User Manual

LARA-R2 series - System Integration Manual
UBX-16010573 - R02 Objective Specification Design-in
Page 96 of 148
Guidelines for single SIM chip connection
A solderable SIM chip (M2M UICC Form Factor) has to be connected the SIM card interface of LARA-R2 series
modules as described in Figure 45.
Follow these guidelines connecting the module to a solderable SIM chip without SIM presence detection:
 Connect the UICC / SIM contacts C1 (VCC) to the VSIM pin of the module.
 Connect the UICC / SIM contact C7 (I/O) to the SIM_IO pin of the module.
 Connect the UICC / SIM contact C3 (CLK) to the SIM_CLK pin of the module.
 Connect the UICC / SIM contact C2 (RST) to the SIM_RST pin of the module.
 Connect the UICC / SIM contact C5 (GND) to ground.
 Provide a 100 nF bypass capacitor (e.g. Murata GRM155R71C104K) at the SIM supply line (VSIM) close to
the related pad of the SIM chip, to prevent digital noise.
 Provide a bypass capacitor of about 22 pF to 47 pF (e.g. Murata GRM1555C1H470J) on each SIM line
(VSIM, SIM_CLK, SIM_IO, SIM_RST), to prevent RF coupling especially in case the RF antenna is placed
closer than 10 - 30 cm from the SIM card holder.
 Limit capacitance and series resistance on each signal of the SIM interface (SIM_CLK, SIM_IO, SIM_RST), to
match the SIM specifications requirements (27.7 ns is the maximum allowed rise time on the SIM_CLK line,
1.0 µs is the maximum allowed rise time on the SIM_IO and SIM_RST lines).
41
VSIM
39
SIM_IO
38
SIM_CLK
40
SIM_RST
4
V_INT
42
GPIO5
SIM CHIP
SIM Chip
Bottom View
(contacts side)
C1
VPP (C6)
VCC (C1)
IO (C7)
CLK (C3)
RST (C2)
GND (C5)
C2 C3 C5
U1
C4
2
8
3
6
7
1
C1 C5
C2 C6
C3 C7
C4 C8
8
7
6
5
1
2
3
4
TP
LARA-R2 series
Figure 45: Application circuit for the connection to a single solderable SIM chip, with SIM detection not implemented
Reference
Description
Part Number - Manufacturer
C1, C2, C3, C4
47 pF Capacitor Ceramic C0G 0402 5% 50 V
GRM1555C1H470JA01 - Murata
C5
100 nF Capacitor Ceramic X7R 0402 10% 16 V
GRM155R71C104KA01 - Murata
U1
SIM chip (M2M UICC Form Factor)
Various Manufacturers
Table 36: Example of components for the connection to a single solderable SIM chip, with SIM detection not implemented