Datasheet

TMC8460-BI Datasheet (V100 / 2016-Sep-01)
Copyright © 2016 TRINAMIC Motion Control GmbH & Co. KG 45
3.9.4 Power Consumption
The values given here are typical values only. The real values depend on configuration, activity, and
temperature.
Table 7 : TMC8460 power consumption
Symbol Parameter Min Typ Max Unit % Notes
P
TOTAL
Total power consumption - 237 - mW 100 P
S
+ P
D
P
S
Static power consumption - 19 - mW 8
P
D
Dynamic power consumption - 218 - mW 92
Table 8 : Power consumption by rail
Symbol Parameter Power (mW) Voltage (V)
Current (mA)
Notes
Rail VCORE
DC core supply voltage, must
always be powered
177.921 1.200 148.268
Rail VCCIO
IO supply voltage, must always
be powered.
46.984 3.300 14.238
Rail VPLL
PLL supply voltage, must always
be powered.
9.000 3.300 2.727
Rail VPP
Power supply for charge pump,
must always be powered.
2.500 2.500 1.000
3.9.5 Package Thermal Behavior
Dynamic and static power consumption cause the junction temperature of the TMC8460 to be higher
than the ambient, case, or board temperature. The equations below show the relationships.
EQ 1:


=

EQ 2:


=

EQ 3:


=

Symbols used:
T
J
= Junction temperature
TA = Ambient temperature
TB = Board temperature measured 1.0mm away from the package
TC = Case temperature
Theta
JA
= Junction-to-ambient thermal resistance
Theta
JB
= Junction-to-board thermal resistance
Theta
JC
= Junction-to-case thermal resistance
P
TOTAL
= Total power consumption
Table 9 : TMC8460 package thermal behavior
Symbol
Parameter Typ Unit Notes
Theta
JA
Junction-to-ambient thermal resistance
18.36 °C/W @ Still air
14.89 °C/W @ 1.0 m/s
13.36 °C/W @ 2.5 m/s
Theta
JB
Junction-to-board thermal resistance 7.12 °C/W
Theta
JC
Junction-to-case thermal resistance 3.41 °C/W