Integration Manual

SARA-R4/N4 series - System Integration Manual
UBX-16029218 - R13 Page 4 of 119
2.2.1 Module supply (VCC)..................................................................................................................................... 39
2.2.2 Generic digital interfaces supply output (V_INT) .......................................................................................... 55
2.3 System functions interfaces................................................................................................................................... 56
2.3.1 Module power-on (PWR_ON) ....................................................................................................................... 56
2.3.2 Module reset (RESET_N) ............................................................................................................................... 57
2.4 Antenna interface .................................................................................................................................................. 58
2.4.1 Antenna RF interface (ANT) .......................................................................................................................... 58
2.4.2 Antenna detection interface (ANT_DET) ...................................................................................................... 65
2.5 SIM interface ......................................................................................................................................................... 68
2.5.1 Guidelines for SIM circuit design .................................................................................................................. 68
2.5.2 Guidelines for SIM layout design .................................................................................................................. 71
2.6 Data communication interfaces ............................................................................................................................ 72
2.6.1 UART interface .............................................................................................................................................. 72
2.6.2 USB interface ................................................................................................................................................ 77
2.6.3 SPI interface .................................................................................................................................................. 78
2.6.4 SDIO interface ............................................................................................................................................... 78
2.6.5 DDC (I
2
C) interface ........................................................................................................................................ 79
2.7 Audio...................................................................................................................................................................... 81
2.7.1 Guidelines for Audio circuit design ............................................................................................................... 81
2.8 General Purpose Input/Output .............................................................................................................................. 81
2.8.1 Guidelines for GPIO circuit design ................................................................................................................ 81
2.8.2 Guidelines for general purpose input/output layout design ........................................................................ 82
2.9 Reserved pins (RSVD) ............................................................................................................................................. 83
2.10 Module placement ................................................................................................................................................ 83
2.11 Module footprint and paste mask ......................................................................................................................... 84
2.12 Thermal guidelines ................................................................................................................................................ 85
2.13 Schematic for SARA-R4/N4 series module integration .......................................................................................... 85
2.13.1 Schematic for SARA-R4/N4 series modules .................................................................................................. 85
2.14 Design-in checklist ................................................................................................................................................. 87
2.14.1 Schematic checklist ....................................................................................................................................... 87
2.14.2 Layout checklist ............................................................................................................................................. 87
2.14.3 Antenna checklist .......................................................................................................................................... 88
3 Handling and soldering ........................................................................................................................ 89
3.1 Packaging, shipping, storage and moisture preconditioning ................................................................................. 89
3.2 Handling ................................................................................................................................................................. 89
3.3 Soldering ................................................................................................................................................................ 90
3.3.1 Soldering paste ............................................................................................................................................. 90
3.3.2 Reflow soldering ........................................................................................................................................... 90
3.3.3 Optical inspection ......................................................................................................................................... 91
3.3.4 Cleaning ........................................................................................................................................................ 91
3.3.5 Repeated reflow soldering ............................................................................................................................ 91
3.3.6 Wave soldering ............................................................................................................................................. 92
3.3.7 Hand soldering .............................................................................................................................................. 92
3.3.8 Rework .......................................................................................................................................................... 92