Datasheet

TMC8460-BI Datasheet (V100 / 2016-Sep-01)
Copyright © 2016 TRINAMIC Motion Control GmbH & Co. KG 50
3.13 Soldering Profile
The provided reflow soldering profile in accordance to IPC/JEDEC standard J-STD-020 is for reference
only. Trinamic advises to optimize to the respective board level parameters to get proper reflow
outcome.
Figure 27 - Soldering Profile
Table 10 : Soldering Profile Parameters
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Preheat
Temperature Min (T
smin
) 100°C 150°C
Temperature Max (T
smax
) 150°C 200°C
Time (min to max) (t
s
) 60-120 seconds 60-120 seconds
T
smax
to T
p
- Ramp-up Rate 3°C/second max. 3°C/second max.
Time maintained above:
- Temperature (T
L
) 183°C 217°C
- Time (t
L
) 60-150 seconds 60-150 seconds
Peak package body temperature (T
p
) 235°C 260°C
Time (t
p
) within 5°C of classification temperature (T
c
)
20 seconds 30 seconds
Ramp-down Rate (T
p
to T
smax
) 6°C / second max. 6°C / second max.
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max.