
2.5.1.3 Guidelines for single SIM chip connection
A solderable SIM chip (M2M UICC Form Factor) must be connected the SIM card interface of the SARA-R4/N4 series
modules as described in Figure 38.
Follow these guidelines to connect the module to a solderable SIM chip without SIM presence detection:
• Connect the UICC / SIM contacts C1 (VCC) to the VSIM pin of the module.
• Connect the UICC / SIM contact C7 (I/O) to the SIM_IO pin of the module.
• Connect the UICC / SIM contact C3 (CLK) to the SIM_CLK pin of the module.
• Connect the UICC / SIM contact C2 (RST) to the SIM_RST pin of the module.
• Connect the UICC / SIM contact C5 (GND) to ground.
• Provide a 100 nF bypass capacitor (e.g. Murata GRM155R71C104K) at the SIM supply line close to the relative pad of
the SIM chip, to prevent digital noise.
• Provide a bypass capacitor of about 22 pF to 47 pF (e.g. Murata GRM1555C1H470J) on each SIM line, to prevent RF
coupling especially in case the RF antenna is placed closer than 10 - 30 cm from the SIM lines.
• Limit capacitance and series resistance on each SIM signal to match the SIM requirements (18.7 ns is the maximum
allowed rise time on clock line, 1.0 µs is the maximum allowed rise time on data and reset lines).
SARA-R4/ N4
41
VSIM
39
SIM _IO
38
SIM _CLK
40 SIM _RST
SIM CHIP
SIM Chip
Bot t om View
(cont act s side)
C1
VPP (C6)
VCC (C1)
IO (C7)
CLK (C3)
RST (C2)
GND (C5)
C2 C3 C5
U1
C4
2
8
3
6
7
1
C1 C5
C2 C6
C3 C7
C4 C8
8
7
6
5
1
2
3
4
Figure 38: Application circuits for the connection to a single solderable SIM chip, with SIM detection not implemented
Reference Description Part Number - Manufacturer
C1, C2, C3, C4 47 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H470JA01 - Murata
C5 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata
U1 SIM chip (M2M UICC Form Factor) Various Manufacturers
Table 27: Example of components for the connection to a single solderable SIM chip, with SIM detection not implemented
2.5.1.4 Guidelines for single SIM card connection with detection
An application circuit for the connection to a single removable SIM card placed in a SIM card holder is described in Figure
39, where the optional SIM card detection feature is implemented.
Follow these guidelines connecting the module to a SIM connector implementing SIM presence detection:
• Connect the UICC / SIM contacts C1 (VCC) to the VSIM pin of the module.
• Connect the UICC / SIM contact C7 (I/O) to the SIM_IO pin of the module.
• Connect the UICC / SIM contact C3 (CLK) to the SIM_CLK pin of the module.
• Connect the UICC / SIM contact C2 (RST) to the SIM_RST pin of the module.
• Connect the UICC / SIM contact C5 (GND) to ground.
• Connect one pin of the normally-open mechanical switch integrated in the SIM connector (as the SW2 pin in Figure
39) to the GPIO5 input pin, providing a weak pull-down resistor (e.g. 470 kΩ, as R2 in Figure 39).
• Connect the other pin of the normally-open mechanical switch integrated in the SIM connector (SW1 pin in Figure
39) to V_INT 1.8 V supply output by means of a strong pull-up resistor (e.g. 1 kΩ, as R1 in Figure 39)
• Provide a 100 nF bypass capacitor (e.g. Murata GRM155R71C104K) at the SIM supply line (VSIM), close to the related
pad of the SIM connector, to prevent digital noise.