Datasheet

Page 5 of 7 QR-QE-20/2003.08.01
3
Cold
耐寒性
The total resistance change
should be within ±20%.
To be operated mechanically.
全阻值變化要在±20%以內，
機械方面能動作。
Temperature:-30 ±2℃
Time: 96 hours
Surface moisture shall be removed, and
then the controller shall be subjected
to standard atmospheric conditions
for 2 hours after which measurement
shall be made.
溫度在-30±2℃放置 96 小時,表面水份攝
取后 2 小時正常狀態下測試.
4
Damp heat
耐濕性
Insulation resistance: more
than 10M Ω with 250V
insulation resistance tester.
The total resistance change
should be within ±20%.
To be operated mechanically.
用 250V 絕緣測試機測試，絕緣阻
抗 10MΩ以上,
全阻值變化要在±20%以內,
機械方面能動作.
Temperature:+60 ± 2℃
Humidity: 90~95%RH
Time: 96 hours
Surface moisture shall be subjected to
standard atmospheric conditions for 2
hours after which measurement shall be
made.
溫度在60±2℃放置96小時,表面水份攝取
后 2 小時正常狀態下測試.
5
Temperature
cycling test
溫度循環測試
The total resistance change
should be within ±20%.
To be operated mechanically.
全阻值變化要在±20%以內，
機械方面能動作。
Low temperature : -10 ±3℃ 30 minutes
High temperature: +60 ±2℃ 30 minutes
Number of cycles: 5
Surface moisture shall be removed, and
then the controller shall be subjected
to standard atmospheric conditions
for 2 hours after which measurement
shall be made.
在低溫為-10 ±3℃放置30分鐘,高溫60 ±
2℃放置 30 分鐘,測試 5 次.表面水份攝取
后 2 小時后正常狀態下測試.
6
Resistance to
soldering
焊錫性
Not less than 3/4 of the surface
dipped shall be covered with new
solder.
浸錫部分表面最少 3/4 被新錫覆蓋 .
Temperature of solder: 235±5℃,
Dipping duration:3±0.5S.
焊錫溫度：235±5℃,
浸錫時間：3±0.5 秒.
7
Resistance to
soldering heat
焊錫耐熱性
Variation of total resistance shall
be within ± 5%, and terminals
shall not work loose to injure
electric contact, after test.
全阻值變化±5%以內,測試後無端
子鬆動,不會損壞電氣接點。
Solder dip:浸焊
Preheating condition: Surface temperature
of the substrate shall be settled within 100℃
in one min.
預熱: 基板表面溫度 100℃以下，1 分鐘
內。
Solder temperature 260±5℃for 5 sec.
焊錫溫度 260±5℃，5 秒。