Data Sheet

FSC-BT826HC
14
6. RECOMMENDED TEMPERATURE REFLOW PROFILE
The re-flow profiles are illustrated in Figure 11 and Figure 12 below.
 Follow: IPC/JEDEC J-STD-020 C
 Condition:
 Average ramp-up rate(217℃ to peak):1~ 2℃/sec max.
 Preheat:150~200C,60~180 seconds
 Temperature maintained above 217℃:60~ 150 seconds
 Time within 5℃ of actual peak temperature:20~ 40 sec.
 Peak temperature:250+0/-5℃ or 260+0/-5℃
 Ramp-down rate:3℃/s e c. m a x .
 Time 25℃ to peak temperature:8 minutes max
 Cycloe interval：5 minus
Figure 12: Typical Lead-free Re-flow Solder Profile