Datasheet
TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 47
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16 Table of Figures
FIGURE 1.1 STANDALONE APPLICATION USING DIFFERENTIAL SENSING ....................................................................................... 4
FIGURE 1.2 STANDALONE APPLICATION USING SINGLE SHUNT CURRENT SENSING ....................................................................... 5
FIGURE 1.3 SPI MODE CONFIGURATION ...................................................................................................................................... 5
FIGURE 2.1 TMC6200-TA PINNING TQFP-EP 48 (7X7MM² BODY, 9X9MM² WITH LEADS) ........................................................ 7
FIGURE 3.1 STANDARD APPLICATION CIRCUIT ........................................................................................................................... 10
FIGURE 3.2 EXTERNAL GATE VOLTAGE SUPPLY ........................................................................................................................... 11
FIGURE 3.3 STANDBY SWITCH .................................................................................................................................................. 12
FIGURE 3.4 MILLER CHARGE DETERMINES SWITCHING SLOPE .................................................................................................... 13
FIGURE 3.5 SLOPES, MILLER PLATEAU AND BLANK TIME (BMX=U V OR W OUTPUT) ................................................................ 14
FIGURE 3.6 BRIDGE PROTECTION OPTIONS FOR POWER ROUTING INDUCTIVITY ......................................................................... 15
FIGURE 3.7 RINGING OF OUTPUT (GREEN) AND GATE VOLTAGES (YELLOW, BLUE) WITH DRVSTRENGTH=0 ............................ 16
FIGURE 3.8 RINGING OF OUTPUT (GREEN) AND GATE VOLTAGES (YELLOW, BLUE) WITH DRVSTRENGTH=2 ............................ 16
FIGURE 3.9 RINGING OF OUTPUT (GREEN) AND GATE VOLTAGES (YELLOW, BLUE) WITH DRVSTRENGTH=3 ............................ 16
FIGURE 3.10 DIODES FOR SAFE OFF CONDITION WITH HIGH GATE SERIES RESISTANCE ............................................................ 17
FIGURE 4.1 SPI TIMING ............................................................................................................................................................ 20
FIGURE 6.1 PRINCIPLE OF SENSE AMPLIFIER ............................................................................................................................. 27
FIGURE 6.2 AMPLIFIER SETTLING AFTER COIL SWITCH EVENT (GREEN: COIL OUTPUT, YELLOW: AMPLIFIER OUTPUT) ................ 28
FIGURE 6.3 OUTPUT CORRECTLY SAMPLED WITH SINE WAVE CURRENT AND 1.66V OFFSET ....................................................... 28
FIGURE 6.4 RANDOM OUTPUT OFFSET AT 20X AMPLIFICATION (YELLOW: OUTPUT, BLUE: VOFS INPUT) ................................. 29
FIGURE 6.5 EXAMPLE FOR THERMAL OFFSET DRIFT AT OUTPUT (5X AMPLIFICATION) [MV] FROM 30°C TO 120°C................... 30
FIGURE 7.1 SHORT DETECTION (U, V OR W OUTPUT) ............................................................................................................... 33
FIGURE 12.1 LAYOUT EXAMPLE ................................................................................................................................................. 43
FIGURE 13.1 DIMENSIONAL DRAWINGS TQFP48-EP ............................................................................................................... 44
17 Revision History
Version
Date
Author
BD= Bernhard Dwersteg
Description
V0.05
2018-APR-22
BD
First version of datasheet based on datasheet TMC6200 V1.0
V0.1
2018-APR-30
BD
First complete version based on preliminary data
V0.11
2018-MAY-09
BD
Offset voltage added to description, added Eval board schematics
V0.12
2018-MAY-29
BD
Minor changes
V0.13
2018-SEP-11
BD
P12VOUT Mnemonic in abs. max. table, tables back to 0.25pt lines
V1.00
2018-OKT-30
BD
Adapted electrical characteristics
V1.01
2018-NOV-15
BD
Reworked schematic showing additional protection components,
added chapter on wiring bridge supply
V1.02
2019-JAN-31
BD
Characterized and documented thermal drift of sense amplifier offset,
added chapter 6.2, re-specification for external clock
V1.03
2019-FEB-13
BD
Added example for offset compensation. Added Standby example
V1.04
2019-AUG-08
BD
Added ordering codes, changed block diagram
Table 17.1 Document Revisions