FSC-BT826HC FSC-BT826HC 4.2 Dual Mode Bluetooth Module Data Sheet Document Type: FSC-BT826HC Document Version: V1.1 Release Date: August 29.
FSC-BT826HC Release Record Version Number Revision 1.0 Revision 1.
FSC-BT826HC 1. INTRODUCTION FSC-BT826HC is a fully integrated Bluetooth module that complies with Bluetooth 4.2 dual mode protocols(BR/EDR/BLE). It supports SPP, BLE, ANCS, iBeacon, profiles. It integrates Baseband controller in a small package（Integrated chip antenna）, so the designers can have better flexibilities for the product shapes. FSC-BT826HC can be communicated by UART port. With Feasycom’s Bluetooth stack, Customers can easily transplant to their software.
FSC-BT826HC 1.2 Feature ◆ Fully qualified Bluetooth 4.2/4.0/3.0/2.1/2.0/1.2/1.1 ◆ Postage stamp sized form factor. ◆ Low power. ◆ Class 1.5 support(high output power) ◆ The default UART Baud rate is 115.2Kbps and can support from 1200bps up to 921.6Kbps,. ◆ UART, I2C,PCM / I2S data connection interfaces. ◆ Support the OTA upgrade. ◆ Bluetooth stack profiles support: SPP, HID, MAP, and all BLE protocols. 1.
FSC-BT826HC 2. GENERAL SPECIFICATION General Specification Chipset Realtek RTL8761 Product FSC-BT826HC Dimension 13mm x 26.9mm x 2.4mm Bluetooth Specification Bluetooth V4.2 Power Supply 3.3 Volt DC Output Power 5.5 dBm Sensitivity -82dBm@0.1%BER Frequency Band 2.402GHz -2.
FSC-BT826HC 3. PHYSICAL CHARACTERISTIC FSC-BT826HC dimension is 26.9mm(L)x13mm(W)x2.4mm(H).
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FSC-BT826HC 12 VDD_3V3 VDD Power supply voltage 3.
FSC-BT826HC By default, this PIN is floating. This PIN can connect to an external antenna to improve the Bluetooth signal coverage. EXT_ANT RF signal output If you need to use an external antenna, by modifying the module on the 0R resistance to block out the on-board 36 antenna; Or contact Feasycom for modification. Table 2 5. Interface Characteristics 5.1 UART Interface Four signals are used to implement the UART function.
FSC-BT826HC 5.2 I2C Interface ◆ Up to two I2C bus interfaces can support both master and slave mode with a frequency up to 400KHZ. ◆ Provide arbitration function, optional PEC(packet error checking) generation and checking. ◆ Supports 7 –bit and 10 –bit addressing mode and general call addressing mode. The I2C interface is an internal circuit allowing communication with an external I2C interface which is an industry standard two line serial interface used for connection to external hardware.
FSC-BT826HC 5.4.1 PCM Format FrameSync is the synchronizing function used to control the transfer of DAC_Data and ADC_Data. A Long FrameSync indicates the start of ADC_Data at the rising edge of FrameSync (Figure 3), and a Short FrameSync indicates the start of ADC_Data at the falling edge of FrameSync (Figure 4). Figure 4：Long FrameSync Figure 5：Short FrameSync 5.4.
FSC-BT826HC Figure 8：16-Bit Output Data with 13-Bit PCM Sample Data and Sign Extension For 16-bit linear PCM output, 3-bit programmable audio gain value can be padded to 13-bit sample data. Figure 9：16-Bit Output Data with 13-Bit PCM Sample Data and Audio Gain 5.4.
FSC-BT826HC Figure 11：PCM Interface (Short FrameSync) Table 5: PCM Interface Clock Specifications Table 6: PCM Interface Timing 5.4.4 PCM Interface Signal Levels The PCM signal level ranges from 1.8V to 3.3V.
FSC-BT826HC 6. RECOMMENDED TEMPERATURE REFLOW PROFILE The re-flow profiles are illustrated in Figure 11 and Figure 12 below. Follow: IPC/JEDEC J-STD-020 C Condition: Average ramp-up rate(217℃ to peak):1~ 2℃/sec m ax. Preheat:150~200C,60~180 seconds Temperature maintained above 217 ℃:60~ 150 seconds Time within 5℃ of actual peak tem perature:20~ 40 sec. Peak temperature:250+0/-5℃ or 260+0/-5℃ Ramp-down rate:3℃/sec. m ax.
FSC-BT826HC 2420C 2170C Figure 13 : Typical Lead-free Re-flow The soldering profile depends on various parameters according to the use of different solder and material. The data here is given only for guidance on solder re-flow. FSC-BT826HC will withstand up to two re-flows to a maximum temperature of 245°C. 7. Reliability and Environmental Specification 7.1 Temperature test Put the module in demo board which uses exit power supply, power on the module and connect to mobile.
FSC-BT826HC 7.4 Drop test Free fall the module (condition built in a wrapper which can defend ESD) from 150cm height to cement ground, each side twice, total twelve times. The appearance will not be damaged and all functions OK. 7.5 Packaging information After unpacking, the module should be stored in environment as follows: Temperature: 25℃ ± 2℃ Humidity: <60% No acidity, sulfur or chlorine environment The module must be used in four days after unpacking. 8.
FSC-BT826HC Figure 14: FSC-BT826HC Restricted Area Following recommendations helps to avoid EMC problems arising in the design. Note that each design is unique and the following list do not consider all basic design rules such as avoiding capacitive coupling between signal lines. Following list is aimed to avoid EMC problems caused by RF part of the module. Use good consideration to avoid problems arising from digital signals in the design. Ensure that signal lines have return paths as short as possible.
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FSC-BT826HC 10.
FCC Regulatory notices Modification statement TSC Auto ID Technology Co., Ltd.has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment. Interference statement This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s).
Model: FSC-BT826HC Contains FCC ID：VTV-FSCBT826HC The host OEM user manual must also contain clear instructions on how end users canfind and/or access the module and the FCC ID and ISED. Model: FSC-BT826HC Contains FCC ID： VTV-FSCBT826HC OEM Statement a. The module manufacturer must show how compliance can be demonstrated only for specific host or hosts b. The module manufacturer must limit the applicable operating conditions in which t transmitter will be used, and c.
2.2 List of applicable FCC rules List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically establish the bands of operation, the power, spurious emissions, and operating fundamental frequencies. DO NOT list compliance to unintentional-radiator rules (Part 15 Subpart B) since that is not a condition of a module grant that is extended to a host manufacturer. See also Section 2.
2.5 Trace antenna designs For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB Publication 996369 D02 FAQ – Modules for Micro-Strip Antennas and traces. The integration information shall include for the TCB review the integration instructions for the following aspects: layout of trace design, parts list (BOM), antenna, connectors, and isolation requirements.4 a) Information that includes permitted variances (e.g.
2.8 Label and compliance information Grantees are responsible for the continued compliance of their modules to the FCC rules. This includes advising host product manufacturers that they need to provide a physical or e-label stating “Contains FCC ID” with their finished product. See Guidelines for Labeling and User Information for RF Devices – KDB Publication 784748.
