Datasheet

7. Performance specification :
Soldering Resistance change rate is: Dip the resistor into a solder bath having
Heat ±(1.0%+0.05) Max. a temperature of 260°C±3°C and hold it for 10±1
seconds.
(Sub-clause 4.18)
Resistance change after continuous
5 cycles for duty cycle specified below :
Step Temperature Time
Temperature Resistance change rate is 1
-55 ± 3
30 mins
cycling
± (1.0% + 0.05Ω) Max.
2 Room temp.
1015 mins
3
+155 ± 2
30 mins
4 Room temp.
1015 mins
(Sub-clause 4.19)
Resistance change after 1,000 hours
Load life in Resistance change rate is (1.5 hours "on", 0.5 hour "off" ) at RCWV
humidity
± (3.0% + 0.1Ω) Max.
in a humidity chamber controlled at
40 ± 2 and 90 to 95 % relative humidity
(Sub-clause 4.24.2.1)
Permanent resistance change after 1,000 hours
Load Life Resistance change rate is operating at RCWV, with duty cycle of
± (3.0% + 0.1Ω) Max.
(1.5 hours"on", 0.5 hour"off") at 70 ± 2 ambient
(Sub-clause 4.25.1)
Terminal Resistance change rate is Twist of Test Board :
bending
± (1.0% + 0.05Ω) Max.
Y/X = 5/90 mm for 10 seconds
(Sub-clause 4.33)
The resistors of 0 only can do the characteristic noted of *
LimitsCharacteristics
Chip Kit Resistors
Test Methods
( JIS C 5201-1 )
Distributed by Conrad Electronic SE • Klaus-Conrad-Str. 1 • D-92240 Hirschau
Datasheet
V1_0717_01_en
6