Specifications
http://www.tyan.com
8
TYAN S8236-IL (S8236GM3NR-IL)
AMD 45nm 8-Core/12-Core Opteron 6100
Series Processors (Magny-Cours)
Supported CPU
Series
AMD 32nm 8-Core/12-Core/16-Core Opteron
6200 Series Processors (Interlagos)
Socket Type / Q'ty G34 / (2)
Thermal Design
Power(TDP)
115W
Processor
System Bus Up to 6.4 GT/s Hyper-Transport link support
Chipset AMD SR5690 + SP5100
Chipset
Super I/O Winbond W83627
Supported DIMM Qty (8)+(8) DIMM slots
DIMM Type / Speed
U/RDDR3, LV and ULV DDR3, LRDIMM / 1866/
1600/ 1333/ 1066/ 800 MHz
Capacity Up to 256GB RDIMM/ 64GB UDIMM
Memory channel 4 Channels per CPU
Memory
Memory voltage 1.5V/ 1.35V/ 1.25V
PCI-E (2) PCI-E Gen.2 x16 slots
Expansion Slots
Recommended
TYAN Riser Card
M2091, PCI-E x16 1U riser card (left) / M2091-R,
PCI-E x16 1U riser card (right)
Recommended
Barebone / Chassis
1U Barebone GT24-B8236-IL
Port Q'ty (3)
LAN
Controller Intel 82574L / Intel 82576EB
Connector
(1) Mini-SAS (4-port) + (2) SATA (totally support
6 ports)
Controller AMD SP5100
Speed 3.0 Gb/s
Storage SATA
RAID
RAID 0/1/10/5 (Promise Integrated Software
RAID)
Connector type D-Sub 15-pin
Resolution Up to 1600x1200@60Hz
Graphic
Chipset Aspeed AST2050
USB
(7) USB2.0 ports (2 at rear, 4 via cable, 1 type A
onboard)
COM (2) ports (1 at rear, 1 via cable)
VGA (1) D-Sub 15-pin VGA port
RJ-45 (3) GbE ports
Power SSI/ATX 24-pin + 8-pin + 8-pin power connectors
Front Panel (1) 2x12-pin SSI front panel header
Input /Output
SATA (1) Mini-SAS connector & (2) SATA-II connectors
System Monitoring Chipset Winbond W83795G










